US3616406A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Preparation of glue layer for bonding gold to a substrate
Assignee: AT&T Inc
•
Filing: 1969-11-03
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Granted: 1971-10-26
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Expires: 1989-11-03
Abstract
Abstract A technique for preparing a glue layer destined for use in bonding gold to a substrate involves depositing a gold-transition metal alloy upon a substrate member by cathodic sputtering techniques.
Inventors
- 👤 Paul A Truner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 01:38
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/009; C03; C03C; C03C27/00; C03C27/04; C03C27/042; C03C27/046; C04B41/45; C04B41/52; C04B41/80; C04B41/81; C04B41/89; C23; C23C; C23C14/00; C23C14/06; C23C14/14; C23C14/18; H; H10; H10N; H10N97/00; H10W; H10W70/00; H10W70/01; H10W70/05; Y; Y10; Y10S; Y10S148/00; Y10S148/02
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
19 words
A technique in accordance with the procedure of claim 1 wherein said alloy is deposited by cathodic sputtering techniques.
Claim 2
Dependent Claim
21 words
A method in accordance with the procedure of claim 1 wherein said alloy has a thickness of at least 500 A.
Claim 3
Dependent Claim
16 words
A method in accordance with the procedure of claim 1 wherein the substrate is glass substrate.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-10-25 | 1975-04-26 | 1975-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-10-25 | 1979-04-26 | 1979-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-10-25 | 1983-04-26 | 1983-10-26 | $7700.00 | Window Closed / Lapsed |