US4822989A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and method of manufacturing thereof
Assignee: Hitachi Ltd
•
Filing: 1987-05-21
•
Granted: 1989-04-18
•
Expires: 2007-05-21
Abstract
Abstract This invention concerns a semiconductor device of a tape carrier type and a method of manufacturing the same, wherein electroconductive layers made of the same material as that of lead terminals are disposed so as to substantially surround the circumferential edge of a hole for containing an IC chip with a predetermined gap as barrier portions for controlling the flowing range or the coating range on a carrier tape before coagulation of the coating material when the surface of said IC chip after being inserted into the IC chip-containing hole and connected with the lead terminals is coated with the coating material. The steps formed with the surface of the carrier tape and the barrier portions which substantially surround the circumferential edge of the hole at a predetermined gap thereby results in controlling the flowing range of the coating material before coagulation, by which the coating region on the surface of the IC chip, etc. with the coating material is made uniform and the scattering in the film thickness is minimized.
Inventors
- 👤 Keiji Miyamoto
- 👤 Atsushi Nakamura
- 👤 Tsuneo Satoh
- 👤 Kazuo Kojima
- 👤 Masayuki Morita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:10
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; G06K19/07743; H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/699; H10W74/00
Claims Analysis
Total Claims: 47
Claim 1
Independent Claim
222 words
A semiconductor device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein there is further included a plurality of leads respectively extending from the surface of said wiring substrate to a portion above said hole and each being in contact with a corresponding one of said plurality of electrode pads of said IC chip which is contained within said hole, and barrier portions which are formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material.
Claim 2
Dependent Claim
222 words
A semiconductor device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein there is further included a plurality of leads respectively extending from the surface of said wiring substrate to a portion above said hole and each being in contact with a corresponding one of said plurality of electrode pads of said IC chip which is contained within said hole, and barrier portions which are formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material.
Claim 3
Dependent Claim
34 words
A semiconductor device according to claim 1, including a plurality of barrier portions disposed so as to surround the circumferential edge of said hole and being separated from said hole by a predetermined gap.
Claim 4
Dependent Claim
79 words
A semiconductor device according to claim 1, including a plurality of barrier portions disposed so as to surround the circumferential edge of said hole and being separated from said hole by a predetermined gap, and a plurality of lead terminals made of the same material as that of said barrier portions extending from said plurality of barrier portions to the inside of said hole and in contact with said IC chip so as to fixedly secure said IC chip.
Claim 5
Dependent Claim
31 words
A semiconductor device according to claim 1, wherein said barrier portions are made of the same material as that used for the wiring pattern at the surface of said wiring substrate.
Claim 6
Dependent Claim
16 words
A semiconductor device according to claim 1, wherein the wiring substrate is a tape carrier type.
Claim 7
Dependent Claim
17 words
A semiconductor device according to claim 1, wherein the surface protecting layer is made of epoxy resin.
Claim 8
Dependent Claim
234 words
A semiconductor device of a module structure incorporating a device having electric functions, said device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein there is further included a plurality of leads respectively extending from the surface of said wiring substrate to a portion above said hole and each being in contact with a corresponding one of said plurality of electrode pads of said IC chip which is contained within said hole, and barrier portions which are formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material.
Claim 9
Dependent Claim
234 words
A semiconductor device of a module structure incorporating a device having electric functions, said device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein there is further included a plurality of leads respectively extending from the surface of said wiring substrate to a portion above said hole and each being in contact with a corresponding one of said plurality of electrode pads of said IC chip which is contained within said hole, and barrier portions which are formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material.
Claim 10
Dependent Claim
34 words
A semiconductor device according to claim 7, including a plurality of barrier portions disposed so as to surround the circumferential edge of said hole and being separated from said hole by a predetermined gap.
Claim 11
Dependent Claim
79 words
A semiconductor device according to claim 7, including a plurality of barrier portions disposed so as to surround the circumferential edge of said hole and being separated from said hole by a predetermined gap, and a plurality of lead terminals made of the same material as that of said barrier portions extending from said plurality of barrier portions to the inside of said hole and in contact with said IC chip so as to fixedly secure said IC chip.
Claim 12
Dependent Claim
31 words
A semiconductor device according to claim 7, wherein the barrier portions are made of the same material as that used for the wiring pattern at the surface of the wiring substrate.
Claim 13
Dependent Claim
16 words
A semiconductor device according to claim 7, wherein the wiring substrate is a tape carrier type.
Claim 14
Dependent Claim
17 words
A semiconductor device according to claim 7, wherein the surface protecting layer is made of epoxy resin.
Claim 15
Dependent Claim
18 words
A semiconductor device according to claim 7, wherein the semiconductor device of module structure is an IC card.
Claim 16
Dependent Claim
20 words
A semiconductor device according to claim 7, wherein the semiconductor device of a module structure is a portable electronic calculator.
