Patent US4727554A successfully refreshed from Google Patents.
US4727554A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Temperature controller for semiconductor devices
Assignee: Fujifilm Holdings Corp
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Filing: 1986-02-10
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Granted: 1988-02-23
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Expires: 2006-02-10
Abstract
Abstract A temperature controller includes a block-shaped heat sink in which a plurality of semiconductor devices to be controlled are mounted, a temperature sensor mounted in the heat sink, and a temperature controlling element mounted on the heat sink. The temperature sensor detects the temperature of the semiconductor devices through the heat sink, and the temperature controlling element responds to an output signal from the temperature sensor for controlling the temperature of the semiconductor devices through the heat sink so that the temperature will be substantially constant. Therefore, the semiconductor devices can be simultaneously controlled in temperature through the single temperature sensor and the single temperature controlling element.
Inventors
- 👤 Hideo Watanabe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:41
CPC Classifications
H; H10; H10W; H10W40/00
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
112 words
A temperature controller for controlling the temperature of a plurality of semiconductor devices, comprising: (i) a block-shaped heat sink in which the semiconductor devices are mounted, said semiconductor devices being arranged in spaced relation as a straight array in said heat sink: (ii) a temperature sensor mounted in said heat sink; and (iii) a temperature controlling device mounted on said heat sink and responsive to an output signal from said temperature sensor for controlling the temperature of the semiconductor devices so that the temperature will be substantially constant, wherein said temperature sensor and said temperature controlling element are positioned more closely to one of said semiconductor devices than the remaining semiconductor devices.
Claim 2
Dependent Claim
112 words
A temperature controller for controlling the temperature of a plurality of semiconductor devices, comprising: (i) a block-shaped heat sink in which the semiconductor devices are mounted, said semiconductor devices being arranged in spaced relation as a straight array in said heat sink: (ii) a temperature sensor mounted in said heat sink; and (iii) a temperature controlling device mounted on said heat sink and responsive to an output signal from said temperature sensor for controlling the temperature of the semiconductor devices so that the temperature will be substantially constant, wherein said temperature sensor and said temperature controlling element are positioned more closely to one of said semiconductor devices than the remaining semiconductor devices.
Claim 3
Dependent Claim
28 words
A temperature controller according to claim 1 wherein said block-shaped heat sink is of an elongate shape with said straight array extending longitudinally in said block-shaped heat sink.
Claim 4
Dependent Claim
18 words
A temperature controller according to claim 1, further comprising a heat-radiating fin mounted on said temperature controlling device.
Claim 5
Dependent Claim
16 words
A temperature controller according to claim 1, wherein said temperature controlling device comprises a Peltier-effect device.
Claim 6
Dependent Claim
92 words
A temperature controller for controlling the temperature of a plurality of semiconductor devices, comprising: (i) a block-shaped heat sink in which the semiconductor devices are mounted; (ii) a temperature sensor mounted in said heat sink; and (iii) a temperature controlling device mounted on said heat sink and responsive to an output signal from said temperature signal for controlling the temperature of the semiconductor devices so that the temperature will be substantially constant, wherein said temperature sensor and said temperature controlling device are positioned in equidistant relation to each of said semiconductor devices.
Claim 7
Dependent Claim
92 words
A temperature controller for controlling the temperature of a plurality of semiconductor devices, comprising: (i) a block-shaped heat sink in which the semiconductor devices are mounted; (ii) a temperature sensor mounted in said heat sink; and (iii) a temperature controlling device mounted on said heat sink and responsive to an output signal from said temperature signal for controlling the temperature of the semiconductor devices so that the temperature will be substantially constant, wherein said temperature sensor and said temperature controlling device are positioned in equidistant relation to each of said semiconductor devices.
Claim 8
Dependent Claim
18 words
A temperature controller according to claim 5, further comprising a heat-radiating fin mounted on said temperature controlling device.
Claim 9
Dependent Claim
16 words
A temperature controller according to claim 5, wherein said temperature controlling device comprises a Peltier-effect device.
Claim 10
Dependent Claim
40 words
A temperature controller according to claim 5, wherein said block-shaped heat sink is of a semicylindrical shape, said semiconductor devices being arranged as a semicircular array with said temperature controlling device being positioned at the center of the semicircular array.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-02-22 | 1991-08-24 | 1992-02-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-02-22 | 1995-08-24 | 1996-02-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-02-22 | 1999-08-24 | 2000-02-23 | $7700.00 | Window Closed / Lapsed |