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US4640719A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for printed circuit board and/or printed wiring board cleaning

Assignee: Petroferm Inc
•
Filing: 1985-07-01
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Granted: 1987-02-03
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Expires: 2005-07-01
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Abstract

Abstract Methods and compositions are provided for the removal of rosin soldering flux and adhesive tape residues from printed circuit and/or wiring boards, and for testing the quality of curing of U.V.-cured soldermask on such boards. The compositions of the invention contain terpene compounds, preferably in combination with terpene emulsifying surfactants to facilitate removal by rinsing in water.

Inventors

  • 👤 Michael E. Hayes
  • 👤 Craig C. Hood
  • 👤 Ronald E. Miller
  • 👤 Robert Sharpe

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 08:12
CPC Classifications
C; C23; C23G; C23G5/00; C23G5/02; C23G5/024; C09; C09D; C09D9/00; H; H05; H05K; H05K3/00; H05K3/22; H05K3/26; H05K3/28; H05K3/288; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K2203/0779; H05K2203/0783; H05K2203/16; H05K2203/162; H05K3/30; H05K3/32; H05K3/34; H05K3/3452

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 73 words
A method for removing rosin soldering flux or adhesive tape residues from a printed wiring board, comprising (a) contacting the board with a composition comprising a terpene compound and from 0 to about 40% by weight of a terpene emulsifying surfactant; (b) allowing the contact to continue for sufficient time to solubilize the soldering flux or tape residues; and (c) removing the composition and solubilized soldering flux or tape residues from the board
Claim 2
Independent Claim 73 words
A method for removing rosin soldering flux or adhesive tape residues from a printed wiring board, comprising (a) contacting the board with a composition comprising a terpene compound and from 0 to about 40% by weight of a terpene emulsifying surfactant; (b) allowing the contact to continue for sufficient time to solubilize the soldering flux or tape residues; and (c) removing the composition and solubilized soldering flux or tape residues from the board
Claim 3
Dependent Claim 52 words
The method of claim 1 wherein the terpene emulsifying surfactant is selected from the group consisting of linear alkyl benzene sulfonates, linear or branched chain alcoholic ethoxylates and ethoxysulfates, polysorbate esters, alkyl and dialkyl succinate compounds, and ethoxylated alkylphenols, which ethoxylated alkylphenols have from about 5 to about 20 ethylene oxide groups.
Claim 4
Dependent Claim 26 words
The method of claim 2 wherein the terpene compound is selected from the group consisting of the d-form of limonene, the e-form of limonene and dipentene.
Claim 5
Dependent Claim 23 words
The method of claim 2 wherein the contact is carried out at a temperature of from about room temperature to about 150° F.
Claim 6
Dependent Claim 26 words
The method of claim 1 wherein the terpene compound is selected from the group consisting of the d-form of limonene, the e-form of limonene and dipentene.
Claim 7
Dependent Claim 17 words
The method of claim 5 wherein the terpene compound is the d-form or the e-form of limonene.
Claim 8
Dependent Claim 30 words
The method of claim 6 wherein the surfactant comprises by weight of the composition about 6.5% poly (7) ethoxy nonylphenol, 2.1% poly (10) ethoxy nonylphenol and 1.4% sodium dioctyl sulfosuccinate.
Claim 9
Dependent Claim 11 words
The method of claim 5 wherein the terpene compound is dipentene.
Claim 10
Dependent Claim 23 words
The method of claim 1 wherein the contact is carried out at a temperature of from about room temperature to about 150° F.

References Cited (Backward Citations)

US4246147A Cited
US4276186A Cited
US4294729A Cited
US4369287A Cited
US4373974A Cited
US4434084A Cited
US4511488A Cited
US4511488B1 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-02-02 1990-08-04 1991-02-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-02-02 1994-08-04 1995-02-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-02-02 1998-08-04 1999-02-03 $7700.00 Window Closed / Lapsed

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