US4521829A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Device for cooling a plurality of integrated modules combined on a rigid printed circuitboard to form logic cards
Assignee: Wincor Nixdorf International GmbH
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Filing: 1983-08-25
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Granted: 1985-06-04
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Expires: 2003-08-25
Abstract
Abstract Integrated modules are disposed on a rigid printed circuitboard with the entire rear surface of each module in contact with a common cooling plate. The individual contact pressure of the integrated modules against the cooling plate occurs by way of resilient elements respectively inserted between the printed circuitboard and the modules.
Inventors
- 👤 Herrmann Wessely
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 13:25
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W78/00
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
95 words
A device which cools a plurality of integrated modules, comprising: a rigid printed circuitboard; a plurality of integrated modules carried on said rigid printed circuitboard, each of said modules including a planar rear surface facing away from said printed circuitboard; a common cooling plate including a highly-planar surface contacting each of said rear surfaces; pressure means acting on said rigid printed circuitboard to press said modules against said cooling plate; and a plurality of resilient means individually disposed between said rigid printed circuitboard and said modules to individually press said modules against said cooling plate.
Claim 2
Independent Claim
95 words
A device which cools a plurality of integrated modules, comprising: a rigid printed circuitboard; a plurality of integrated modules carried on said rigid printed circuitboard, each of said modules including a planar rear surface facing away from said printed circuitboard; a common cooling plate including a highly-planar surface contacting each of said rear surfaces; pressure means acting on said rigid printed circuitboard to press said modules against said cooling plate; and a plurality of resilient means individually disposed between said rigid printed circuitboard and said modules to individually press said modules against said cooling plate.
Claim 3
Dependent Claim
15 words
The device of claim 1, wherein: each of said resilient means comprises a resilient pad.
Claim 4
Dependent Claim
15 words
The device of claim 1, wherein: each of said resilient means comprises a rubber pad.
Claim 5
Dependent Claim
28 words
The device of claim 1, said integrated modules having terminals wherein: each of said resilient means comprises a resilient pad contacting the respective module and said printed circuitboard.
Claim 6
Dependent Claim
18 words
The device of claim 1, and further comprising: conductive grease between said rear surfaces and said cooling plate.
Claim 7
Independent Claim
106 words
A device which cools a plurality of integrated modules, comprising: a rigid printed circuitboard; a plurality of integrated modules carried on said rigid printed circuitboard, each of said modules including a planar rear surface facing away from said printed circuitboard; a common cooling plate including a highly-planar surface contacting each of said rear surfaces; pressure means acting on said rigid printed circuitboard to press said modules against said cooling plate; and a plurality of resilient means individually disposed between said rigid printed circuitboard and said modules to individually press said modules against said cooling plate, each of said resilient means comprising spring terminals on the modules.
Claim 8
Independent Claim
106 words
A device which cools a plurality of integrated modules, comprising: a rigid printed circuitboard; a plurality of integrated modules carried on said rigid printed circuitboard, each of said modules including a planar rear surface facing away from said printed circuitboard; a common cooling plate including a highly-planar surface contacting each of said rear surfaces; pressure means acting on said rigid printed circuitboard to press said modules against said cooling plate; and a plurality of resilient means individually disposed between said rigid printed circuitboard and said modules to individually press said modules against said cooling plate, each of said resilient means comprising spring terminals on the modules.
Claim 9
Dependent Claim
21 words
The device of claim 6, wherein: each of said resilient means further comprises a rigid member to limit the spring path.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-06-03 | 1988-12-03 | 1989-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-06-03 | 1992-12-03 | 1993-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-06-03 | 1996-12-03 | 1997-06-04 | $7700.00 | Window Closed / Lapsed |