US3696985A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Methods of and apparatus for aligning and bonding workpieces
Assignee: AT&T Inc
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Filing: 1969-12-31
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Granted: 1972-10-10
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Expires: 1989-12-31
Abstract
Abstract Bonding machines have transparent elements on their bonding axes. Magnified optical means are positioned to view bonding tips and integrated-circuit chips simultaneously through the transparent elements thereby facilitating alignment of the chips to the tips. In one embodiment a bonding tip is transparent and a transparent compliant bonding member is utilized in conjunction with the tip to produce compliant bonds. Another embodiment utilizes a transparent tip in a ''''hard tip'''' type of bonding operation. A third embodiment utilizes a transparent tray closely positionable to the bonding tip. After alignment of the tip to one of the chips is achieved the tray is removed and bonding proceeds on an accurately positioned substrate.
Inventors
- 👤 Carl R Herring
- 👤 Fred J Schneider
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 04:23
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49131
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
110 words
In a method of compliant bonding wherein metal-to-metal bonding of a first workpiece to a second workpiece is accomplished by the steps of clamping said workpieces together around the desired bond region between a support and a deformable compliant member, said member being capable of deformation around one of said workpieces, and applying sufficient thermal and/or mechanical bonding energy to said bond region to deform said member around said one workpiece and bond said workpiece, the improvement which comprises the steps of: providing that said compliant member is transparent, and viewing the workpieces through said transparent compliant member while aligning said workpieces to each other whereby said alignment is facilitated.
Claim 2
Dependent Claim
110 words
In a method of compliant bonding wherein metal-to-metal bonding of a first workpiece to a second workpiece is accomplished by the steps of clamping said workpieces together around the desired bond region between a support and a deformable compliant member, said member being capable of deformation around one of said workpieces, and applying sufficient thermal and/or mechanical bonding energy to said bond region to deform said member around said one workpiece and bond said workpiece, the improvement which comprises the steps of: providing that said compliant member is transparent, and viewing the workpieces through said transparent compliant member while aligning said workpieces to each other whereby said alignment is facilitated.
Claim 3
Independent Claim
115 words
A method for compliantly bonding a first workpiece to a second workpiece, which comprises: aligning the first workpiece to a predetermined portion of a transparent compliant bonding member said member being capable of deformation around one of said workpieces while viewing the workpiece through the member; engaging the aligned first workpiece with the member; aligning the engaged first workpiece with a predetermined portion of the second workpiece while viewing said workpieces through the member; and compressively engaging, for a predetermined period, a bonding tip against the said portion of said second workpiece with the first workpiece and the compliant member therebetween to effect compliant bonding between the workpieces while viewing said workpieces through the member.
Claim 4
Independent Claim
115 words
A method for compliantly bonding a first workpiece to a second workpiece, which comprises: aligning the first workpiece to a predetermined portion of a transparent compliant bonding member said member being capable of deformation around one of said workpieces while viewing the workpiece through the member; engaging the aligned first workpiece with the member; aligning the engaged first workpiece with a predetermined portion of the second workpiece while viewing said workpieces through the member; and compressively engaging, for a predetermined period, a bonding tip against the said portion of said second workpiece with the first workpiece and the compliant member therebetween to effect compliant bonding between the workpieces while viewing said workpieces through the member.
Claim 5
Independent Claim
101 words
A method for thermocompression bonding a beam-lead integrated circuit chip to a substrate, which comprises: aligning the chip to a predetermined portion of a transparent tip while viewing the chip through the tip; engaging the aligned chip with the tip; aligning the leads of the engaged chip with a predetermined portion of the substrate while viewing the chip and substrate through the tip; and compressively engaging for a predetermined period the tip against said portion of said substrate with the leads of the chip therebetween to effect bonding between the leads and the substrate while viewing said leads through the tip.
Claim 6
Independent Claim
101 words
A method for thermocompression bonding a beam-lead integrated circuit chip to a substrate, which comprises: aligning the chip to a predetermined portion of a transparent tip while viewing the chip through the tip; engaging the aligned chip with the tip; aligning the leads of the engaged chip with a predetermined portion of the substrate while viewing the chip and substrate through the tip; and compressively engaging for a predetermined period the tip against said portion of said substrate with the leads of the chip therebetween to effect bonding between the leads and the substrate while viewing said leads through the tip.
