Mounting device for electronic components

Claim 2

An assembly comprising a heat sink (12) and a board (11), said heat sink and said board sandwiching an electrical or electronic component therebetween, said assembly further comprising pressure means (20) for causing said heat sink to exert a contact force (Fc) on the component, and coupling means (18, 21) passing through said heat sink and said board for coupling said pressure means with said heat sink, and for preloading a biasing force (4F0) on said heat sink prior to said heat sink being mounted onto said board, wherein said biasing force is related to said contact force.

Claim 3

The assembly according to claim 1, wherein said coupling means includes fastening means (18) coupled with said pressure means, and first stopping means (21) for stopping against said heat sink.

Claim 4

The assembly according to claim 2, wherein said fastening means includes second stopping means which enables the fastening means to be secured to the board with a mounting force which is substantially independent from said contact force.

Claim 5

An assembly comprising a first element (12) and a second element (11), said first and said second elements sandwiching an electrical or electronic component (13) therebetween, said assembly including pressure means (20) for causing said first element to exert a predetermined contact force (Fc) on the component and coupling means (18, 21) passing through said first and second elements for coupling said pressure means to said first element, said coupling means retaining said pressure means and said first element together in a manner such that said pressure means exerts a preloaded biasing force on said first element prior to said first element being mounted onto said second element, and wherein said biasing force is related to said predetermined contact force.

Claim 6

An assembly comprising a first element (12) and a second element (11), said first and said second elements sandwiching an electrical or electronic component (13) therebetween, said assembly including pressure means (20) for causing said first element to exert a predetermined contact force (Fc) on the component and coupling means (18, 21) passing through said first and second elements for coupling said pressure means to said first element, said coupling means retaining said pressure means and said first element together in a manner such that said pressure means exerts a preloaded biasing force on said first element prior to said first element being mounted onto said second element, and wherein said biasing force is related to said predetermined contact force.

Claim 7

The assembly according to claim 4, wherein said coupling means includes fastening means (18) coupled with said pressure means, and first stopping means (21) for stopping against said first element.

Claim 8

The assembly according to claim 5, wherein said fastening means includes second stopping means which enables the fastening means to be secured to the second element with a mounting force which is substantially independent from said contact force.

Claim 9

An electronic component frame assembly comprising a first element and a second element sandwiching an electrical or electronic component therebetween, said assembly further including: pressure means for effecting a predetermined contact force to be exerted by said first element on said component; fastener means passing through said first and second elements for fastening said first element to said second element, said fastener means being operatively coupled to said first element by a coupling means for operatively coupling said first element to said fastener means and to said pressure means, said pressure means being disposed in a position whereby a biasing force is exerted between said fastener means and said first element prior to said first element being mounted onto said second element, wherein said biasing force is related to said predetermined contact force; and said second element having means for receiving said fastening means to mount said first element onto said second element.

Claim 10

An electronic component frame assembly comprising a first element and a second element sandwiching an electrical or electronic component therebetween, said assembly further including: pressure means for effecting a predetermined contact force to be exerted by said first element on said component; fastener means passing through said first and second elements for fastening said first element to said second element, said fastener means being operatively coupled to said first element by a coupling means for operatively coupling said first element to said fastener means and to said pressure means, said pressure means being disposed in a position whereby a biasing force is exerted between said fastener means and said first element prior to said first element being mounted onto said second element, wherein said biasing force is related to said predetermined contact force; and said second element having means for receiving said fastening means to mount said first element onto said second element.

Claim 11

An electronic component frame assembly comprising a heat sink and a board, said heat sink and said board, sandwiching an electrical or electronic component therebetween, said assembly further comprising: pressure means for effecting a predetermined contact force to be exerted by said heat sink on said component; fastener means passing through said heat sink and said board for fastening said heat sink to said board, said fastener means being operatively coupled to said heat sink by a coupling means for operatively coupling said heat sink to said fastener means and to said pressure means, said pressure means being disposed in a position whereby a biasing force is exerted between said fastener means and said heat sink prior to said heat sink being mounted onto said board, and wherein said biasing force is employed to govern said predetermined contact force; and said board having means for receiving said fastening means to mount said heat sink onto said board.

Claim 12

An electronic component frame assembly comprising a heat sink and a board, said heat sink and said board, sandwiching an electrical or electronic component therebetween, said assembly further comprising: pressure means for effecting a predetermined contact force to be exerted by said heat sink on said component; fastener means passing through said heat sink and said board for fastening said heat sink to said board, said fastener means being operatively coupled to said heat sink by a coupling means for operatively coupling said heat sink to said fastener means and to said pressure means, said pressure means being disposed in a position whereby a biasing force is exerted between said fastener means and said heat sink prior to said heat sink being mounted onto said board, and wherein said biasing force is employed to govern said predetermined contact force; and said board having means for receiving said fastening means to mount said heat sink onto said board.