Claim 17
Dependent Claim
19 words
A semiconductor device according to claim 7, wherein the semiconductor device of a module structure is a wrist watch.
Claim 18
Dependent Claim
208 words
A semiconductor device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof being coated with a surface protecting layer made of resin, wherein there is further included a plurality of leads each extending from the surface of said wiring substrate to a portion above said hole and each being in contact with a corresponding one of said plurality of electrode pads of said IC chip which is contained within said hole, wherein the width of each one of the leads formed is broad and is such that the gap between each of the leads at the periphery of said hole is made smaller than the width of each of said leads.
Claim 19
Dependent Claim
208 words
A semiconductor device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof being coated with a surface protecting layer made of resin, wherein there is further included a plurality of leads each extending from the surface of said wiring substrate to a portion above said hole and each being in contact with a corresponding one of said plurality of electrode pads of said IC chip which is contained within said hole, wherein the width of each one of the leads formed is broad and is such that the gap between each of the leads at the periphery of said hole is made smaller than the width of each of said leads.
Claim 20
Dependent Claim
16 words
A semiconductor device according to claim 16, wherein the wiring substrate is a tape carrier type.
Claim 21
Dependent Claim
36 words
A semiconductor device according to claim 16, wherein the broad width portion of each of the leads extends as far as said portion above said hole formed for inserting the IC chip of the wiring substrate.
Claim 22
Dependent Claim
75 words
A semiconductor device according to claim 16, wherein the broad width portion of each of the leads is disposed at least as far as the periphery of the hole for inserting the IC chip in the wiring substrate, and wherein that portion of each of said leads extending as far as said portion above said hole having a smaller width than that portion of each lead adjacent to and beyond the periphery of said hole.
Claim 23
Dependent Claim
104 words
A semiconductor device according to claim 16, wherein the broad width portion of each of the leads is disposed at least as far as the periphery of the hole for inserting the IC chip in the wiring substrate, and wherein that portion of each said leads extending as far as said portion above said hole having a smaller width than that portion of each lead adjacent to and beyond the periphery of said hole, the boundary region between the broad width portion and the narrow width portion corresponding to each of said leads substantially defines the coating region for the surface protecting resin layer.
Claim 24
Dependent Claim
20 words
A semiconductor device as defined in claim 16, wherein the surface protecting layer made of resin is an epoxy resin.
Claim 25
Dependent Claim
220 words
A semiconductor device of a module structure incorporating a device having electric functions, said device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof being coated with a surface protecting layer made of resin, wherein there is further included a plurality of leads each extending from the surface of said wiring substrate to a portion above said hole and each being in contact with a corresponding one of said plurality of electrode pads of said IC chip which is contained within said hole, wherein the width of each one of the leads formed is broad and is such that the gap between each of the leads at the periphery of said hole is made smaller than the width of each of said leads.
Claim 26
Dependent Claim
220 words
A semiconductor device of a module structure incorporating a device having electric functions, said device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof being coated with a surface protecting layer made of resin, wherein there is further included a plurality of leads each extending from the surface of said wiring substrate to a portion above said hole and each being in contact with a corresponding one of said plurality of electrode pads of said IC chip which is contained within said hole, wherein the width of each one of the leads formed is broad and is such that the gap between each of the leads at the periphery of said hole is made smaller than the width of each of said leads.
Claim 27
Dependent Claim
19 words
A semiconductor device of module structure according to claim 22, wherein the wiring substrate is a tape carrier type.
Claim 28
Dependent Claim
19 words
A semiconductor device according to claim 22, wherein the semiconductor device of a module structure is an IC card.
Claim 29
Dependent Claim
20 words
A semiconductor device according to claim 22, wherein the semiconductor device of a module structure is a portable electronic calculator.
Claim 30
Dependent Claim
19 words
A semiconductor device according to claim 22, wherein the semiconductor device of a module structure is a wrist watch.
Claim 31
Independent Claim
171 words
A method of manufacturing a semiconductor device which comprises preparing a wiring substrate having a wiring pattern including a plurality of leads electrically connected with a plurality of electrode pads of an IC chip and wirings for electrically connecting said leads with external electrodes, formed at the surface of an insulation substrate, enhousing said IC chip into a hole formed for inserting said IC chip in said wiring substrate, electrically connecting a plurality of electrode pads of said IC chip with a plurality of leads of said wiring substrate, coating said IC chip and the peripheral region thereof, extending partly into said wiring substrate, with surface coating material made of resin and then applying heat treatment to cure said surface coating material thereby forming a surface protecting layer, wherein barrier portions are formed along the surface of the wiring substrate adjacent to the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said surface protection resin material at the surface of said wiring substrate before coagulation.