Claim 7
Independent Claim
183 words
A method of bonding first workpieces to second workpieces, which comprises the steps of: supporting a plurality of the first workpieces on a transparent tray; moving the tray into intersecting relationship with a bonding axis of a bonding machine; viewing along the bonding axis with a magnifying optical system through the transparent tray to simultaneously visualize a bonding tip and any of the first workpieces or portions thereof which are on or near the bonding axis; manipulating the supporting tray in response to the visualization to align one of the first workpieces with the tip; moving the tip along the bonding axis to engage the tip with the aligned first workpiece; moving the tip to a retracted position; moving the tray out of intersecting relationship with the bonding axis; placing a second workpiece into a pre-positionable location so that a desired portion of the second workpiece Is aligned with the bonding axis; and moving the tip and the engaged first workpiece into compressive relationship with the second workpiece to effect bonding between the first workpiece and the desired portions of the second workpiece.
Claim 8
Independent Claim
183 words
A method of bonding first workpieces to second workpieces, which comprises the steps of: supporting a plurality of the first workpieces on a transparent tray; moving the tray into intersecting relationship with a bonding axis of a bonding machine; viewing along the bonding axis with a magnifying optical system through the transparent tray to simultaneously visualize a bonding tip and any of the first workpieces or portions thereof which are on or near the bonding axis; manipulating the supporting tray in response to the visualization to align one of the first workpieces with the tip; moving the tip along the bonding axis to engage the tip with the aligned first workpiece; moving the tip to a retracted position; moving the tray out of intersecting relationship with the bonding axis; placing a second workpiece into a pre-positionable location so that a desired portion of the second workpiece Is aligned with the bonding axis; and moving the tip and the engaged first workpiece into compressive relationship with the second workpiece to effect bonding between the first workpiece and the desired portions of the second workpiece.
Claim 9
Dependent Claim
40 words
The method of bonding of claim 4 wherein the first workpieces are beam-lead integrated-circuit chips, the second workpieces are substrates and bonding is effected between the leads of the chips and conductive elements formed on the surface of the substrates.
Claim 10
Dependent Claim
90 words
In a bonding apparatus, a system for aligning a workpiece with a bonding tip which comprises: a transparent tray for supporting the workpiece; optical magnification means having a predetermined depth of field for viewing the workpiece and the bonding tip through the transparent tray; means for supporting the transparent tray close enough to the bonding tip so that the tip and the workpiece are simultaneously within the depth of field of the optical magnification means; and means for manipulating the transparent tray to align the workpieces with the bonding tip.
Claim 11
Dependent Claim
90 words
In a bonding apparatus, a system for aligning a workpiece with a bonding tip which comprises: a transparent tray for supporting the workpiece; optical magnification means having a predetermined depth of field for viewing the workpiece and the bonding tip through the transparent tray; means for supporting the transparent tray close enough to the bonding tip so that the tip and the workpiece are simultaneously within the depth of field of the optical magnification means; and means for manipulating the transparent tray to align the workpieces with the bonding tip.
Claim 12
Independent Claim
282 words
An apparatus for bonding beam-lead integrated circuit chips to conductive elements on substrates which comprises: a bonding tip; a transparent tray for supporting a plurality of the chips; means for moving the tray into and out of intersecting relationship with the bonding axis; magnifying optical means for viewing simultaneously the bonding tip and the chips or portions thereof which are on or near the bonding axis when the transparent tray intersects the bonding axis; means for manipulating the tray in response to an image of the tip and the chips as seen through the magnifying optical means to align one of the chips with the tip; means for moving the bonding tip along the bonding axis to engage the tip with the aligned chip and returning the tip to a retracted position; a removable support block having two intersecting reference surfaces thereon and having a clamp assembly thereon for maintaining a desired portion of the conductive elements of the substrate at a desired location with respect to the reference surfaces of the block; at least two stop members against which the reference surfaces of the block can be placed, the stop members being adjustable positionable with respect to the bonding axis, in a plane intersecting the axis, such that the desired portion of substrate can be aligned with the bonding axis when the support block is located against the stop members; and means for moving the bonding tip and the engaged chip into compressive engagement with the conductive elements of one of the substrates held in the desired location on the block against the stop members to effect bonding between the leads of the chip and the conductive elements of the substrate.
