US5331371A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Alignment and exposure method
Assignee: Canon Inc
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Filing: 1993-11-04
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Granted: 1994-07-19
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Expires: 2013-11-04
Abstract
Abstract A semiconductor device manufacturing exposure method for exposing different portions of a semiconductor wafer with radiation in a step-and-repeat manner includes the steps of: placing the wafer on a wafer chuck; detecting a first mark of the wafer, whereby a wafer mark signal is produced; controlling a rotational position of the wafer chuck on the basis of the wafer mark signal; printing an image of a second mark of a mask on a portion of a photosensitive material layer provided on a portion of the wafer chuck outside the wafer; photoelectrically detecting the image of the second mark of the mask printed on the photosensitive layer, whereby a mask mark signal is produced; producing data necessary for control of movement of the wafer chuck through a stage, by using the mask mark signal; effecting step-and-repeat exposure of the different portions of the wafer by using a radiation beam while controlling the movement of the wafer chuck through the stage on the basis of the produced data; and blocking a portion of the radiation beam with use of a blocking member disposed between a source of the radiation beam and the wafer to prevent exposure of the photosensitive material layer during the step-and-repeat exposure.
Inventors
- 👤 Tetsuya Mori
- 👤 Akiyoshi Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 15:18
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70058; G03F7/70066; G03F7/70216; G03F7/70425; G03F7/70433; G03F7/70691; G03F9/00; G03F9/70
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
254 words
A semiconductor device manufacturing exposure method for exposing different portions of a semiconductor wafer with radiation in a step-and-repeat manner, said method comprising the steps of: placing the wafer on a wafer chuck; detecting a first mark of the water, whereby a wafer mark signal is produced; controlling a rotational position of the wafer chuck on the basis of the wafer mark signal; printing an image of a second mark of a mask on a portion of a photosensitive material layer provided on a portion of the wafer chuck outside the wafer; photoelectrically detecting the image of the second mark of the mask printed on the photosensitive layer, whereby a mask mark signal is produced; producing data necessary for control of movement of the water chuck through a stage, by using the mask mark signal; effecting step-and-repeat exposure of the different portions of the wafers by using a radiation beam while controlling the movement of the wafer chuck through the stage of the basis of the produced data; and blocking a portion of the radiation beam with use of a blocking member disposed between a source of the radiation beam and the wafer to prevent exposure of the photosensitive material layer during the step-and-repeat exposure, and using the blocking member to change the range of passage of the radiation beam when the portion of the wafer to be exposed changes between when an inside portion of the wafer is to be exposed and when an outside portion of the wafer is to be exposed.
Claim 2
Dependent Claim
254 words
A semiconductor device manufacturing exposure method for exposing different portions of a semiconductor wafer with radiation in a step-and-repeat manner, said method comprising the steps of: placing the wafer on a wafer chuck; detecting a first mark of the water, whereby a wafer mark signal is produced; controlling a rotational position of the wafer chuck on the basis of the wafer mark signal; printing an image of a second mark of a mask on a portion of a photosensitive material layer provided on a portion of the wafer chuck outside the wafer; photoelectrically detecting the image of the second mark of the mask printed on the photosensitive layer, whereby a mask mark signal is produced; producing data necessary for control of movement of the water chuck through a stage, by using the mask mark signal; effecting step-and-repeat exposure of the different portions of the wafers by using a radiation beam while controlling the movement of the wafer chuck through the stage of the basis of the produced data; and blocking a portion of the radiation beam with use of a blocking member disposed between a source of the radiation beam and the wafer to prevent exposure of the photosensitive material layer during the step-and-repeat exposure, and using the blocking member to change the range of passage of the radiation beam when the portion of the wafer to be exposed changes between when an inside portion of the wafer is to be exposed and when an outside portion of the wafer is to be exposed.
Claim 3
Dependent Claim
24 words
A method according to claim 1, further comprising the step of then erasing the image of the mark printed on the photosensitive material layer.
Claim 4
Dependent Claim
69 words
A method according to claim 2, further comprising the steps of: disposing the blocking member on a plane which is substantially optically conjugate with the mask; and changing the position of the block member along the plane between when a central portion of the wafer is to be exposed with the radiation beam and when a peripheral portion of the wafer is to be exposed with the radiation beam.
Claim 5
Dependent Claim
20 words
A method according to claim 2, further comprising the step of disposing the block member adjacent to the wafer chuck.
Claim 6
Dependent Claim
22 words
A method according to claim 1, wherein the photosensitive material layer comprises one of a magneto-optic recording material and a photochromic material.
Claim 7
Dependent Claim
255 words
An exposure method for exposing different portions of a substrate with radiation in a step-and-repeat manner, said method comprising the steps of: placing the substrate on a chucking member; illuminating a mask with a radiation beam, whereby an image of a mark of a mask is printed through a projection optical system on a portion of a photosensitive material layer provided on a portion of the chucking member outside the substrate; photoelectrically detecting the image of the mark of the mask printed on the photosensitive layer, without using the projection optical system, whereby a mask mark signal is produced; producing data necessary for control of movement of the chucking member, by using the mask mark signal; illuminating the mask with a radiation beam while controlling the movement of the chucking member through a stage on the basis of the produced data, so as to print a pattern of the mask on different portions of the substrate sequentially through the projection optical system to perform step-and-repeat exposure of the substrate; and blocking a portion of the radiation beam with use of a blocking member disposed between a source of the radiation beam and the substrate to prevent exposure of the photosensitive material layer during the step-and-repeat exposure, and using the blocking member to change the range of passage of the radiation beam when the portion of the wafer to be exposed changes between when an inside portion of the wafer is to be exposed and when an outside portion of the wafer is to be exposed.
