Patent US4379728A successfully refreshed from Google Patents.
US4379728A
Expired / Lapsed
US
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Cyanourea compounds or polymers thereof as epoxy resin curing agents
Assignee: WR Grace and Co Conn
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Filing: 1982-02-04
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Granted: 1983-04-12
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Expires: 2002-02-04
Abstract
Abstract This invention is directed to latent thermal curing agents for epoxy resins comprising cyanourea compounds of the formula: <IMAGE> wherein R is the organic moiety of a mono- or poly-isocyanate remaining after reaction of the isocyanate group or groups to form cyanourea groups and n is 1 or more, preferably 1 to 2. The epoxy-curing agent system is stable at room temperature and cures at temperatures above 100 DEG C. to form a crosslinked, solid material suitable as an adhesive, sealant or coating. The polymeric form polymerized from dicyanourea compound can be dissolved in a solvent and admixed with an epoxy resin to form a thermoset adhesive, sealant or coating on heating above 100 DEG C. The polymeric form from the combination of cyanourea and dicyanourea or dicyanourea per se dissolving in epoxy resin also forms a thermosetting adhesive, sealant or coating on heating above 100 DEG C.
Inventors
- 👤 Shiow C. Lin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 16:43
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/4007; C08G59/4014; C08G59/4021; C08G18/00; C08G18/06; C08G18/08; C08G18/10; C08G2190/00
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
53 words
A heat curable composition comprising an epoxy resin and a cyanourea compound of the formula: ##STR12## wherein R is the organic moiety of a mono- or polyisocyanate remaining after reaction of the isocyanate groups to form cyanourea groups and n is 1 or more, the equivalent ratio of epoxide:N-cyanourea being 1 to 30:2.
Claim 2
Dependent Claim
53 words
A heat curable composition comprising an epoxy resin and a cyanourea compound of the formula: ##STR12## wherein R is the organic moiety of a mono- or polyisocyanate remaining after reaction of the isocyanate groups to form cyanourea groups and n is 1 or more, the equivalent ratio of epoxide:N-cyanourea being 1 to 30:2.
Claim 3
Dependent Claim
54 words
A heat curable composition comprising (1) an epoxy resin, and (2)a polymer having the following recurring structural units: ##STR13## wherein R is the organic moiety of a polyisocyanate remaining after reaction of the isocyanate groups to form cyanourea groups and m is at least 2, the equivalent ratio of epoxide:N-cyanourea being 1 to 30:2.
Claim 4
Dependent Claim
54 words
A heat curable composition comprising (1) an epoxy resin, and (2)a polymer having the following recurring structural units: ##STR13## wherein R is the organic moiety of a polyisocyanate remaining after reaction of the isocyanate groups to form cyanourea groups and m is at least 2, the equivalent ratio of epoxide:N-cyanourea being 1 to 30:2.
Claim 5
Dependent Claim
12 words
The composition of claim 1 also containing a solvent for the composition.
Claim 6
Dependent Claim
12 words
The composition of claim 2 also containing a solvent for the composition.
Claim 7
Dependent Claim
64 words
A process for forming a thermoset material which comprises heating an epoxy resin and a cyanourea compound of the formula: ##STR14## wherein R is the organic moiety of a mono- or polyisocyanate remaining after reaction of the isocyanate groups to form cyanourea groups and n is 1 or more at a temperature above 100° C., the equivalent ratio of epoxide:N-cyanourea being 1 to 30:2.
Claim 8
Dependent Claim
64 words
A process for forming a thermoset material which comprises heating an epoxy resin and a cyanourea compound of the formula: ##STR14## wherein R is the organic moiety of a mono- or polyisocyanate remaining after reaction of the isocyanate groups to form cyanourea groups and n is 1 or more at a temperature above 100° C., the equivalent ratio of epoxide:N-cyanourea being 1 to 30:2.
