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US6285043B1
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Application-specific optoelectronic integrated circuit
Assignee: University of Missouri–St. Louis
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Filing: 1999-11-01
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Granted: 2001-09-04
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Expires: 2019-11-01
Abstract
Abstract An application-specific rf optoelectronic integrated circuit having a generic chip member and a defining substrate in communication with at least one generic chip member. The generic chip member contains passive building block components that are independent from each other and being connected by paths external to the generic chip member. The external connection paths are defined by a defining substrate member having passive components for providing optical and electrical interconnection between selected building block components on the generic chip member to define the specific function of the integrated circuit. It is possible to use the same design of the generic chip for several applications merely by altering the interconnect paths on a defining substrate.
Inventors
- 👤 Daniel Yap
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 09:24
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4219; G02B6/4228; G02B6/4232; H; H10; H10F; H10F39/00; H10F39/10; H10F39/107; G02B6/423; G02B6/4246
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
92 words
An integrated circuit comprising: at least one chip member having a predefined pattern of building block components arranged thereon, said building block components being separate and independent from each other, said building block components having external connection points; and a substrate member in communication with predetermined external connection points of said at least one chip member, said substrate member having a predefined pattern of circuit sections for modifying and selectively connecting selected building block components in said predefined pattern of building block components to each other thereby defining an application-specific integrated circuit.
Claim 2
Dependent Claim
92 words
An integrated circuit comprising: at least one chip member having a predefined pattern of building block components arranged thereon, said building block components being separate and independent from each other, said building block components having external connection points; and a substrate member in communication with predetermined external connection points of said at least one chip member, said substrate member having a predefined pattern of circuit sections for modifying and selectively connecting selected building block components in said predefined pattern of building block components to each other thereby defining an application-specific integrated circuit.
Claim 3
Dependent Claim
14 words
The integrated circuit of claim 1 wherein said circuit sections further comprise passive components.
Claim 4
Dependent Claim
36 words
The integrated circuit of claim 2 wherein said passive components are chosen from the group consisting of transmission lines, capacitors, inductors, resistors, resonators, tuning stubs and rf filters, waveguides, reflectors, and means for holding optical fibers.
Claim 5
Dependent Claim
24 words
The integrated circuit of claim 3 wherein said means for holding optical fibers further comprises at least one groove for retaining an optical fiber.
Claim 6
Dependent Claim
13 words
The integrated circuit of claim 1 wherein said building blocks are active devices.
Claim 7
Dependent Claim
16 words
The integrated circuit of claim 5 wherein said active devices are optical devices and electronic devices.
Claim 8
Dependent Claim
31 words
The integrated circuit of claim 5 wherein said active devices are chosen from the group consisting of photodetectors, optoelectronic modulators, light emitters amplifier stages, buffers, drivers, switches, logic gates and latches.
Claim 9
Dependent Claim
15 words
The integrated circuit of claim 1 wherein said external connection points are solder-bump compatible pads.
Claim 10
Dependent Claim
38 words
The integrated circuit of claim 8 wherein a solder bump is disposed between said solder pads thereby defining a connecting path between said building blocks on said chip member and between said substrate member and said chip member.
Claim 11
Dependent Claim
18 words
The integrated circuit of claim 9 wherein said solder bump is formed as part of said substrate member.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-09-03 | 2005-03-05 | 2005-09-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-09-03 | 2009-03-05 | 2009-09-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-09-03 | 2013-03-05 | 2013-09-04 | $7700.00 | Window Closed / Lapsed |