US4193849A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making a raw board for use in printed circuits
Assignee: Eneos Corp
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Filing: 1978-03-15
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Granted: 1980-03-18
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Expires: 1998-03-15
Abstract
Abstract There is disclosed a method of making a raw board for use in printed circuits, comprising the steps of subjecting a film of a plastic to vapor deposition with a metal and then electrochemically depositing a metal on the metal.
Inventors
- 👤 Junichi Sato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 18:04
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/14; H05K3/146
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
147 words
A method for making a raw board for use in printed circuits, comprising the steps of subjecting a very long film of a flexible plastic which can be easily rolled into a roll form to vapor deposition with a metal so as to vapor-deposit the metal directly onto the surface of the flexible film, and continuously immersing the flexible film in an electrochemical bath including as an additive a brightener which has its brightening effect only at a temperature between about 15° to 30° C., said bath being kept at a temperature between 50°-60° C. where said brightener has no brightening effect so that a metal is continuously electroplated on the surface of the metal previously vapor-deposited on the surface of the flexible film thereby to produce a flexible raw board for use in printed circuits with the raw board having approximately 1.5 kg/cm of peel strength.
Claim 2
Independent Claim
147 words
A method for making a raw board for use in printed circuits, comprising the steps of subjecting a very long film of a flexible plastic which can be easily rolled into a roll form to vapor deposition with a metal so as to vapor-deposit the metal directly onto the surface of the flexible film, and continuously immersing the flexible film in an electrochemical bath including as an additive a brightener which has its brightening effect only at a temperature between about 15° to 30° C., said bath being kept at a temperature between 50°-60° C. where said brightener has no brightening effect so that a metal is continuously electroplated on the surface of the metal previously vapor-deposited on the surface of the flexible film thereby to produce a flexible raw board for use in printed circuits with the raw board having approximately 1.5 kg/cm of peel strength.
Claim 3
Dependent Claim
21 words
The method of claim 1 wherein said plastic is selected from the group consisting of polyvinyl chloride, polyethylene telephthalate and polyimide.
Claim 4
Dependent Claim
31 words
The method of claim 1 wherein said metal to be vapor-deposited on said film is selected from the group consisting of Cu, Ni, Sn, an alloy thereof and a Cu-Zn alloy.
Claim 5
Dependent Claim
11 words
The method of claim 1 wherein said metal is used alone.
Claim 6
Dependent Claim
18 words
The method of claim 3 wherein said metal is used in a combination of at least two metals.
Claim 7
Dependent Claim
38 words
The method of claim 1 wherein said metal to be electro-chemically deposited on the surface of said vapor-deposited metal is at least one metal selected from the group consisting of Cu, Ni, Sn, Zn and an alloy thereof.
Claim 8
Dependent Claim
13 words
The method of claim 1 wherein said film is at least 200 m.
Claim 9
Independent Claim
132 words
A method for making a flexible laminate of plastic and copper for use in printed circuits, comprising: (a) subjecting a flexible plastic film to vapor deposition with copper so as to vapor-deposit a first layer of copper directly onto the surface of said film, said film being about 40 to 50μ in thickness and said first layer of copper being about 0.1μ to 0.3μ in thickness; (b) immersing said film and first copper layer into an electrochemical copper plating bath including a brightener as an additive, said bath being at a temperature of about 50° to 60° C., and plating a second layer of copper of about 10μ to 12μ in thickness onto said first copper layer, said copper layers having approximately 1.5 kg/cm of peel strength from said flexible plastic film.
Claim 10
Independent Claim
132 words
A method for making a flexible laminate of plastic and copper for use in printed circuits, comprising: (a) subjecting a flexible plastic film to vapor deposition with copper so as to vapor-deposit a first layer of copper directly onto the surface of said film, said film being about 40 to 50μ in thickness and said first layer of copper being about 0.1μ to 0.3μ in thickness; (b) immersing said film and first copper layer into an electrochemical copper plating bath including a brightener as an additive, said bath being at a temperature of about 50° to 60° C., and plating a second layer of copper of about 10μ to 12μ in thickness onto said first copper layer, said copper layers having approximately 1.5 kg/cm of peel strength from said flexible plastic film.
Claim 11
Dependent Claim
17 words
A flexible raw board for use in printed circuits as produced by the method of claim 1.
Claim 12
Dependent Claim
17 words
A flexible raw board for use in printed circuits as produced by the method of claim 8.
References Cited (Backward Citations)
US3702284A
Cited
US3901770A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-03-18 | 1983-09-17 | 1984-03-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-03-18 | 1987-09-17 | 1988-03-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-03-18 | 1991-09-17 | 1992-03-18 | $7700.00 | Window Closed / Lapsed |