Discrete die burn-in for non-packaged die

Claim 2

Discrete testing apparatus for testing a semiconductor device in die form, comprising: a) a first plate; b) a die-receiving cavity in the first plate; c) a second plate; d) means to secure the first and second plates together; e) an insulative substrate, separate from the first and second plates having a plurality of circuit traces thereon and dimensioned so as to fit within said die receiving cavity being received by the die receiving cavity prior to insertion of the die in a position juxtaposed to a face side of the die when the die is in the die receiving cavity, so that the insulative substrate is at least partially contained within the die receiving cavity when the first and second plates are secured together, and means to retain the insulative substrate is received in the die receiving cavity prior to placement of the die into the die receiving cavity; f) a plurality of contacts on the plurality of circuit traces, the contacts being positioned so that, when the first plate and the second plate are aligned and the die and the insulative substrate are positioned in the die-receiving cavity, the contacts are in alignment with contact locations on the die; g) connector terminals in an electrical communication with the plurality of contacts; and h) means to bias the die and the insulative substrate together when the first plate and the second plate are secured together, thereby causing the contacts to be maintained in electrical communication with said contact locations; i) the means to secure including a clamp, the clamp extending across at least one of the first and second plates to secure the first and second plates together, wherein when the first and second plates are secured together with the die in the die receiving cavity, a plurality of said contact locations are in electrical communication with the connector terminals.

Claim 3

Discrete testing apparatus as described in claim 1, further comprising: the connector terminals being positioned on the second plate so that, when the first plate and the second plate are aligned by the alignment means and the die and the insulative substrate are positioned in the die-receiving cavity, the plurality of contacts are in alignment with contact locations on the die.

Claim 4

Discrete testing apparatus as described in claim 2, further comprising: said clamp consisting of a clasp which may either be latched into place.

Claim 5

Discrete testing apparatus as described in claim 1, further comprising: the die receiving cavity having a biased platform therein, the biased platform exerting a biasing force against the die, the biasing force being sufficiently uniform to cause the die to establish contact with the plurality of contacts.

Claim 6

Discrete testing apparatus as described in claim 1, further comprising: means to bias die received in the die receiving cavity with the plurality of contacts after the first and second plates have been mated.

Claim 7

Discrete testing apparatus as described in claim 5, further comprising: the external connector leads being secured by the die cavity plate and terminating on the die cavity plate as contact pads, the contact pads being in approximate planar alignment with the contact location on the die.

Claim 8

Discrete testing apparatus as described in claim 1, further comprising: the plurality of contacts including contact pads which are in alignment with the die receiving cavity after the first and second plates have been mated.

Claim 9

Discrete testing apparatus as described in claim 1, further comprising: the plurality of contacts including a contact pads which are in alignment with the die receiving cavity after the first and second plates have been mated.

Claim 10

Discrete testing apparatus as described in claim 1, further comprising: said clamp consisting of a clasp which is latched into place.

Claim 11

Discrete testing apparatus for testing a semiconductor device in die form, comprising: a) a first plate; b) a die-receiving cavity in the first plate; c) a second plate; d) means to secure the first and second plates together; e) an insulative substrate, separate from the first and second plates having a plurality of circuit traces thereon and dimensioned so as to fit within said die receiving cavity in a position juxtaposed to a face side of the die when the die is in the die receiving cavity, so that the insulative substrate is at least partially contained within the die receiving cavity when the first and second plates are secured together; f) a plurality of contacts on the plurality of circuit traces, the contacts being positioned so that, when the first plate and the second plate are in alignment, and the die is positioned in the die-receiving cavity, the contacts are in alignment with contact locations on the die; g) connector terminals in electrical communication with the contacts; and h) means to bias the die and the insulative substrate together when the first plate and the second plate are secured together, thereby causing the contacts to be maintained in electrical communication with said contact locations; i) the means to secure including a clamp, the clamp extending across at least one of the first and second plates to secure the first and second plates together, wherein when the first and second plates are secured together with the die in the die receiving cavity, a plurality of said contact locations are in electrical communication with the connector terminals.

Claim 12

Discrete testing apparatus for testing a semiconductor device in die form, comprising: a) a first plate; b) a die-receiving cavity in the first plate; c) a second plate; d) means to secure the first and second plates together; e) an insulative substrate, separate from the first and second plates having a plurality of circuit traces thereon and dimensioned so as to fit within said die receiving cavity in a position juxtaposed to a face side of the die when the die is in the die receiving cavity, so that the insulative substrate is at least partially contained within the die receiving cavity when the first and second plates are secured together; f) a plurality of contacts on the plurality of circuit traces, the contacts being positioned so that, when the first plate and the second plate are in alignment, and the die is positioned in the die-receiving cavity, the contacts are in alignment with contact locations on the die; g) connector terminals in electrical communication with the contacts; and h) means to bias the die and the insulative substrate together when the first plate and the second plate are secured together, thereby causing the contacts to be maintained in electrical communication with said contact locations; i) the means to secure including a clamp, the clamp extending across at least one of the first and second plates to secure the first and second plates together, wherein when the first and second plates are secured together with the die in the die receiving cavity, a plurality of said contact locations are in electrical communication with the connector terminals.