Claim 13
Independent Claim
282 words
An apparatus for bonding beam-lead integrated circuit chips to conductive elements on substrates which comprises: a bonding tip; a transparent tray for supporting a plurality of the chips; means for moving the tray into and out of intersecting relationship with the bonding axis; magnifying optical means for viewing simultaneously the bonding tip and the chips or portions thereof which are on or near the bonding axis when the transparent tray intersects the bonding axis; means for manipulating the tray in response to an image of the tip and the chips as seen through the magnifying optical means to align one of the chips with the tip; means for moving the bonding tip along the bonding axis to engage the tip with the aligned chip and returning the tip to a retracted position; a removable support block having two intersecting reference surfaces thereon and having a clamp assembly thereon for maintaining a desired portion of the conductive elements of the substrate at a desired location with respect to the reference surfaces of the block; at least two stop members against which the reference surfaces of the block can be placed, the stop members being adjustable positionable with respect to the bonding axis, in a plane intersecting the axis, such that the desired portion of substrate can be aligned with the bonding axis when the support block is located against the stop members; and means for moving the bonding tip and the engaged chip into compressive engagement with the conductive elements of one of the substrates held in the desired location on the block against the stop members to effect bonding between the leads of the chip and the conductive elements of the substrate.
Claim 14
Dependent Claim
156 words
Apparatus for thermocompression bonding a first workpiece to a second workpiece, which comprises: a bonding head capable of transmitting light through at least a tip portion thereof; means for aligning said first workpiece to a predetermined portion of the tip; means for engaging said aligned first workpieces to said tip; means for aligning the engaged first workpiece with a predetermined portion of the second workpiece; means for compressively engaging for a predetermined period the tip against the said portion of said second workpiece with the first workpiece therebetween to effect bonding between the workpieces; and means for viewing the first workpiece and said predetermined portion of the second workpiece through the light transmitting portion of the tip whereby said alignment of the first workpiece to the tip, the alignment of the first workpiece to the second workpiece and the compressive engagement between the workpieces is performable in response to visual information transmitted through said viewing means.
Claim 15
Dependent Claim
156 words
Apparatus for thermocompression bonding a first workpiece to a second workpiece, which comprises: a bonding head capable of transmitting light through at least a tip portion thereof; means for aligning said first workpiece to a predetermined portion of the tip; means for engaging said aligned first workpieces to said tip; means for aligning the engaged first workpiece with a predetermined portion of the second workpiece; means for compressively engaging for a predetermined period the tip against the said portion of said second workpiece with the first workpiece therebetween to effect bonding between the workpieces; and means for viewing the first workpiece and said predetermined portion of the second workpiece through the light transmitting portion of the tip whereby said alignment of the first workpiece to the tip, the alignment of the first workpiece to the second workpiece and the compressive engagement between the workpieces is performable in response to visual information transmitted through said viewing means.
Claim 16
Dependent Claim
29 words
The apparatus of claim 8, which further comprises: means for engaging a transparent compliant member with the tip Whereby the apparatus can be made capable of producing compliant bonds.
Claim 17
Dependent Claim
127 words
The apparatus of claim 9 wherein the head comprises: a hollow chamber internal of said head, the chamber being formed and located so that bonding axis passes two sides thereof; being closed on one of its sides through which the bonding axis passes by the transparent engagement portion being in communication with the aperture in the engagement portion; being closed at the opposite one of the sides through which the bonding axis passes by a transparent member; and having an aperture in one of the sides other than those through which the bonding axis passes which aperture is connectable to the vacuum source whereby the connection to the vacuum source is remote from the bonding axis and visibility along the axis is not impaired by such connection.
