← Back to Patent Explorer
US4640747A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for surface treatment of copper product

Assignee: Mitsui Kinzoku Co Ltd
•
Filing: 1985-10-23
•
Granted: 1987-02-03
•
Expires: 2005-10-23
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A process for surface-treating copper products, for example, a copper foil to be used for a copper-clad laminate, the resulting surface-treated copper product having a superior bond strength to a base material, resistant to etching solution, acids, etc., is provided, which process comprises electrically depositing a binary alloy consisting of 95 to 20% by weight of zinc and 5 to 80% by weight of nickel, on the surface of a copper product to form a coating layer, followed by laminating the resulting copper product onto a base material under heating and pressure, said binary alloy being converted during the lamination into a ternary alloy of zinc, nickel and copper constituting a boundary layer having a superior bond strength between the copper product and the base material.

Inventors

  • 👤 Kuniki Ueno
  • 👤 Naotomi Takahashi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 14:04
CPC Classifications
C; C25; C25D; C25D5/00; C25D5/48; C25D5/50; C25D3/00; C25D3/02; C25D3/56; C25D3/562; C25D3/565; C25D5/10; C25D5/60; C25D5/605; C25D5/627; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/384; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K2203/11; H05K2203/1105; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 73 words
A process for surface-treating a copper product, which process comprises electrically depositing a binary alloy consisting of 95 to 20% by weight of zinc and 5 to 80% by weight of nickel, on the surface of a copper product to form a coating layer, followed by laminating or heat-pressing copper product thus obtained onto a base material so as to convert said binary alloy into a ternary alloy of zinc, nickel and copper.
Claim 2
Dependent Claim 73 words
A process for surface-treating a copper product, which process comprises electrically depositing a binary alloy consisting of 95 to 20% by weight of zinc and 5 to 80% by weight of nickel, on the surface of a copper product to form a coating layer, followed by laminating or heat-pressing copper product thus obtained onto a base material so as to convert said binary alloy into a ternary alloy of zinc, nickel and copper.
Claim 3
Dependent Claim 34 words
A process for surface-treating a copper product according to claim 1 wherein said surface of a copper product is a roughened surface formed by a granular copper layer electrically deposited on the copper product.
Claim 4
Dependent Claim 26 words
A process for surface-treating a copper product according to claim 2 wherein said copper product is a copper foil to be used for a copper-clad laminate.
Claim 5
Dependent Claim 23 words
A process for surface-treating a copper product according to claim 3 wherein said coating layer has a thickness of 0.001 to 0.15 μm.
Claim 6
Dependent Claim 23 words
A process for surface-treating a copper product according to claim 3 wherein said coating layer has a thickness of 0.001 to 0.01 μm.
Claim 7
Dependent Claim 32 words
A process for surface-treating a copper product according to claim 3 wherein said binary alloy consists of 90 to 50% by weight of zinc and 10 to 50% by weight of nickel.
Claim 8
Dependent Claim 35 words
A process for surface-treating a copper foil according to claim 1 wherein said electro-deposition of a binary alloy is carried out using an electrolyte containing as fundamental components, potassium pyrophosphate, zinc pyrophosphate and nickel pyrophosphate.

References Cited (Backward Citations)

US3377259A Cited
US3585010A Cited
US3857681A Cited
US4104134A Cited
US4189331A Cited
US4376154A Cited
US4268364A Cited
US4456508A Cited
US4469567A Cited
US4572768A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-02-02 1990-08-04 1991-02-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-02-02 1994-08-04 1995-02-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-02-02 1998-08-04 1999-02-03 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag