Devices for welding of integrated-circuit wafers

Claim 1

A device for soldering to a substrate integrated circuit chips mounted previously on a carrier film, said film comprising a series of openings and a conductive sheet hot-rolled on one surface of said film, said sheet forming at each opening a plurality of flexible leads extending towards the center of said opening and bonded to a chip located in said center, said device comprising: a first support plate for supporting said substrate, a bonding head movable in a direction perpendicular to said plate, means for displacing said head between a first position in which it is at a distance from said substrate and a second position in which it is in contact with said substrate, a second support plate, disposed between the first support plate and the bonding head when this latter is in its first position, for supporting the film having chips mounted thereon, said second support plate being provided with a die opening positioned on the bonding axis of the head, and means for adjusting successively each chip of the film on the bonding axis of the head, each adjusted chip overlying said die opening, said bonding head comprising a peen shaped to be engaged in said die opening for cutting the leads of the adjusted chip, when the bonding head is displaced from its first position to its second position for soldering to said substrate the remaining portions of the leads of said chip which, after this cutting-off has been completed, is carried by said peen to said substrate.

Claim 2

A device for soldering to a substrate integrated circuit chips mounted previously on a carrier film, said film comprising a series of openings and a conductive sheet hot-rolled on one surface of said film, said sheet forming at each opening a plurality of flexible leads extending towards the center of said opening and bonded to a chip located in said center, said device comprising: a first support plate for supporting said substrate, a bonding head movable in a direction perpendicular to said plate, means for displacing said head between a first position in which it is at a distance from said substrate and a second position in which it is in contact with said substrate, a second support plate, disposed between the first support plate and the bonding head when this latter is in its first position, for supporting the film having chips mounted thereon, said second support plate being provided with a die opening positioned on the bonding axis of the head, and means for adjusting successively each chip of the film on the bonding axis of the head, each adjusted chip overlying said die opening, said bonding head comprising a peen shaped to be engaged in said die opening for cutting the leads of the adjusted chip, when the bonding head is displaced from its first position to its second position for soldering to said substrate the remaining portions of the leads of said chip which, after this cutting-off has been completed, is carried by said peen to said substrate.

Claim 3

A device for soldering to a substrate integrated circuit chips mounted previously on a carrier film, said film comprising a series of openings and a conductive sheet hot-rolled on one surface of said film, said sheet forming at each opening a plurality of flexible leads extending towards the center of said opening and bonded to a chip located in said center, said device comprising: a first support plate for supporting said substrate, a bonding head movable in a direction perpendicular to said plate, means for displacing said head between a first position in which it is at a distance from said substrate and a second position in which it is in contact with said substrate, a second support plate, disposed between the first support plate and the bonding head when this latter is in its first position, for supporting the film having chips mounted thereon, said second support plate being provided with a die opening positioned on the bonding axis of the head, and means for adjusting successively each chip of the film on the bonding axis of the head, each adjusted chip overlying said die opening, said bonding head comprising a peen shaped to be engaged in said die opening for cutting the leads of the adjusted chip, when the bonding head is displaced from its first position to its second position for soldering to said substrate the remaining portions of the leads of said chip which, after this cutting-off has been completed, is carried by said peen to said substrate.

Claim 4

A device for soldering to a substrate integrated circuit chips mounted previously on a carrier film, said film comprising a series of openings and a conductive sheet hot-rolled on one surface of said film, said sheet forming at each opening a plurality of flexible leads extending towards the center of said opening and bonded to a chip located in said center, said device comprising: a first support plate for supporting said substrate, a bonding head movable in a direction perpendicular to said plate, means for displacing said head between a first position in which it is at a distance from said substrate and a second position in which it is in contact with said substrate, a second support plate, disposed between the first support plate and the bonding head when this latter is in its first position, for supporting the film having chips mounted thereon, said second support plate being provided with a die opening positioned on the bonding axis of the head, and means for adjusting successively each chip of the film on the bonding axis of the head, each adjusted chip overlying said die opening, said bonding head comprising a peen shaped to be engaged in said die opening for cutting the leads of the adjusted chip, when the bonding head is displaced from its first position to its second position for soldering to said substrate the remaining portions of the leads of said chip which, after this cutting-off has been completed, is carried by said peen to said substrate.

Claim 5

A device for soldering to a substrate integrated circuit chips mounted previously on a carrier film, said film comprising a series of openings and a conductive sheet hot-rolled on one surface of said film, said sheet forming at each opening a plurality of flexible leads extending towards the center of said opening and bonded to a chip located in said center, said device comprising: a first support plate for supporting said substrate, a bonding head movable in a direction perpendicular to said plate, means for displacing said head between a first position in which it is at a distance from said substrate and a second position in which it is in contact with said substrate, a second support plate, disposed between the first support plate and the bonding head when this latter is in its first position, for supporting the film having chips mounted thereon, said second support plate being provided with a die opening positioned on the bonding axis of the head, means for adjusting successively each chip of the film on the bonding axis of the head, each adjusted chip overlying said die opening, said bonding head comprising a peen shaped to be engaged in said die opening for cutting the leads of the adjusted chip, when the bonding head is displaced from its first position to its second position, said peen having a recess for receiving said chip when the latter, after said cutting-off has been completed, is lifted off the film, and pneumatic means for maintaining said chip in said recess between the instant where this chip is lifted off the film and the instant where the remaining portions of the leads of said chip are applied by the peen to be soldered on the substrate.

Claim 6

A device for soldering to a substrate integrated circuit chips mounted previously on a carrier film, said film comprising a series of openings and a conductive sheet hot-rolled on one surface of said film, said sheet forming at each opening a plurality of flexible leads extending towards the center of said opening and bonded to a chip located in said center, said device comprising: a first support plate for supporting said substrate, a bonding head movable in a direction perpendicular to said plate, means for displacing said head between a first position in which it is at a distance from said substrate and a second position in which it is in contact with said substrate, a second support plate, disposed between the first support plate and the bonding head when this latter is in its first position, for supporting the film having chips mounted thereon, said second support plate being provided with a die opening positioned on the bonding axis of the head, means for adjusting successively each chip of the film on the bonding axis of the head, each adjusted chip overlying said die opening, said bonding head comprising a peen shaped to be engaged in said die opening for cutting the leads of the adjusted chip, when the bonding head is displaced from its first position to its second position, said peen having a recess for receiving said chip when the latter, after said cutting-off has been completed, is lifted off the film, and pneumatic means for maintaining said chip in said recess between the instant where this chip is lifted off the film and the instant where the remaining portions of the leads of said chip are applied by the peen to be soldered on the substrate.