Patent US3986944A successfully refreshed from Google Patents.
US3986944A
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Method for obtaining adhesion of multilayer thin films
Assignee: Bull HN Information Systems Inc
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Filing: 1975-06-27
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Granted: 1976-10-19
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Expires: 1995-06-27
Abstract
Abstract A method for obtaining adhesion of multilayer thin films through the use of a conventional sputtering system. The adhesion between the multilayer thin films is obtained by forming a graded interface between a deposit material and a substrate using an adhesion layer material. The graded interface is formed by sputtering a uniform layer of the adhesion layer material on the surface of the deposit material. The deposit material is coated on a sputtering cathode. The subsequent sputtering from this cathode results in the graded interface between the deposit material and substrate due to the radially non-uniform rate of removal of the adhesion layer material and deposit material from the cathode's surface.
Inventors
- 👤 Floyd T. Gould
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-22 22:48
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/02; C23C14/027
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
122 words
A method for obtaining adhesion of multilayer thin films through the use of a sputtering system, the thin films comprising a substrate, an adhesion material, and a deposit material, the steps comprising: sputtering the adhesion material onto a layer of deposit material mounted on the surface of a sputterable cathode so as to form an outermost layer on the cathode consisting completely of adhesion material; sputtering the adhesion material layer and the deposit material off of the sputterable cathode and onto the substrate until the desired thickness of the deposit material is reached, the removal of the adhesion material layer and the deposit material off of the sputterable cathode being nonuniform thereby depositing a graded interface on the surface of the substrate.
Claim 2
Independent Claim
122 words
A method for obtaining adhesion of multilayer thin films through the use of a sputtering system, the thin films comprising a substrate, an adhesion material, and a deposit material, the steps comprising: sputtering the adhesion material onto a layer of deposit material mounted on the surface of a sputterable cathode so as to form an outermost layer on the cathode consisting completely of adhesion material; sputtering the adhesion material layer and the deposit material off of the sputterable cathode and onto the substrate until the desired thickness of the deposit material is reached, the removal of the adhesion material layer and the deposit material off of the sputterable cathode being nonuniform thereby depositing a graded interface on the surface of the substrate.
Claim 3
Dependent Claim
51 words
The method as described in claim 1 further including the additional step of sputtering the layer of adhesion material off of the deposit material until only a thin film of the adhesion layer remains, this additional step performed prior to sputtering the remaining adhesion layer and deposit material onto the substrate.
Claim 4
Dependent Claim
47 words
The method as described in claim 1 further including the repeating of the steps in claim 1 so as to form an additional layer of deposit material and an additional layer of adhesion material to thereby form a multilayer thin film of deposit materials on the substrate.
Claim 5
Independent Claim
167 words
A method for obtaining adhesion of multilayer thin films through the use of a sputtering system, the thin films comprising a substrate, an adhesion material, and a deposit material, the steps material; sputtering the adhesion material onto a layer of deposit material mounted on the surface of a sputterable cathode so as to form an outermost layer on the sputterable cathode consisting completely of adhesion material sputtering a portion of the layer of adhesion material from the sputterable cathode onto the substrate; sputtering a mixture of the remaining adhesion material and the deposit material from the sputterable cathode onto the adhesion layer already formed on the substrate, the mixture forming a graded interface between the adhesion layer on the substrate and the deposit material, the mixture produced by the nonuniform removal of the adhesion material layer and deposit material as they are removed from the sputtering system's sputterable cathode; sputtering the remaining deposit material onto the substrate until the desired thickness of the deposit material is reached.
Claim 6
Independent Claim
167 words
A method for obtaining adhesion of multilayer thin films through the use of a sputtering system, the thin films comprising a substrate, an adhesion material, and a deposit material, the steps material; sputtering the adhesion material onto a layer of deposit material mounted on the surface of a sputterable cathode so as to form an outermost layer on the sputterable cathode consisting completely of adhesion material sputtering a portion of the layer of adhesion material from the sputterable cathode onto the substrate; sputtering a mixture of the remaining adhesion material and the deposit material from the sputterable cathode onto the adhesion layer already formed on the substrate, the mixture forming a graded interface between the adhesion layer on the substrate and the deposit material, the mixture produced by the nonuniform removal of the adhesion material layer and deposit material as they are removed from the sputtering system's sputterable cathode; sputtering the remaining deposit material onto the substrate until the desired thickness of the deposit material is reached.
Claim 7
Dependent Claim
47 words
The method as described in claim 4 further including the repeating of the steps in claim 4 so as to form an additional layer of deposit material and an additional layer of adhesion material to thereby form a multilayer thin film of deposit materials on the substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-10-19 | 1980-04-19 | 1980-10-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-10-19 | 1984-04-19 | 1984-10-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-10-19 | 1988-04-19 | 1988-10-19 | $7700.00 | Window Closed / Lapsed |