Patent US4374457A successfully refreshed from Google Patents.
US4374457A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of fabricating complex micro-circuit boards and substrates
Assignee: ENOMOTO INTERNATIONAL A CORP OF CA
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Filing: 1980-08-04
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Granted: 1983-02-22
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Expires: 2000-08-04
Abstract
Abstract A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in an aperture formed within a substrate and beneath the chips.
Inventors
- 👤 Raymond E. Wiech, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 04:45
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/101; H10; H10D; H10D62/00; H10D62/10; H10D62/117; H10W; H10W40/00; H10W40/10; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09118; H05K3/107; H10W70/682; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07353; H10W72/30; H10W72/331; H10W72/334; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/5366; H10W72/551; H10W72/552; H10W72/5524; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49155; Y10T29/49158
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
111 words
A method of making a substrate comprising the steps of: (a) providing a homogeneous composition formed of particulate material and binder, (b) molding said composition to a predetermined shape having a planar surface having portions on said surface wherein heat producing elements will be secured, (c) forming a continuous heat sink aperture region of predetermined geometry in said shape in a plane below the said surface of said shape and adjacent the said portions wherein heat producing elements will be secured, said aperture region extending to at least one surface of said shape, (d) removing at least a portion of said binder, and (e) sintering said shape after said binder removal.
Claim 2
Independent Claim
111 words
A method of making a substrate comprising the steps of: (a) providing a homogeneous composition formed of particulate material and binder, (b) molding said composition to a predetermined shape having a planar surface having portions on said surface wherein heat producing elements will be secured, (c) forming a continuous heat sink aperture region of predetermined geometry in said shape in a plane below the said surface of said shape and adjacent the said portions wherein heat producing elements will be secured, said aperture region extending to at least one surface of said shape, (d) removing at least a portion of said binder, and (e) sintering said shape after said binder removal.
Claim 3
Dependent Claim
21 words
A method as set forth in claim 1 further including the step of placing a heat sink material in said aperture.
Claim 4
Dependent Claim
28 words
A method as set forth in claim 1 further including forming grooves in said surface for receiving electrically conductive material in the bottom portions thereof in step (b).
Claim 5
Dependent Claim
21 words
A method as set forth in claim 3 further including the step of placing a heat sink material in said aperture.
Claim 6
Dependent Claim
40 words
A method of making a substrate as set forth in claim 3 including placing continuous electrically conductive material in the bottom portions of said grooves and extending upwardly in said grooves to a region below the tops of said grooves.
Claim 7
Dependent Claim
21 words
A method as set forth in claim 5 further including the step of placing a heat sink material in said aperture.
Claim 8
Dependent Claim
35 words
A method as set forth in claim 1 further including the step of forming at least one hole in said shape during step (b) passing from said surface to a further surface of said shape.
Claim 9
Dependent Claim
44 words
A method as set forth in claim 7 further including forming further regions of electrically conductive material on said surface and on said further surface and placing electrically conductive material in said hole to interconnect conductive material on said surface and said further surface.
Claim 10
Dependent Claim
21 words
A method as set forth in claim 7 further including the step of placing a heat sink material in said aperture.
Claim 11
Dependent Claim
44 words
A method as set forth in claim 9 further including forming further regions of electrically conductive material on said surface and on said further surface and placing electrically conductive material in said hole to interconnect conductive material on said surface and said further surface.
Claim 12
Dependent Claim
28 words
A method as set forth in claim 7 further including forming grooves in said surface for receiving electrically conductive material in the bottom portions thereof in step (b)
Claim 13
Dependent Claim
44 words
A method as set forth in claim 11 further including forming further regions of electrically conductive material on said surface and on said further surface and placing electrically conductive material in said hole to interconnect conductive material on said surface and said further surface.
Claim 14
Dependent Claim
41 words
A method as set forth in claim 12 wherein the heat producing element is a semiconductor chip, said chip being bonded to said surface and connecting a wire between said chip and said electrically conductive material in one of said grooves.
Claim 15
Dependent Claim
21 words
A method as set forth in claim 11 further including the step of placing a heat sink material in said aperture.
Claim 16
Dependent Claim
44 words
A method as set forth in claim 14 further including forming further regions of electrically conductive material on said surface and on said further surface and placing electrically conducting material in said hole to interconnect conductive material on said surface and said further surface.
Claim 17
Dependent Claim
40 words
A method of making a substrate as set forth in claim 11 including placing continuous electrically conductive material in the bottom portions of said grooves and extending upwardly in said grooves to a region below the tops of said grooves.
Claim 18
Dependent Claim
44 words
A method as set forth in claim 16 further including forming further regions of electrically conductive material on said surface and on said further surface and placing electrically conductive material in said hole to interconnect conductive material on said surface and said further surface.
Claim 19
Dependent Claim
21 words
A method as set forth in claim 16 further including the step of placing a heat sink material in said aperture.
Claim 20
Dependent Claim
44 words
A method as set forth in claim 18 further including forming further regions of electrically conductive material on said surface and on said further surface and placing electrically conductive material in said hole to interconnect conductive material on said surface and said further surface.
Claim 21
Dependent Claim
37 words
A method as set forth in claim 11 further including formation of a well in said surface adjacent said grooves during step (b) for receiving said heat producing elements, said heat sink aperture passing beneath said well.
Claim 22
Dependent Claim
44 words
A method as set forth in claim 20 further including forming further regions of electrically conductive material on said surface and on said further surface and placing electrically conductive material in said hole to interconnect conductive material on said surface and said further surface.
Claim 23
Dependent Claim
21 words
A method as set forth in claim 20 further including the step of placing a heat sink material in said aperture.
Claim 24
Dependent Claim
44 words
A method as set forth in claim 22 further including forming further regions of electrically conductive material on said surface and on said further surface and placing electrically conductive material on said hole to interconnect conductive material on said surface and said further surface.
Claim 25
Dependent Claim
39 words
A method of making substrates as set forth in claim 20 including placing continuous electrically conductive material in the bottom portions of said grooves and extending upwardly in said grooves to a region below the top of said grooves.
Claim 26
Dependent Claim
44 words
A method as set forth in claim 24 further including forming further regions of electrically conductive material on said surface and on said further surface and placing electrically conductive material in said hole to interconnect conductive material on said surface and said further surface.
Claim 27
Dependent Claim
21 words
A method as set forth in claim 24 further including the step of placing a heat sink material in said aperture.
Claim 28
Dependent Claim
44 words
A method as set forth in claim 26 further including forming further regions of electrically conductive material on said surface and on said further surface and placing electrically conductive material in said hole to interconnect conductive material on said surface and said further surface.
Claim 29
Dependent Claim
41 words
A method as set forth in claim 27 wherein the heat producing element in a semiconductor chip, said chip being bonded to said surface and connecting a wire between said chip and said electrically conductive material in one of said grooves.
References Cited (Backward Citations)
US3438127A
Cited
US4289719A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-02-21 | 1986-08-23 | 1987-02-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-02-21 | 1990-08-23 | 1991-02-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-02-21 | 1994-08-23 | 1995-02-22 | $7700.00 | Window Closed / Lapsed |