Claim 13

Discrete testing apparatus as described in claim 10, further comprising: said plurality of contacts on the plurality of conductors being mounted to an insulative substrate, the insulative substrate being supported by the first and second plates when the first and second plates are secured together.

Claim 14

Discrete testing apparatus as described in claim 10, further comprising: a spacer plate which fits within the die receiving cavity and the die, and which precisely positions the die for subsequent alignment.

Claim 15

Discrete testing apparatus as described in claim 12, further comprising: a slot in the die cavity plate, for facilitating lifting the die out of the die receiving cavity.

Claim 16

Discrete testing apparatus as described in claim 10, further comprising: the connector terminals in electrical communication with the plurality of contacts comprising a plurality of external connector leads attached to the die cavity plate, and extending from the burn in fixture.

Claim 17

Discrete testing apparatus as described in claim 14, further comprising: said connector terminals extending from the burn in fixture in standard semiconductor package configuration.

Claim 18

Discrete testing apparatus as described in claim 10, further comprising: contact between the contact locations on the die for said electrical communication with the contact terminals being established by TAB (tape automated bonding) tape which is not bonded with the die at the contact locations.

Claim 19

Discrete testing apparatus as described in claim 10, further comprising: the plurality of contacts being conductive polymer contacts.

Claim 20

Discrete testing apparatus as described in claim 10, further comprising: the plurality of contacts being positioned on the insulative substrate so that, when the die and the insulative substrate are positioned in the die receiving cavity, the plurality of contacts are between the die and the second plate.

Claim 21

Discrete testing apparatus as described in claim 18, further comprising: the plurality of contacts being located in the die cavity housing.

Claim 22

Discrete testing apparatus as described in claim 10, further comprising: the plurality of contacts being conductive soft metal contacts.

Claim 23

Discrete testing apparatus as described in claim 18, further comprising: a) the plurality of contacts being positioned on the insulative substrate so that, when the die and the insulative substrate are positioned in the die receiving cavity, the plurality of contacts are between the die and the second plate; b) one of said first and second plates being a cover plate, the cover plate supporting said plurality of contacts; c) the first plate including a resilient compressible elastomeric strip, the rigid elastomeric strip biasing the plurality of contacts against the die, thereby establishing an ohmic contact between the die contact locations and the plurality of contacts.

Claim 24

Discrete testing apparatus as described in claim 10, further comprising: a) the cover plate including a dielectric cover; and b) the plurality of contacts being contact pins which are mounted to the dielectric cover.

Claim 25

Discrete testing apparatus as described in claim 10, further comprising: a) contact between the contact locations on the die for said electrical communication with the contact terminals being established by TAB (tape automated bonding) tape which is not bonded with the die at the contact locations; and b) the TAB tape extending beyond the confines of a fixture formed by the first and second plates and terminating in an external connector, the external connector including said connector terminals.

Claim 26

Discrete testing apparatus as described in claim 10, further comprising: the plurality of contacts including a flexible rods which extend into the die receiving cavity after the first and second plates have been mated.

Claim 27

Discrete testing apparatus as described in claim 10, further comprising: said clamp consisting of a clasp which is latched into place.

Claim 28

Discrete testing apparatus for testing a semiconductor device in die form, comprising: a) a first plate; b) a die-receiving cavity in the first plate; c) a second plate; d) means to secure the first and second plates together; e) an insulative substrate, separate from the first and second plates with a plurality of circuit traces thereon, the plurality of circuit traces being dimensioned so as to fit within said die receiving cavity adjacent to the die when the die is in the die receiving cavity, so that the insulative substrate is at least partially contained within the die receiving cavity when the first and second plates are secured together; f) a plurality of contacts on the plurality of circuit traces, the contacts being positioned so that, when the first plate and the second plate are in alignment, and the die is positioned in the die-receiving cavity, the contacts are in alignment with contact locations on the die; g) connector terminals in electrical communication with the contacts; and h) means to bias the die and the insulative substrate together when the first plate and the second plate are secured together, thereby causing the contacts to be maintained in electrical communication with said contact locations, contact between the contact locations on the die for said electrical communication with the connector terminals being established without bonding the contacts with the die at the contact locations; i) the second plate including a rigid cover plate and a resilient compressible elastomeric strip, said elastomeric strip biasing the insulative substrate against the die, thereby establishing an ohmic contact between the die contact locations and conductive traces on the insulative substrate; j) the means to secure including a clamp, the clamp extending across at least one of the first and second plates to secure the first and second plates together, wherein when the first and second plates are secured together with the die in the die receiving cavity, a plurality of said contact locations are in electrical communication with the connector terminals.