Claim 9
Dependent Claim
64 words
A process for forming a thermoset material which comprises heating an epoxy resin and a polymer having the following recurring structural units: ##STR15## wherein R is the organic moiety of a polyisocyanate remaining after reaction of the isocyanate groups to form cyanourea groups and m is at least 2 at a temperature above 100° C., the equivalent ratio of epoxide:N-cyanourea being 1 to 30:2.
Claim 10
Dependent Claim
64 words
A process for forming a thermoset material which comprises heating an epoxy resin and a polymer having the following recurring structural units: ##STR15## wherein R is the organic moiety of a polyisocyanate remaining after reaction of the isocyanate groups to form cyanourea groups and m is at least 2 at a temperature above 100° C., the equivalent ratio of epoxide:N-cyanourea being 1 to 30:2.
Claim 11
Dependent Claim
13 words
The process according to claim 5 wherein the composition also contains a solvent.
Claim 12
Dependent Claim
13 words
The process according to claim 6 wherein the composition also contains a solvent.
Claim 13
Dependent Claim
8 words
The composition of claim 1 as an adhesive.
Claim 14
Dependent Claim
8 words
The composition of claim 1 as a sealant.
Claim 15
Dependent Claim
8 words
The composition of claim 1 as a coating.
Claim 16
Dependent Claim
8 words
The composition of claim 2 as an adhesive.
Claim 17
Dependent Claim
8 words
The composition of claim 2 as a sealant.
Claim 18
Dependent Claim
8 words
The composition of claim 2 as a coating.
Claim 19
Dependent Claim
88 words
The process of adhering two substrates which comprises applying to at least one of said substrates a heat curable composition comprising an epoxy resin and a cyanourea compound of the formula: ##STR16## wherein R is the organic moiety of a mono- or polyisocyanate remaining after reaction of the isocyanate groups to form cyanourea groups and n is 1 or more, the equivalent ratio of epoxide:N-cyanourea being 1 to 30:2 contacting the substrates with the composition therebetween and heating the thus contacted substrates at a temperature above 100° C.
Claim 20
Dependent Claim
88 words
The process of adhering two substrates which comprises applying to at least one of said substrates a heat curable composition comprising an epoxy resin and a cyanourea compound of the formula: ##STR16## wherein R is the organic moiety of a mono- or polyisocyanate remaining after reaction of the isocyanate groups to form cyanourea groups and n is 1 or more, the equivalent ratio of epoxide:N-cyanourea being 1 to 30:2 contacting the substrates with the composition therebetween and heating the thus contacted substrates at a temperature above 100° C.
Claim 21
Dependent Claim
90 words
The process of adhering two substrates which comprises applying to at least one of said substrates a heat curable composition comprising (1) an epoxy resin, and (2) a polymer having the following recurring structural units: ##STR17## wherein R is the organic moiety of a polyisocyanate remaining after reaction of the isocyanate groups to form cyanourea groups and m is at least 2, the equivalent ratio of epoxide:N-cyanourea being 1 to 30:2 contacting the substrates with the composition therebetween and heating the thus contacted substrates at a temperature above 100° C.
Claim 22
Dependent Claim
90 words
The process of adhering two substrates which comprises applying to at least one of said substrates a heat curable composition comprising (1) an epoxy resin, and (2) a polymer having the following recurring structural units: ##STR17## wherein R is the organic moiety of a polyisocyanate remaining after reaction of the isocyanate groups to form cyanourea groups and m is at least 2, the equivalent ratio of epoxide:N-cyanourea being 1 to 30:2 contacting the substrates with the composition therebetween and heating the thus contacted substrates at a temperature above 100° C.
Claim 23
Dependent Claim
12 words
The process according to claim 15 wherein the composition contains a solvent.
Claim 24
Dependent Claim
12 words
The process according to claim 16 wherein the composition contains a solvent.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-04-11 | 1986-10-11 | 1987-04-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-04-11 | 1990-10-11 | 1991-04-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-04-11 | 1994-10-11 | 1995-04-12 | $7700.00 | Window Closed / Lapsed |