Abstract A multilayer identification card is equipped with an IC module. The module is arranged on a carrier element which is located in a recess in the multilayer card. The card layers bordering the recess bear supporting layers which are thermoresistant in the range of hot lamination temperatures. This prevents the recess from becoming filled with fluid card material during the hot laminating process, during which the card layers will soften and eventually become fluid. Thus, the IC module can advantageously give way within the recess when the card is bent. Further, the supporting layers have a stabilizing effect on the adjacent card layers and thereby prevent irregularities caused by incorporation of the carrier element from being passed onto the card surface. For these reasons, it is also possible to arrange the IC module or the carrier element which bears the module in the area of a magnetic stripe while preventing reading or writing processes from being disturbed by irregularities which would otherwise appear on the surface of the stripe.
A carrier element for incorporating an IC module in an identification card, the IC module being arranged on the carrier element together with its leads and contact surfaces, characterized wherein the carrier element is composed of two films, a first film having a window bearing the IC module which is connected to leads ending on the film, and a second film bearing, on its front and back surfaces, conductive coatings which are connected with each other in an electrically conductive manner by the second film.
Claim 2
Dependent Claim
85 words
A carrier element for incorporating an IC module in an identification card, the IC module being arranged on the carrier element together with its leads and contact surfaces, characterized wherein the carrier element is composed of two films, a first film having a window bearing the IC module which is connected to leads ending on the film, and a second film bearing, on its front and back surfaces, conductive coatings which are connected with each other in an electrically conductive manner by the second film.
Claim 3
Dependent Claim
33 words
A carrier element as in claim 1, wherein the leads of the first film bearing the module are connected with the coatings on the back of the second film by a soldering process.
Claim 4
Dependent Claim
21 words
A carrier element as in claim 1, wherein the IC module is connected with the second film by an adhesive layer.
Claim 5
Dependent Claim
31 words
A carrier element as in claim 1, wherein the thickness of an exterior one of said conductive coatings is related to the thickness of a varnish layer on the second film.