US6357330B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for cutting a wafer
Assignee: Intel Corp
•
Filing: 1999-01-07
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Granted: 2002-03-19
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Expires: 2019-01-07
Abstract
Abstract A wafer cutting apparatus which includes a wafer saw, a detector, and a control unit. The detector detects a variable of a wafer being sawed. The control unit utilizes the variable to control the saw.
Inventors
- 👤 M. Lawrence A. Dass
- 👤 Isaura S. Gaeta
- 👤 Krishna Seshan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 14:31
CPC Classifications
B; B28; B28D; B28D5/00; B28D5/0058; B28D5/0064; B23; B23D; B23D59/00; B23D59/001; Y; Y10; Y10T; Y10T83/00; Y10T83/02; Y10T83/0207; Y10T83/0215; Y10T83/141; Y10T83/145; Y10T83/162; Y10T83/263; Y10T83/525; Y10T83/536; Y10T83/538; Y10T83/541
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
157 words
An apparatus for cutting a wafer which includes: a wafer saw including a stand, a wafer holder on the stand capable of holding a wafer, and a spindle on the stand to which a sawing blade is mountable to saw the wafer, the spindle and the wafer holder being movable relative to one another to saw the wafer in a selected direction; a detector mounted so as to face a surface of the wafer, the detector detecting a feature at a surface of a wafer when held by the wafer holder, the detector and the wafer holder being movable relative to one another in the selected direction to allow the detector to detect variability of the feature along the surface of the wafer in the selected direction; and a control unit which utilizes the variable to vary sawing of the wafer by the blade in the selected direction as a function of variability in the selected direction.
Claim 2
Independent Claim
157 words
An apparatus for cutting a wafer which includes: a wafer saw including a stand, a wafer holder on the stand capable of holding a wafer, and a spindle on the stand to which a sawing blade is mountable to saw the wafer, the spindle and the wafer holder being movable relative to one another to saw the wafer in a selected direction; a detector mounted so as to face a surface of the wafer, the detector detecting a feature at a surface of a wafer when held by the wafer holder, the detector and the wafer holder being movable relative to one another in the selected direction to allow the detector to detect variability of the feature along the surface of the wafer in the selected direction; and a control unit which utilizes the variable to vary sawing of the wafer by the blade in the selected direction as a function of variability in the selected direction.
Claim 3
Dependent Claim
57 words
The wafer cutting apparatus of claim 1 wherein the saw includes: a depth adjuster which is operable to move the spindle and the wafer holder relative to one another so as to adjust the depth of cut of the wafer, wherein the feature is a height of the wafer and the control unit controls the depth adjuster.
Claim 4
Dependent Claim
42 words
The wafer cutting apparatus of claim 1 wherein the saw includes: a motor which is operable to rotate the spindle, wherein the feature depends on a material of the wafer and the control unit controls the speed of rotation of the motor.
Claim 5
Dependent Claim
54 words
The wafer cutting apparatus of claim 1 wherein the saw includes: translation apparatus which is operable to move the wafer holder and the spindle relative to one another so as to progress the blade over the wafer, wherein the feature depends on a material of the wafer and the control unit controls the translator.
Claim 6
Dependent Claim
39 words
The wafer cutting apparatus of claim 1 wherein the saw includes: a nozzle positioned to direct flow of a fluid onto the wafer being sawed, wherein the control unit controls the flow through the nozzle dependent on the feature.
Claim 7
Dependent Claim
19 words
The wafer cutting apparatus of claim 1 wherein the feature provides information about variations in height of the wafer.
Claim 8
Dependent Claim
24 words
The wafer cutting apparatus of claim 1 wherein the presence of objects in a street of sawing, the feature being one of the objects.
Claim 9
Dependent Claim
16 words
The wafer cutting apparatus of claim 1 wherein the feature is a temperature of the wafer.
Claim 10
Dependent Claim
32 words
The wafer cutting apparatus of claim 1 wherein the control of the sawing of the wafer by the blade by the control unit is in response to the detector detecting the wafer.
Claim 11
Dependent Claim
38 words
The wafer cutting apparatus of claim 1 which includes a memory coupled to the detector for storing the variable of the feature, wherein the control unit utilizes the variable stored in memory to control sawing of the wafer.
Claim 12
Dependent Claim
35 words
The wafer cutting apparatus of claim 10 which includes a data entering device for storing a wafer characteristic in the memory, wherein the control unit utilizes the wafer characteristic to control sawing of the wafer.
Claim 13
Dependent Claim
42 words
The wafer cutting apparatus of claim 1 which includes a memory and a data entering device coupled to the memory for entering a wafer characteristic into the memory, wherein the control unit utilizes the wafer characteristic to control sawing of the wafer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-03-18 | 2005-09-17 | 2006-03-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-03-18 | 2009-09-17 | 2010-03-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-03-18 | 2013-09-17 | 2014-03-19 | $7700.00 | Window Closed / Lapsed |