Claim 32
Independent Claim
171 words
A method of manufacturing a semiconductor device which comprises preparing a wiring substrate having a wiring pattern including a plurality of leads electrically connected with a plurality of electrode pads of an IC chip and wirings for electrically connecting said leads with external electrodes, formed at the surface of an insulation substrate, enhousing said IC chip into a hole formed for inserting said IC chip in said wiring substrate, electrically connecting a plurality of electrode pads of said IC chip with a plurality of leads of said wiring substrate, coating said IC chip and the peripheral region thereof, extending partly into said wiring substrate, with surface coating material made of resin and then applying heat treatment to cure said surface coating material thereby forming a surface protecting layer, wherein barrier portions are formed along the surface of the wiring substrate adjacent to the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said surface protection resin material at the surface of said wiring substrate before coagulation.
Claim 33
Dependent Claim
40 words
A method of manufacturing a semiconductor device according to claim 27, wherein a plurality of barrier portions are formed and are disposed so as to surround the circumferential edge of said hole and are separated therefrom by a predetermined gap.
Claim 34
Dependent Claim
80 words
A method of manufacturing a semiconductor device according to claim 27, wherein a plurality of barrier portions are formed and are disposed so as to surround the circumferential edge of said hole and are separated therefrom by a predetermined gap, and further including a plurality of lead terminals made of the same material as that of said barrier portions extending from said plurality of barrier portions to the inside of said hole and being fixedly secured to said IC chip.
Claim 35
Dependent Claim
35 words
A method of manufacturing a semiconductor device according to claim 27, wherein said barrier portions are made of the same material as that used for the wiring pattern at the surface of said wiring substrate.
Claim 36
Dependent Claim
20 words
A method of manufacturing a semiconductor device according to claim 27, wherein the wiring substrate is a tape carrier type.
Claim 37
Dependent Claim
21 words
A method of manufacturing a semiconductor device according to claim 27, wherein the surface protecting layer is made of epoxy resin.
Claim 38
Independent Claim
267 words
A method of manufacturing a semiconductor device of a module structure in which a device having a wiring substrate attached with an IC chip is incorporated into a substrate having an electrical function, by using the device having said wiring substrate attached with said IC chip of a structure comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation substrate and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, said plurality of electrode pads of said IC chip and said plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein there is further included a plurality of leads respectively extending from the surface of said wiring substrate to a portion above said hole and each being in contact with a corresponding one of said plurality of electrode pads of said IC chip which is contained within said hole, and barrier portions which are formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material.
Claim 39
Independent Claim
267 words
A method of manufacturing a semiconductor device of a module structure in which a device having a wiring substrate attached with an IC chip is incorporated into a substrate having an electrical function, by using the device having said wiring substrate attached with said IC chip of a structure comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation substrate and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, said plurality of electrode pads of said IC chip and said plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein there is further included a plurality of leads respectively extending from the surface of said wiring substrate to a portion above said hole and each being in contact with a corresponding one of said plurality of electrode pads of said IC chip which is contained within said hole, and barrier portions which are formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material.
Claim 40
Dependent Claim
38 words
A method of manufacturing a semiconductor device according to claim 33, including a plurality of barrier portions disposed so as to surround the circumferential edge of said hole and being separated from said hole by a predetermined gap.
Claim 41
Dependent Claim
83 words
A method of manufacturing a semiconductor device according to claim 33, including a plurality of barrier portions disposed so as to surround the circumferential edge of said hole and being separated from said hole by a predetermined gap, and a plurality of lead terminals made of the same material as that of said barrier portions extending from said plurality of barrier portions to the inside of said hole and in contact with said IC chip so as to fixedly secure said IC chip.
Claim 42
Dependent Claim
34 words
A method of manufacturing a semiconductor device according to claim 33, wherein said barrier portions are made of the same material as that used for wiring pattern at the surface of said wiring substrate.
Claim 43
Dependent Claim
20 words
A method of manufacturing a semiconductor device according to claim 33, wherein the wiring substrate is a tape carrier type.
Claim 44
Dependent Claim
21 words
A method of manufacturing a semiconductor device according to claim 33, wherein the surface protecting layer is made of epoxy resin.
Claim 45
Dependent Claim
23 words
A method of manufacturing a semiconductor device of a module structure according to claim 33, wherein the semiconductor device is an IC card.
Claim 46
Dependent Claim
24 words
A method of manufacturing a semiconductor device of a module structure according to claim 33, wherein the semiconductor device is a portable electronic calculator.
Claim 47
Dependent Claim
23 words
A method of manufacturing a semiconductor device of a module structure according to claim 33, wherein the semiconductor device is a wrist watch.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-04-17 | 1992-10-17 | 1993-04-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-04-17 | 1996-10-17 | 1997-04-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-04-17 | 2000-10-17 | 2001-04-18 | $7700.00 | Window Closed / Lapsed |