Claim 18
Dependent Claim
55 words
The apparatus of claim 8 wherein the bonding head includes a transparent engagement portion and the means for engaging the first workpiece with the head includes an aperture in said engagement portion connectable to a source of vacuum whereby said first workpiece can be held against said head by the forces of the vacuum source.
Claim 19
Dependent Claim
34 words
The apparatus of claim 11 wherein the aperture in the engagement portion is shaped to accommodate a body portion of a beam-lead integrated-circuit chip while leads of the chip bear against the engagement portion.
Claim 20
Dependent Claim
17 words
The apparatus of claim 8 wherein the bonding head includes a transparent engagement portion which is quartz.
Claim 21
Dependent Claim
17 words
The apparatus of claim 8 wherein the bonding head includes a transparent engagement portion which is glass.
Claim 22
Dependent Claim
112 words
In an apparatus for compliant bonding wherein metal-to-metal bonding of a first workpiece to a second workpiece including means for clamping said workpieces together around the desired bond region between a support and a deformable compliant member, said member being capable of deformation around one of said workpieces and means for applying sufficient thermal and/or mechanical bonding energy to said bond region to deform said member around said one workpiece and bond said workpiece, the improvement which comprises: the compliant member being transparent; and the apparatus having means for viewing the workpieces through the transparent compliant member whereby alignment of the workpieces with each other and with the compliant member is facilitated.
Claim 23
Dependent Claim
112 words
In an apparatus for compliant bonding wherein metal-to-metal bonding of a first workpiece to a second workpiece including means for clamping said workpieces together around the desired bond region between a support and a deformable compliant member, said member being capable of deformation around one of said workpieces and means for applying sufficient thermal and/or mechanical bonding energy to said bond region to deform said member around said one workpiece and bond said workpiece, the improvement which comprises: the compliant member being transparent; and the apparatus having means for viewing the workpieces through the transparent compliant member whereby alignment of the workpieces with each other and with the compliant member is facilitated.
Claim 24
Dependent Claim
17 words
The apparatus of claim 15 wherein the compliant member is formed of a film of polyimide film.
Claim 25
Dependent Claim
84 words
In a bonding head wherein a first workpiece to be bonded to a second workpiece is held in engagement with the head on a bonding axis prior to engagement with the second workpiece, the improvement which comprises: the bonding head being transparent along the bonding axis whereby the engaged first workpiece is visible through the head, the second workpiece is visible through the head when the engaged first workpiece overlies the second workpiece and alignment between the workpieces is facilitated because of such visibility.
Claim 26
Dependent Claim
84 words
In a bonding head wherein a first workpiece to be bonded to a second workpiece is held in engagement with the head on a bonding axis prior to engagement with the second workpiece, the improvement which comprises: the bonding head being transparent along the bonding axis whereby the engaged first workpiece is visible through the head, the second workpiece is visible through the head when the engaged first workpiece overlies the second workpiece and alignment between the workpieces is facilitated because of such visibility.
Claim 27
Dependent Claim
48 words
The bonding head of claim 17 which comprises: a transparent engagement portion against which the first workpiece bears, and an aperture in said engagement portion connectable to a source of vacuum whereby said first workpiece can be held against said head by the forces of the vacuum source.
Claim 28
Dependent Claim
126 words
The bonding head of claim 18 which comprises: a hollow chamber internal of said head, the chamber being formed and located so that bonding axis passes two sides thereof; being closed on one of its sides through which the bonding axis passes by the transparent engagement portion being in communication with the aperture in the engagement portion; being closed at the opposite one of the sides through which the bonding axis passes by a transparent member; and having an aperture in one of the sides other than those through which the bonding axis passes which aperture is connectable to the vacuum source whereby the connection to the vacuum source is remote fRom the bonding axis and visibility along the axis is not impaired by such connection.
Claim 29
Dependent Claim
35 words
The bonding head of claim 18 wherein the aperture in the engagement portion is shaped to accommodate a body portion of a beam-lead integrated-circuit chip while leads of the chip bear against the engagement portion.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-10-10 | 1976-04-10 | 1976-10-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-10-10 | 1980-04-10 | 1980-10-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-10-10 | 1984-04-10 | 1984-10-10 | $7700.00 | Window Closed / Lapsed |