Method of making a multilayer printed wiring board

Claim 2

A manufacturing method for a multilayer printed wiring board comprising the steps of: forming a first multilayer interconnection by selectively laminating a first metal wiring layer, a first insulation layer, a second metal wiring layer electrically connected with said first metal wiring layer, and a second insulation layer, on both sides of a ceramic substrate having through holes at predetermined positions so as to provide a multilayer interconnection electrically connecting the layers via said through holes; forming a second multilayer interconnection by selectively laminating a third metal wiring layer, a third insulation layer, a fourth metal wiring layer electrically connected with said third metal wiring layer, and a fourth insulation layer, on one side of a base substrate; and placing together and integrating said first multilayer interconnection formed on said ceramic substrate and said second multilayer interconnection formed on said base substrate under application of pressure and heat.

Claim 3

A manufacturing method for a multilayer printed wiring board of claim 1, wherein the process to provide a multilayer interconnection on said ceramic substrate includes lamination of metal wiring layer and insulation layer conducted on both upper and lower sides of said ceramic substrate.

Claim 4

A manufacturing method for a multilayer printed wiring board of claim 1 wherein said integration process under pressurized and heated conditions comprises: pre-baking at 65° C. for 30 minutes under the pressure of 30 to 40 kg/cm 2 ; pre-curing at 150° to 160° C. for 60 minutes under the same pressure; and final curing at 250° C. for 30 minutes under the same pressure.

Claim 5

A manufacturing method for a multilayer printed wiring board comprising of: a process where a metal wiring layer and insulation layer are laminated on both sides of a ceramic substrate having through holes at predetermined positions so as to provide a multilayer interconnection electrically connecting the layers via said through holes; a process where a multilayer interconnection is formed by lamination of a metal wiring layer and an insulation layer on a base substrate; a process where said ceramic substrate and said base substrate with interconnections formed on them are placed together and integrated under application of pressure and heat; and a process where other ceramic substrates with multilayer interconnections formed on them are successively placed on said integrated ceramic substrate and all of them are integrated under pressurized and heated conditions.

Claim 6

A manufacturing method for a multilayer printed wiring board comprising of: a process where a metal wiring layer and insulation layer are laminated on both sides of a ceramic substrate having through holes at predetermined positions so as to provide a multilayer interconnection electrically connecting the layers via said through holes; a process where a multilayer interconnection is formed by lamination of a metal wiring layer and an insulation layer on a base substrate; a process where said ceramic substrate and said base substrate with interconnections formed on them are placed together and integrated under application of pressure and heat; and a process where other ceramic substrates with multilayer interconnections formed on them are successively placed on said integrated ceramic substrate and all of them are integrated under pressurized and heated conditions.

Claim 7

A manufacturing method for a multilayer printed wiring board of claim 4 wherein the process to provide a multilayer interconnection on said ceramic substrate includes lamination of metal wiring layer and insulating layer conducted on both upper and lower sides of said ceramic substrate.

Claim 8

A manufacturing method for a multilayer printed wiring board of claim 4 wherein said integration process under pressurized and heated conditions comprises: pre-baking at 65° C. for 30 minutes under the pressure of 30 to 40 kg/cm 2 ; pre-curing at 150° to 160° C. for 60 minutes under the same pressure; and final curing at 250° C. for 30 minutes under the same pressure.

Claim 9

A manufacturing method for a multilayer printed wiring board according to the following requirements: a process to provide multilayer interconnections on both sides of a ceramic substrate having through holes at predetermined positions comprises of the steps below: (a) forming ground and connection layers on the upper and lower sides of said ceramic substrate mutually connected via through holes; (b) forming an insulation layer on the ground and connection layer; (c) Forming a signal wiring layer on said insulation layer for connection with said ground and connection layer; (d) forming a connection bump on said signal wiring layer; (e) applying polyimide precursor to the connection bump; and a process to provide a multilayer interconnection on a base substrate by alternatively laminating a wiring layer and an insulation layer comprises of the steps below: (a) forming a ground and connection layer on said base substrate; (b) forming an insulation layer on the ground and connection layer; (c) forming a signal wiring layer on said insulation layer for connection with said ground and connection layer; (d) Forming a connection bump on said signal wiring layer; (e) applying polyimide precursor on connection bump; and a ceramic substrate with a multilayer interconnection formed on it is placed on said base substrate and integrated with it under heated and pressurized conditions.

Claim 10

A manufacturing method for a multilayer printed wiring board according to the following requirements: a process to provide multilayer interconnections on both sides of a ceramic substrate having through holes at predetermined positions comprises of the steps below: (a) forming ground and connection layers on the upper and lower sides of said ceramic substrate mutually connected via through holes; (b) forming an insulation layer on the ground and connection layer; (c) Forming a signal wiring layer on said insulation layer for connection with said ground and connection layer; (d) forming a connection bump on said signal wiring layer; (e) applying polyimide precursor to the connection bump; and a process to provide a multilayer interconnection on a base substrate by alternatively laminating a wiring layer and an insulation layer comprises of the steps below: (a) forming a ground and connection layer on said base substrate; (b) forming an insulation layer on the ground and connection layer; (c) forming a signal wiring layer on said insulation layer for connection with said ground and connection layer; (d) Forming a connection bump on said signal wiring layer; (e) applying polyimide precursor on connection bump; and a ceramic substrate with a multilayer interconnection formed on it is placed on said base substrate and integrated with it under heated and pressurized conditions.

Claim 11

A manufacturing method for multilayer printed wiring board of claim 7 wherein the process to provide a multilayer interconnections on both sides of a ceramic substrate comprises performance of the steps on the upper and the lower sides of the ceramic substrate.

Claim 12

A manufacturing method for a multilayer printed wiring board of claim 7 wherein said integration process under pressurized and heated conditions comprises: pre-baking at 65° C. for 30 minutes under the pressure of 30 to 40 kg/cm 2 ; pre-curing at 150° to 160° C. for 60 minutes under the same pressure; and final curing at 250° C. for 30 minutes under the same pressure.