Integrated transducer assemblies

Claim 2

A transducer assembly comprising: a. a realtively thin diaphragm fabricated from a semiconductor material and having located on a surface at least one force responsive element in an active central area of said diaphragm, said central area surrounded by a peripheral non-active area, b. a tubular base member having a central aperture relatively congruent with said active area of said diaphragm and having on a surface thereof a plurality of wire accommodating apertures, said base member fabricated from a high dielectric material, c. a thin and relatively smooth metal ring, depoSited about the periphery of said diaphragm, said ring having a plurality of apertures about the periphery thereof, said ring having a central aperture approximately congruent with said active area, and d. means including a glass bond of a thickness substantially less than the thickness of said thin diaphragm, coupling said ring between said diaphragm and said tubular base member with said apertures about the periphery of said ring communicating with said wire accommodating apertures of said base member.

Claim 3

The transducers assembly according to claim 1 wherein said means coupling said ring between said diaphragm and said housing includes at least one bond fabricated from a glass, having a melting temperature below 400*F.

Claim 4

The transducer according to claim 1 wherein said force responsive element is a piezoresistor.

Claim 5

A transducer assembly comprising: a. a relatively thin diaphragm fabricated from a semiconductor material and having located thereon at least one force responsive element in an active central area of said diaphragm, and said central area surrounded by a peripheral non-active area, b. a longitudinal tubular member having a central aperture relatively congruent with said active area of said diaphragm and having on a surface thereof a plurality of wire accommodating slots, said member fabricated from a dielectric insulating material, c. a thin and relatively smooth metal ring deposited about the periphery of said thin diaphragm, said ring having a plurality of U-shaped apertures about the periphery thereof defining contact areas, said ring having a central aperture approximately congruent with said active area, whereby U-shaped apertures are located within said non-active area, and d. insulating means including a glass bond of a thickness substantially less than the thickness of said thin diaphragm coupling said ring between said diaphragm and said tubular member with each one of said apertures in direct communication with a respective one of said slots, whereby said apertures and said slots form locating positions for connecting utilization means to said force responsive element.

Claim 6

A transducer assembly comprising: a. a relatively thin diaphragm fabricated from a semiconductor material and having located thereon at least one force responsive element in an active central area of said diaphragm, and said central area surrounded by a peripheral non-active area, b. a longitudinal tubular member having a central aperture relatively congruent with said active area of said diaphragm and having on a surface thereof a plurality of wire accommodating slots, said member fabricated from a dielectric insulating material, c. a thin and relatively smooth metal ring deposited about the periphery of said thin diaphragm, said ring having a plurality of U-shaped apertures about the periphery thereof defining contact areas, said ring having a central aperture approximately congruent with said active area, whereby U-shaped apertures are located within said non-active area, and d. insulating means including a glass bond of a thickness substantially less than the thickness of said thin diaphragm coupling said ring between said diaphragm and said tubular member with each one of said apertures in direct communication with a respective one of said slots, whereby said apertures and said slots form locating positions for connecting utilization means to said force responsive element.

Claim 7

A transducer assembly comprising a thin diaphragm fabricated from a semiconductor material and having located on a surface thereof at least one force responsive element, said element positioned within a central portion of said diaphragm, a thin and relatively smooth metal ring, deposited about the periphery of said diaphragm, having a central aperture defining said active area, and a plurality of terminal accommodating apertures about the periphery of said ring, means securing said ring to said diaphragm with the active area within said central aperture of said ring and an annular housing having a series of wire accommodating grooves in a sidewall thereof secured to said ring with the apertures in said ring aligned with the grooves in said housing.

Claim 8

A transducer assembly comprising a thin diaphragm fabricated from a semiconductor material and having located on a surface thereof at least one force responsive element, said element positioned within a central portion of said diaphragm, a thin and relatively smooth metal ring, deposited about the periphery of said diaphragm, having a central aperture defining said active area, and a plurality of terminal accommodating apertures about the periphery of said ring, means securing said ring to said diaphragm with the active area within said central aperture of said ring and an annular housing having a series of wire accommodating grooves in a sidewall thereof secured to said ring with the apertures in said ring aligned with the grooves in said housing.

Claim 9

The transducer according to claim 5 wherein said metal ring is secured to said housing by means of an electrostatic glass bond.