US5772905A
Expired / Lapsed
US
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Nanoimprint lithography
Assignee: University of Minnesota System
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Filing: 1995-11-15
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Granted: 1998-06-30
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Expires: 2015-11-15
Abstract
Abstract A lithographic method and apparatus for creating ultra-fine (sub-25 nm) patterns in a thin film coated on a substrate is provided, in which a mold having at least one protruding feature is pressed into a thin film carried on a substrate. The protruding feature in the mold creates a recess of the thin film. The mold is removed from the film. The thin film then is processed such that the thin film in the recess is removed exposing the underlying substrate. Thus, the patterns in the mold is replaced in the thin film, completing the lithography. The patterns in the thin film will be, in subsequent processes, reproduced in the substrate or in another material which is added onto the substrate.
Inventors
- 👤 Stephen Y. Chou
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 17:15
CPC Classifications
B; B29; B29C; B29C59/00; B29C59/02; B29C59/022; B82; B82Y; B82Y10/00; B82Y40/00; G; G03; G03F; G03F7/00; G03F7/0002; G03F9/00; G03F9/70; G03F9/7049; G03F9/7053; B29C2059/023; B29C59/026; Y; Y10; Y10S; Y10S977/00; Y10S977/84; Y10S977/887
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
218 words
A lithographic method for forming a pattern in a film carried on a substrate, comprising the steps of: obtaining a substrate; depositing a film on the substrate; obtaining a mold of a stiff material which is hard relative to the film, the mold having a first protruding feature and a recess formed thereby and a second protruding feature spaced apart prom the first protruding feature, the first and second features and the recess having a shape forming a mold pattern and providing at least one mold pattern lateral dimension which is less than 200 nm; urging the mold at a molding pressure into the film whereby the thickness of the film under the protruding feature is reduced and a thin region is formed in the film, wherein the molding pressure is sufficiently high to transfer the mold pattern to the film and the molding pressure causes a local deformation in the mold which is less than the mold pattern lateral dimension; removing the mold from the film; processing the relief whereby the thin region is removed exposing portions of the surface of the substrate which underlie the thin region; and whereby the exposed portions of the surface of the substrate substantially replicate the mold pattern and have at least one lateral dimension which is less than 200 nm.
Claim 2
Dependent Claim
218 words
A lithographic method for forming a pattern in a film carried on a substrate, comprising the steps of: obtaining a substrate; depositing a film on the substrate; obtaining a mold of a stiff material which is hard relative to the film, the mold having a first protruding feature and a recess formed thereby and a second protruding feature spaced apart prom the first protruding feature, the first and second features and the recess having a shape forming a mold pattern and providing at least one mold pattern lateral dimension which is less than 200 nm; urging the mold at a molding pressure into the film whereby the thickness of the film under the protruding feature is reduced and a thin region is formed in the film, wherein the molding pressure is sufficiently high to transfer the mold pattern to the film and the molding pressure causes a local deformation in the mold which is less than the mold pattern lateral dimension; removing the mold from the film; processing the relief whereby the thin region is removed exposing portions of the surface of the substrate which underlie the thin region; and whereby the exposed portions of the surface of the substrate substantially replicate the mold pattern and have at least one lateral dimension which is less than 200 nm.
Claim 3
Dependent Claim
13 words
The method of claim 1 wherein the thin film comprises a thermoplastic polymer.
Claim 4
Dependent Claim
30 words
The method of claim 1 including heating the thin film to a temperature to allow sufficient softening of the film relative to the mold prior to the step of urging.
Claim 5
Dependent Claim
27 words
The method of claim 1 wherein the features on the mold are formed from material selected from the group consisting of: semiconductors, dielectrics, metals, and their combination.
Claim 6
Dependent Claim
27 words
The method of claim 1 wherein the step of urging comprises pressing the mold into the thin film without allowing the features to contact the underlying substrate.
Claim 7
Dependent Claim
14 words
The method of claim 1 wherein the step of processing comprises reactive ion etching.
Claim 8
Dependent Claim
22 words
The method of claim 1 including repeating the steps of obtaining a mold, urging, removing, and processing to form a multilayered device.
Claim 9
Dependent Claim
21 words
The method of claim 1 including the step of aligning the features on the mold with a pattern on the substrate.
Claim 10
Dependent Claim
19 words
The method of claim 1 including the step of depositing a material on the exposed portion of the substrate.
Claim 11
Dependent Claim
21 words
The method of claim 9 wherein the material is selected from the group consisting of semiconductors, dielectrics, metals, and their combination.
