Data card and method of manufacturing same

Claim 1

A data card comprising a lower covering film, an upper covering film and a card body positioned between said covering films, in which card body at least one semiconductor element is present and is connected to a carrier body which carrier body is provided on one or both surfaces thereof conductor tracks, characterized in that: (a) the carrier body (4) is a film which carries electric conductor tracks (11, 12) at one or both surfaces thereof and which carrier body is provided with at least one perforation (10) extending from the upper to the lower surface of said carrier body, in which perforation there is arranged a semiconductor element consituted by a semiconductor chip (5); (b) at least one surface of the semiconductor chip (5) is connected through wire connections (7) to the conductor tracks (11) on a surface of the carrier body (4); (c) the carrier body (4) carries on the surface thereof connected to the wire connections (7) a frame (8) having an upper side opening which surrounds the semiconductor chip and the wire connections and has a height such that the distance of the lower surface of the carrier body (4) to the upper side opening of the frame (8) is substantially equal to the thickness of the card body (3) and (d) the space inside the frame (8) is filled up to its upper side opening with a covering mass (9) enclosing the semiconductor chip (5) and the wire connections (7).

Claim 10

A method of manufacturing a data card comprising the steps: (a) providing a carrier body (4), constituted by a film, with electric conductor tracks (11) on the upper and the lower surface thereof; (b) forming a preforation (10) in said carrier body (4), extending from the upper to the lower surface thereof; (c) causing a film (6) to adhere to said lower surface; (d) inserting a semiconductor chip (5) in said perforation (10) in said carrier body (4) while causing said semiconductor chip (5) to adhere to said film (6); (e) forming wire connections (7) between said semiconductor chip (5) and said conductor tracks (11); (f) positioning a frame (8) on the surface of said carrier body (4) bearing the conductor tracks (11) joined to said wireconnections (7) in a manner such that said frame (8) surrounds said semiconductor chip (5) and said wire connectors (7) and adheres to said carrier body (4); (g) filling said frame (8) with a curable covering mass (9); (h) curing said covering mass (9); and (i) removing said film (6) from said lower surface.

Claim 11

A method of manufacturing a data card comprising the steps: (a) providing a carrier body (4), constituted by a film, with electric conductor tracks (11) on the upper and the lower surface thereof; (b) forming a preforation (10) in said carrier body (4), extending from the upper to the lower surface thereof; (c) causing a film (6) to adhere to said lower surface; (d) inserting a semiconductor chip (5) in said perforation (10) in said carrier body (4) while causing said semiconductor chip (5) to adhere to said film (6); (e) forming wire connections (7) between said semiconductor chip (5) and said conductor tracks (11); (f) positioning a frame (8) on the surface of said carrier body (4) bearing the conductor tracks (11) joined to said wireconnections (7) in a manner such that said frame (8) surrounds said semiconductor chip (5) and said wire connectors (7) and adheres to said carrier body (4); (g) filling said frame (8) with a curable covering mass (9); (h) curing said covering mass (9); and (i) removing said film (6) from said lower surface.