Abstract There is provided a method and materials for cooling the power train components, such as transformers, rectifiers, chokes, and the like, of an integrated on-board power supply IOP) using a single heatsink. Spacers are positioned between the power train components and a substrate, the substrate for mounting the components. The spacers are individually dimensioned and shaped to raise the heat-removal surfaces of the components to a substantially uniform and minimal height. A heatsink having a substantially planar, heat-acquiring surface is positioned on the heat-removal surfaces of the power train components. Fasteners are used to compress the spacers, urging the components against the heatsink to provide a substantially continuous and coplanar thermal interface between the components and the heatsink. After the components, heat sink and substrate have been fastened to each other, the components are electrically connected to the substrate by soldering.
An apparatus, for providing a coplanar heatsink and electronics assembly, comprising: a substantially planar substrate; heat generating components of different heights positioned on one side of said substrate, each of said components including a heat-removal surface on one side thereof; at least one spacer positioned between said heat generating components and said substrate, each of said spacers dimensioned in relation to the height of its associated heat generating component such that said heat removal surfaces of said heat generating components are substantially coplanar with one another; a heatsink having a substantially planar heat-acquiring surface on one side thereof, said heat-acquiring surface positioned on said heat-removal surfaces of said components; and means for fastening said heatsink to said substrate to compress said spacers, thereby urging said heat-removal surfaces against said heat acquiring surfaces.
Claim 2
Independent Claim
132 words
An apparatus, for providing a coplanar heatsink and electronics assembly, comprising: a substantially planar substrate; heat generating components of different heights positioned on one side of said substrate, each of said components including a heat-removal surface on one side thereof; at least one spacer positioned between said heat generating components and said substrate, each of said spacers dimensioned in relation to the height of its associated heat generating component such that said heat removal surfaces of said heat generating components are substantially coplanar with one another; a heatsink having a substantially planar heat-acquiring surface on one side thereof, said heat-acquiring surface positioned on said heat-removal surfaces of said components; and means for fastening said heatsink to said substrate to compress said spacers, thereby urging said heat-removal surfaces against said heat acquiring surfaces.
Claim 3
Dependent Claim
38 words
The apparatus as in claim 1 wherein said means for fastening includes a plurality of self-clinching threaded inserts positioned in said substrate, and a plurality of screws, said screws inserted through said heatsink to engage with said inserts.
Claim 4
Dependent Claim
14 words
The apparatus as in claim 1 wherein said heatsink is made of extruded aluminum.
Claim 5
Dependent Claim
19 words
The apparatus as in claim 1 further including means for electrically connecting said heat generating components to said substrate.