Claim 12
Dependent Claim
14 words
The method of claim 9 including selectively removing the film following depositing the material.
Claim 13
Dependent Claim
18 words
The method of claim 11 wherein the step of selectively removing the film comprises a lift off process.
Claim 14
Dependent Claim
20 words
The method of claim 1 including removing the exposed portion of the substrate to form a recess in the substrate.
Claim 15
Dependent Claim
188 words
A lithographic method for forming a pattern in a film carried on a substrate, comprising the steps; obtaining a substrate; depositing a thin film on the substrate; obtaining a mold of a stiff material which is hard relative to the film, the mold having a first feature and a second feature, the first feature spaced apart from the second feature, the first and second features forming a mold pattern having at least one mold pattern lateral dimension which is less than 200 nm; molding the film with the features of the mold to form thin regions in the film shaped by the features by pressing the mold into the film at a molding pressure, wherein the pressure is sufficiently high to transfer the features to the film and the molding pressure causes a local deformation in the mold which is less than the mold pattern lateral dimension; and removing the thin region of the film exposing portions of the substrate underlying the thin regions thereby patterning the substrate with the feature to form a pattern which has at least one lateral dimension which is less than 200 nm.
Claim 16
Dependent Claim
188 words
A lithographic method for forming a pattern in a film carried on a substrate, comprising the steps; obtaining a substrate; depositing a thin film on the substrate; obtaining a mold of a stiff material which is hard relative to the film, the mold having a first feature and a second feature, the first feature spaced apart from the second feature, the first and second features forming a mold pattern having at least one mold pattern lateral dimension which is less than 200 nm; molding the film with the features of the mold to form thin regions in the film shaped by the features by pressing the mold into the film at a molding pressure, wherein the pressure is sufficiently high to transfer the features to the film and the molding pressure causes a local deformation in the mold which is less than the mold pattern lateral dimension; and removing the thin region of the film exposing portions of the substrate underlying the thin regions thereby patterning the substrate with the feature to form a pattern which has at least one lateral dimension which is less than 200 nm.
Claim 17
Dependent Claim
19 words
The method of claim 14 including the step of depositing a material on the exposed portion of the substrate.
Claim 18
Dependent Claim
20 words
The method of claim 14 including removing the exposed portion of the substrate to form a recess in the substrate.
Claim 19
Dependent Claim
21 words
The method of claim 14 including repeating the steps of obtaining a mold, molding and removing to form a multilayered device.
Claim 20
Dependent Claim
21 words
The method of claim 14 including the step of aligning the features on the mold with a pattern on the substrate.
Claim 21
Dependent Claim
177 words
A lithographic method for forming a pattern in a film carried on a substrate, comprising the steps of: obtaining a substrate; depositing a film on the substrate; obtaining a mold of a stiff material which is hard relative to the film, the mold having a first protruding feature and a recess formed thereby, and a second protruding feature spaced apart from the first protruding feature, the features and the recess having a shape forming a mold pattern with at least one mold pattern lateral dimension which is less than 200 nm; urging the mold at a molding pressure into the film creating a thickness contrast pattern in the film, wherein the molding pressure is sufficiently high to transfer the features to the film and the molding pressure causes a local deformation in the mold which is less than the mold pattern lateral dimension; removing the mold from the film; and transferring the thickness contrast pattern in the film onto the substrate wherein the thickness contrast has at least one lateral dimension which is less than 200 nm.
Claim 22
Dependent Claim
177 words
A lithographic method for forming a pattern in a film carried on a substrate, comprising the steps of: obtaining a substrate; depositing a film on the substrate; obtaining a mold of a stiff material which is hard relative to the film, the mold having a first protruding feature and a recess formed thereby, and a second protruding feature spaced apart from the first protruding feature, the features and the recess having a shape forming a mold pattern with at least one mold pattern lateral dimension which is less than 200 nm; urging the mold at a molding pressure into the film creating a thickness contrast pattern in the film, wherein the molding pressure is sufficiently high to transfer the features to the film and the molding pressure causes a local deformation in the mold which is less than the mold pattern lateral dimension; removing the mold from the film; and transferring the thickness contrast pattern in the film onto the substrate wherein the thickness contrast has at least one lateral dimension which is less than 200 nm.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-29 | 2001-12-29 | 2002-06-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-29 | 2005-12-29 | 2006-06-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-29 | 2009-12-29 | 2010-06-30 | $7700.00 | Window Closed / Lapsed |