US4150171A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electroless plating
Assignee: Surface Technology Inc
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Filing: 1978-04-05
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Granted: 1979-04-17
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Expires: 1998-04-05
Abstract
Abstract Dielectric or non-conductive substrates are electrolessly plated by contacting the surface of the substrate with aqueous solutions containing stannous and copper ions, the solutions being alternatively combined with a single solution, followed by contacting the surface of the substrate with a reducing agent capable of reducing the valence state of the copper ions. Systems of solutions useful in the practice of the aforesaid process are also disclosed.
Inventors
- 👤 Nathan Feldstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-22 16:30
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; C23C18/285; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1612; C23C18/2006; C23C18/2046; C23C18/2073; C23C18/208
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
66 words
A process for producing a metallic pattern on a substrate comprising the steps of (a) contacting said substrate with an aqueous solution of stannous ions; (b) drying said substrate; (c) oxidizing selected portions of said substrate; (d) contacting said substrate with an aqueous solution of copper ions; and (e) contacting said substrate with a reducing agent capable of reducing the valence state of said copper ions.
Claim 2
Dependent Claim
66 words
A process for producing a metallic pattern on a substrate comprising the steps of (a) contacting said substrate with an aqueous solution of stannous ions; (b) drying said substrate; (c) oxidizing selected portions of said substrate; (d) contacting said substrate with an aqueous solution of copper ions; and (e) contacting said substrate with a reducing agent capable of reducing the valence state of said copper ions.
Claim 3
Dependent Claim
13 words
The process of claim 1, wherein said oxidizing is effected with ultra-violet light.
Claim 4
Dependent Claim
39 words
A process for the preparation of a non-conductor prior to electroless metal deposition comprising the steps of (a) contacting said substrate with a composition comprising stannous ions, and (b) contacting the treated substrate with a composition comprising copper ions.
Claim 5
Dependent Claim
39 words
A process for the preparation of a non-conductor prior to electroless metal deposition comprising the steps of (a) contacting said substrate with a composition comprising stannous ions, and (b) contacting the treated substrate with a composition comprising copper ions.
Claim 6
Dependent Claim
14 words
The process according to claim 3 further containing the step of electroless metal deposition.
Claim 7
Dependent Claim
16 words
The process according to claim 3 wherein said copper ions are derived from a copper(I) compound.
Claim 8
Dependent Claim
16 words
The process according to claim 3 wherein said copper ions are derived from a copper(II) compound.
Claim 9
Dependent Claim
16 words
The process according to claim 3 wherein said composition comprising stannous ions further contains aged tin(IV).
Claim 10
Dependent Claim
44 words
The process according to claim 3 further containing the step of development which is prior to electroless metal deposition and wherein said development comprises a reducing composition capable of reducing the copper ions adsorbed onto the substrate to a lower or elemental oxidative state.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-04-16 | 1982-10-16 | 1983-04-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-04-16 | 1986-10-16 | 1987-04-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-04-16 | 1990-10-16 | 1991-04-17 | $7700.00 | Window Closed / Lapsed |