Patent US6117347A successfully refreshed from Google Patents.
US6117347A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of separating wafers into individual die
Assignee: NEC Corp
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Filing: 1997-07-10
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Granted: 2000-09-12
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Expires: 2017-07-10
Abstract
Abstract A method of separating a wafer into individual die is disclosed. The wafer includes a substrate with organic thin-film multiple layers. A portion of the organic multiple layers is etched along a scribe line with excimer laser to form a groove to expose a portion of the substrate before sawing the substrate along the scribe line with a saw blade. Plasma etching or ion beam etching or sand blasting is an alternative to the excimer laser.
Inventors
- 👤 Hisashi Ishida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 10:20
CPC Classifications
H; H10; H10P; H10P54/00; H10P52/00
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
165 words
A method of separating a wafer into individual dies, the method comprising the steps of: forming a substrate of a ceramic material; forming organic multiple layers over the surface of said ceramic substrate; removing a portion of said organic multiple layers along a scribe line to form a groove to expose a portion of the surface of said ceramic substrate, said removing step forming two spaced parallel side walls defined by peripheral edges of the organic multiple layers, said side walls being connected to and extending from said ceramic substrate and cooperating with said exposed portion of the surface of said ceramic substrate to define said groove, said exposed portion being flat and extending across the scribe line; inserting a saw blade that has a thickness less than a width of said groove into said groove out of interference contact with said two spaced parallel side walls; and sawing said substrate inwardly from said exposed portion thereof along the scribe line with said saw blade.
Claim 2
Independent Claim
165 words
A method of separating a wafer into individual dies, the method comprising the steps of: forming a substrate of a ceramic material; forming organic multiple layers over the surface of said ceramic substrate; removing a portion of said organic multiple layers along a scribe line to form a groove to expose a portion of the surface of said ceramic substrate, said removing step forming two spaced parallel side walls defined by peripheral edges of the organic multiple layers, said side walls being connected to and extending from said ceramic substrate and cooperating with said exposed portion of the surface of said ceramic substrate to define said groove, said exposed portion being flat and extending across the scribe line; inserting a saw blade that has a thickness less than a width of said groove into said groove out of interference contact with said two spaced parallel side walls; and sawing said substrate inwardly from said exposed portion thereof along the scribe line with said saw blade.
Claim 3
Dependent Claim
30 words
A method as claimed in claim 1, wherein said removing step includes the step of irradiating laser beam of excimer laser to remove said portion of the organic multiple layers.
Claim 4
Dependent Claim
28 words
A method as claimed in claim 1, wherein said removing step includes the step of plasma etching said portion of the organic multiple layers with excited etchant ions.
Claim 5
Dependent Claim
26 words
A method as claimed in claim 1, wherein said removing step includes the step of etching said portion of the organic multiple layers with ion beam.
Claim 6
Dependent Claim
26 words
A method as claimed in claim 1, wherein said removing step includes the step of sand blasting to etch said portion of the organic multiple layers.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-09-12 | 2004-03-13 | 2004-09-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-09-12 | 2008-03-13 | 2008-09-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-09-12 | 2012-03-13 | 2012-09-12 | $7700.00 | Window Closed / Lapsed |