Patent US4229028A successfully refreshed from Google Patents.
US4299873A
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US
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Multilayer circuit board
Assignee: Hitachi Ltd
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Filing: 1980-04-07
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Granted: 1981-11-10
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Expires: 2000-04-07
Abstract
Abstract A multilayer circuit board obtained by laminating and bonding a plurality of ceramic substrates, each substrate having holes therein and a conductive circuit pattern on at least one surface thereof, and bonding layers between each ceramic substrate, said bonding layers containing an organic or inorganic adhesive and an inorganic filler and having good electrical insulating properties, good thermal conductivity and a larger coefficient of thermal expansion than that of the ceramic substrate shows good thermal conductivity, wiring accuracy and productivity.
Inventors
- 👤 Satoru Ogihara
- 👤 Mitsuru Ura
- 👤 Yoshihiro Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 13:18
CPC Classifications
B; B32; B32B; B32B7/00; B32B7/04; B32B7/12; B32B3/00; B32B3/10; B32B27/00; B32B27/18; B32B27/20; B32B9/00; B32B9/04; B32B9/045; H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H05K3/4626; H05K3/4629; H10; H10W; H10W99/00; B32B2307/00; B32B2307/20; B32B2307/202; B32B2457/00; B32B2457/08; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/096; H05K3/4623; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24802; Y10T428/24926
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
59 words
A multilayer circuit board obtained by laminating and bonding a plurality of ceramic substrates, each substrate having holes therein and a conductive circuit pattern on at least one surface thereof, and electrically insulative bonding layers between adjacent ceramic substrates, said bonding layers having good thermal conductivity and a larger coefficient of thermal expansion than that of the ceramic substrate.
Claim 2
Dependent Claim
59 words
A multilayer circuit board obtained by laminating and bonding a plurality of ceramic substrates, each substrate having holes therein and a conductive circuit pattern on at least one surface thereof, and electrically insulative bonding layers between adjacent ceramic substrates, said bonding layers having good thermal conductivity and a larger coefficient of thermal expansion than that of the ceramic substrate.
Claim 3
Dependent Claim
28 words
A multilayer circuit board according to claim 1, wherein the ceramic substrates are of alumina, mullite, beryllia, silicon nitride, silicon carbide, aluminum nitride or of the combinations thereof.
Claim 4
Dependent Claim
22 words
A multilayer circuit board according to claim 1, wherein the bonding layer contains an organic or inorganic adhesive and an inorganic filler.
Claim 5
Dependent Claim
16 words
A multilayer circuit board according to claim 3, wherein the organic adhesive is an epoxy resin.
Claim 6
Dependent Claim
22 words
A multilayer circuit board according to claim 3, wherein the inorganic adhesive is a glass, a phosphate adhesive or a silicate adhesive.
Claim 7
Dependent Claim
24 words
A multilayer circuit board according to claim 3, wherein the inorganic filler is beryllia, magnesia, zircon, alumina, silicon nitride, boron nitride, or silicon carbide.
Claim 8
Dependent Claim
31 words
A multilayer circuit board according to claim 3, wherein the inorganic adhesive is an epoxy resin and the inorganic filler is beryllia, zircon, alumina, silicon nitride, boron nitride, or silicon carbide.
Claim 9
Dependent Claim
21 words
A multilayer circuit board according to claim 3, wherein the inorganic adhesive is a glass and the inorganic filler is alumina.
Claim 10
Dependent Claim
22 words
A multilayer circuit board according to claim 3, wherein the inorganic adhesive is a phosphate adhesive and the inorganic filler is alumina.
Claim 11
Dependent Claim
24 words
A multilayer circuit board according to claim 3, wherein the inorganic adhesive is a silicate adhesive and the inorganic filler is alumina or beryllia.
Claim 12
Dependent Claim
108 words
A process for producing a multilayer circuit board which comprises forming a conductive circuit pattern on at least one surface of a ceramic substrate having a number of holes therein, forming an electrically insulation bonding layer containing an organic or inorganic adhesive and one or more inorganic fillers of good thermal conductivity and a larger coefficient of thermal expansion than that of the ceramic substrate on at least one surface of the ceramic substrate, laminating a plurality of the thus treated ceramic substrates so as to form alternate layers of the ceramic substrates and the bonding layers, and bonding individual substrates and bonding layers under pressure with heating.
Claim 13
Dependent Claim
108 words
A process for producing a multilayer circuit board which comprises forming a conductive circuit pattern on at least one surface of a ceramic substrate having a number of holes therein, forming an electrically insulation bonding layer containing an organic or inorganic adhesive and one or more inorganic fillers of good thermal conductivity and a larger coefficient of thermal expansion than that of the ceramic substrate on at least one surface of the ceramic substrate, laminating a plurality of the thus treated ceramic substrates so as to form alternate layers of the ceramic substrates and the bonding layers, and bonding individual substrates and bonding layers under pressure with heating.
Claim 14
Dependent Claim
29 words
A process acccording to claim 11, wherein the organic adhesive is an epoxy resin and the inorganic filler is beryllia, zircon, alumina, silicon nitride, boron nitride or silicon carbide.
Claim 15
Dependent Claim
19 words
A process according to claim 11, wherein the inorganic adhesive is a glass and the inorganic filler is alumina.
Claim 16
Dependent Claim
20 words
A process according to claim 11, wherein the inorganic adhesive is a phosphate adhesive and the inorganic filler is alumina.
Claim 17
Dependent Claim
22 words
A process according to claim 11, wherein the inorganic adhesive is a silicate adhesive and the inorganic filler is alumina or beryllia.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-11-09 | 1985-05-11 | 1985-11-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-11-09 | 1989-05-11 | 1989-11-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-11-09 | 1993-05-11 | 1993-11-10 | $7700.00 | Window Closed / Lapsed |