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JPH03250697A Expired / Lapsed JP ⏱️ 0.0 years remaining

Power supply cooling module

Assignee: Fujitsu Ltd
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Filing: 1990-02-28
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Granted: —
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Expires: 2010-02-28
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Abstract

Abstract PURPOSE:To ease mounting and enhance cooling effect by constructing a heat sink with an upper heat sink brought into close contact with a case upper surface of a power supply and having a through-hole for a fixed machine screw at the side edge thereof, and with a lower heat sink brought into close contact with both side walls of the case and having a screw hole in the upper surface, and fixing a screw hole in the upper surface, and fixing the heat sink via a flange part of the case upper surface. CONSTITUTION:For mounting a heat sink 2 on a power supply 1 mounted on a printed board 6 a lower heat sink 4 is placed on the printed board 6 along opposite side walls 13 of a case 11 of the power supply 1. Then, an upper heat sink 3 is brought into contact with the upper surface of the case 11, and a through-hole 32, a notched hole part 14 in a flange part 12, and a screw hole 42 in the lower heat radiator 4 are positioned. By inserting a fixing screw 5 into the hole and clamping it, the upper and lower heat sinks 3 and 4 are fixed to the case 11 in close contact with each other holding the flange part 12 of the case 11 therebetween. Accordingly, a power supply cooling module can be formed by the work from the upper part in the state where the lower heat sink to 4 is placed.

Inventors

  • 👤 Kazuhiko Tokuda
  • 👤 和彦 徳田

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-10-23 15:25
CPC Classifications
—

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