Claim 29

Discrete testing apparatus for testing a semiconductor device in die form, comprising: a) a first plate; b) a die-receiving cavity in the first plate; c) a second plate; d) means to secure the first and second plates together; e) an insulative substrate, separate from the first and second plates with a plurality of circuit traces thereon, the plurality of circuit traces being dimensioned so as to fit within said die receiving cavity adjacent to the die when the die is in the die receiving cavity, so that the insulative substrate is at least partially contained within the die receiving cavity when the first and second plates are secured together; f) a plurality of contacts on the plurality of circuit traces, the contacts being positioned so that, when the first plate and the second plate are in alignment, and the die is positioned in the die-receiving cavity, the contacts are in alignment with contact locations on the die; g) connector terminals in electrical communication with the contacts; and h) means to bias the die and the insulative substrate together when the first plate and the second plate are secured together, thereby causing the contacts to be maintained in electrical communication with said contact locations, contact between the contact locations on the die for said electrical communication with the connector terminals being established without bonding the contacts with the die at the contact locations; i) the second plate including a rigid cover plate and a resilient compressible elastomeric strip, said elastomeric strip biasing the insulative substrate against the die, thereby establishing an ohmic contact between the die contact locations and conductive traces on the insulative substrate; j) the means to secure including a clamp, the clamp extending across at least one of the first and second plates to secure the first and second plates together, wherein when the first and second plates are secured together with the die in the die receiving cavity, a plurality of said contact locations are in electrical communication with the connector terminals.

Claim 30

Discrete testing apparatus as described in claim 26, further comprising: the connector terminals being positioned on the second plate so that, when the first plate and the second plate are aligned by the alignment means and the die and the insulative substrate are positioned in the die-receiving cavity, the plurality of contacts are in alignment with contact locations on the die.

Claim 31

Discrete testing apparatus as described in claim 26, further comprising: the biasing force exerted by the biased platform being sufficiently uniform to cause the die to establish contact with the plurality of contacts.

Claim 32

Discrete testing apparatus as described in claim 26, further comprising: the plurality of contacts including contact pads which are in alignment with the die receiving cavity after the first and second plates have been mated.

Claim 33

Discrete testing apparatus as described in claim 26, further comprising: a spacer plate which fits within the die receiving cavity and the die, and which precisely positions the die for subsequent alignment.

Claim 34

Discrete testing apparatus as described in claim 30, further comprising: a slot in the die cavity plate, for facilitating lifting the die out of the die receiving cavity.

Claim 35

Discrete testing apparatus as described in claim 26, further comprising: the connector terminals in electrical communication with the plurality of contacts comprising a plurality of external connector leads attached to the die cavity plate, and extending from the burn in fixture.

Claim 36

Discrete testing apparatus as described in claim 32, further comprising: said connector terminals extending from the burn in fixture in a standard semiconductor package configuration.

Claim 37

Discrete testing apparatus as described in claim 26, further comprising: contact between the contact locations on the die for said electrical communication with the contact terminals being established by TAB (tape automated bonding) tape which is not bonded with the die at the contact locations.

Claim 38

Discrete testing apparatus as described in claim 34, further comprising: the second plate including a rigid cover plate and a resilient compressible elastomeric strip, the rigid elastomeric strip biasing the TAB tape against the die, thereby establishing an ohmic contact between the die contact locations and conductive traces on the TAB tape.

Claim 39

Discrete testing apparatus as described in claim 26, further comprising: the plurality of contacts being conductive polymer contacts.

Claim 40

Discrete testing apparatus as described in claim 26, further comprising: the plurality of contacts being positioned on the insulative substrate so that, when the die and the insulative substrate are positioned in the die receiving cavity, the plurality of contacts are between the die and the second plate.

Claim 41

Discrete testing apparatus as described in claim 37, further comprising: the plurality of contacts being located in the die cavity housing.

Claim 42

Discrete testing apparatus as described in claim 26, further comprising: the plurality of contacts being conductive soft metal contacts.

Claim 43

Discrete testing apparatus as described in claim 39, further comprising: the plurality of contacts being positioned on the insulative substrate so that, when the die and the insulative substrate are positioned in the die receiving cavity, the plurality of contacts are between the die and the second plate; b) the cover plate supports said plurality of contacts; and c) the first plate including a resilient compressible elastomeric strip, the rigid elastomeric strip biasing the plurality of contacts against the die, thereby establishing an ohmic contact between the die contact locations and the plurality of contacts.

Claim 44

Discrete testing apparatus as described in claim 26, further comprising: a) the cover plate including a dielectric cover; and b) the plurality of contacts being contact pins which are mounted to the dielectric cover.

Claim 45

Discrete testing apparatus as described in claim 26, further comprising: a) contact between the contact locations on the die for said electrical communication with the contact terminals being established by TAB (tape automated bonding) tape which is not bonded with the die at the contact locations; and b) the TAB tape extending beyond the confines of a fixture formed by the first and second plates and terminating in an external connector, the external connector including said connector terminals.

Claim 46

Discrete testing apparatus as described in claim 26, further comprising: said clamp consisting of a clasp which is latched into place.