Claim 8
Dependent Claim
255 words
An exposure method for exposing different portions of a substrate with radiation in a step-and-repeat manner, said method comprising the steps of: placing the substrate on a chucking member; illuminating a mask with a radiation beam, whereby an image of a mark of a mask is printed through a projection optical system on a portion of a photosensitive material layer provided on a portion of the chucking member outside the substrate; photoelectrically detecting the image of the mark of the mask printed on the photosensitive layer, without using the projection optical system, whereby a mask mark signal is produced; producing data necessary for control of movement of the chucking member, by using the mask mark signal; illuminating the mask with a radiation beam while controlling the movement of the chucking member through a stage on the basis of the produced data, so as to print a pattern of the mask on different portions of the substrate sequentially through the projection optical system to perform step-and-repeat exposure of the substrate; and blocking a portion of the radiation beam with use of a blocking member disposed between a source of the radiation beam and the substrate to prevent exposure of the photosensitive material layer during the step-and-repeat exposure, and using the blocking member to change the range of passage of the radiation beam when the portion of the wafer to be exposed changes between when an inside portion of the wafer is to be exposed and when an outside portion of the wafer is to be exposed.
Claim 9
Independent Claim
175 words
A method used in a step-and-repeat exposure method for sequentially exposing different zones of a semiconductor wafer for the manufacture of semiconductor devices, wherein a wafer is held by a wafer chuck and, while moving the wafer chuck with a movable stage, the different zones of the wafer are exposed with exposure light, comprising the steps of: providing a photosensitive material on the wafer chuck and outside the wafer held thereon; and placing a block member in a portion of a path of the exposure light between the wafer and a light source supplying the exposure light, so as to block a portion of the exposure light to prevent the photosensitive material from being irradiation with the exposure light during the step-and-repeat exposure of the wafer, and using the blocking member to change the range of passage of the radiation beam when the portion of the wafer to be exposed changes between when an inside portion of the wafer is to be exposed and when an outside portion of the wafer is to be exposed.
Claim 10
Independent Claim
175 words
A method used in a step-and-repeat exposure method for sequentially exposing different zones of a semiconductor wafer for the manufacture of semiconductor devices, wherein a wafer is held by a wafer chuck and, while moving the wafer chuck with a movable stage, the different zones of the wafer are exposed with exposure light, comprising the steps of: providing a photosensitive material on the wafer chuck and outside the wafer held thereon; and placing a block member in a portion of a path of the exposure light between the wafer and a light source supplying the exposure light, so as to block a portion of the exposure light to prevent the photosensitive material from being irradiation with the exposure light during the step-and-repeat exposure of the wafer, and using the blocking member to change the range of passage of the radiation beam when the portion of the wafer to be exposed changes between when an inside portion of the wafer is to be exposed and when an outside portion of the wafer is to be exposed.
Claim 11
Dependent Claim
33 words
A method according to claim 7, wherein further comprising the step of placing the blocking member on and moving the blocking member along a plane which is substantially optically conjugate with a mask.
Claim 12
Dependent Claim
23 words
A method according to claim 7, wherein said placing step comprises the step of placing the blocking member close to the wafer chuck.
Claim 13
Dependent Claim
15 words
A method according to claim 7, wherein the photosensitive material comprises a magneto-optic recording material.
Claim 14
Dependent Claim
14 words
A method according to claim 7, wherein the photosensitive material comprises a photochromic material.
Claim 15
Dependent Claim
103 words
A method according to claim 7, further comprising the step of controlling the movement of the wafer chuck through the wafer stage, wherein said controlling step comprises the step of producing necessary data comprising the step of: illuminating the mask with the exposure light whereby, through a projection lens system, a mark of the mask is printed on the photosensitive material; photoelectrically detecting the printed image of the mark mask by using a mark detecting optical system, whereby a mask mark image signal is produced; and producing the necessary data, for the control of the wafer chuck movement, by using the produced signal.
Claim 16
Dependent Claim
23 words
A method according to claim 12, wherein the printed image of the mask mark on the photosensitive material is able to be erased.
Claim 17
Dependent Claim
140 words
A method according to claim 7, further comprising the step of controlling the movement of the wafer chuck through the wafer stage, wherein said controlling step comprises the step of producing necessary data comprising the steps of: detecting a mark of the wafer, whereby a wafer mark signal is produced; controlling the position of the wafer chuck on the basis of the wafer mark signal; illuminating the mask with the exposure light whereby, through a projective lens system, a mark of the mask is printed on the photosensitive material; photoelectrically detecting the printed image of the mask mark by using a mark detecting optical system, whereby a mask mark image signal is produced; and producing the necessary data, for the control of the wafer chuck movement, by using the produced wafer mark signal and the produced mask mark image signal.
Claim 18
Dependent Claim
23 words
A method according to claim 14, wherein the printed image of the mask mark on the photosensitive material is able to be erased.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-07-18 | 1998-01-17 | 1998-07-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-18 | 2002-01-17 | 2002-07-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-18 | 2006-01-17 | 2006-07-19 | $7700.00 | Window Closed / Lapsed |