US5065280A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flex interconnect module
Assignee: HP Inc
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Filing: 1990-08-30
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Granted: 1991-11-12
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Expires: 2010-08-30
Abstract
Abstract An electronic packaging module in which the inactive sides of integrated circuit chips are held in compression against a heat spreader by an elastomer pressed thereagainst by a multilayer flexible printed circuit board. A TAB frame, which may be demountable, interconnects integrated circuit chips to a multilayer flexible printed circuit board. A backing plate is fastened to a heat spreader so that it presses against the multilayer flexible printed circuit board. Contacts are compressed against the motherboard to interconnect the multilayer flexible printed circuit board thereto. Coaxial power connectors provide power and ground connections between non-peripheral portions of the multilayer flexible printed circuit board and the motherboard.
Inventors
- 👤 Marcos Karnezos
- 👤 Ravindhar Kaw
- 👤 Lawrence Hanlon
- 👤 Farid Matta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 18:32
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K3/365; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W40/20; H10W40/231; H10W40/235; H10W40/237; H10W40/625
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
89 words
An electronic module, comprising: heat spreader means; a plurality of integrated circuit chips; a chip interconnect frame in electrical contact with each chip; a multilayer flexible conductor module in electrical contact with each chip interconnect frame; a motherboard assembly in electrical contact with the flexible conductor module; elastomer means compressed between the flexible conductor module and the chips; and mounting means including an inflexible backing plate urging the flexible conductor toward the chips for maintaining the chips in compression between the flexible conductor module and the heat spreader conductor.
Claim 2
Dependent Claim
89 words
An electronic module, comprising: heat spreader means; a plurality of integrated circuit chips; a chip interconnect frame in electrical contact with each chip; a multilayer flexible conductor module in electrical contact with each chip interconnect frame; a motherboard assembly in electrical contact with the flexible conductor module; elastomer means compressed between the flexible conductor module and the chips; and mounting means including an inflexible backing plate urging the flexible conductor toward the chips for maintaining the chips in compression between the flexible conductor module and the heat spreader conductor.
Claim 3
Dependent Claim
35 words
The electronic module claimed in claim 1, wherein the mounting means further comprises: means for aligning and compressing the chips, elastomer means and the flexible conducting module between the heat spreader and the backing plate.
Claim 4
Dependent Claim
29 words
The electronic module claimed in claim 1, wherein the mounting means further comprises: means for compressing extension contacts around the periphery of the flexible conductor module to the motherboard.
Claim 5
Dependent Claim
30 words
The electronic module claimed in claim 3, wherein the mounting means further comprises: coaxial power connector means for directly interconnecting non-peripheral portions of the flexible conductor module to the motherboard.
Claim 6
Independent Claim
85 words
A method of packaging an electronic module, comprising the steps of: mounting a plurality of integrated circuit chips in contact with a heat spreader; interconnecting the active side of each chip to a multilayer flexible conductor module; interconnecting a motherboard assembly with the flexible conductor module; urging an inflexible backing plate against the flexible conductor toward the chips; and compressing an elastomer between the flexible conductor module and the chips to maintain the chips in compression between the flexible conductor module and the heat spreader.
Claim 7
Independent Claim
85 words
A method of packaging an electronic module, comprising the steps of: mounting a plurality of integrated circuit chips in contact with a heat spreader; interconnecting the active side of each chip to a multilayer flexible conductor module; interconnecting a motherboard assembly with the flexible conductor module; urging an inflexible backing plate against the flexible conductor toward the chips; and compressing an elastomer between the flexible conductor module and the chips to maintain the chips in compression between the flexible conductor module and the heat spreader.
Claim 8
Dependent Claim
30 words
The method of packaging an electronic module claimed in claim 5, further comprising the step of: compressing extension contacts around the periphery of the flexible conductor module against the motherboard.
Claim 9
Dependent Claim
32 words
The method of packaging an electronic module claimed in claim 6, further comprising the step of: directly interconnecting non-peripheral portions of the flexible conductor module to the motherboard with coaxial power connectors.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-11 | 1995-05-13 | 1995-11-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-11 | 1999-05-13 | 1999-11-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-11 | 2003-05-13 | 2003-11-12 | $7700.00 | Window Closed / Lapsed |