Photocurable imidizable polyene-polythiol compositions

Claim 2

An amide-acid polyene of the formula: ##STR26## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR27## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10.

Claim 3

An imide-containing polyene of the formula: ##STR28## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR29## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10.

Claim 4

An imide-containing polyene of the formula: ##STR28## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR29## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10.

Claim 7

The method according to claim 3 wherein the anhydride-containing member is an anhydride acid halide and the halide formed from reacting the anhydride acid halide with the ethylenically unsaturated alcohol is removed prior to reaction with the primary diamine.

Claim 8

The process of imidizing the amide-acid polyene of claim 1 which comprises heating said polyene at a temperature in the range 50°-250° C. for a time sufficient to cause imidization.

Claim 9

The process according to claim 7 wherein the imidization is carried out in an inert solvent for the amide-acid polyene at a temperature in the range 50°-150° C.

Claim 10

A photocurable composition comprising (A) an amide-acid containing polyene of the formula: ##STR32## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR33## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator.

Claim 11

A photocurable composition comprising (A) an amide-acid containing polyene of the formula: ##STR32## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR33## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator.

Claim 12

A photocurable composition comprising (A) an imide-containing polyene of the formula: ##STR34## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR35## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator.

Claim 13

A photocurable composition comprising (A) an imide-containing polyene of the formula: ##STR34## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR35## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator.

Claim 14

The process of forming a solid cured amide-acid containing polythioether which comprises admixing (A) a polyene of the formula: ##STR36## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR37## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator and, thereafter, exposing the mixture to actinic radiation.

Claim 15

The process of forming a solid cured amide-acid containing polythioether which comprises admixing (A) a polyene of the formula: ##STR36## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR37## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator and, thereafter, exposing the mixture to actinic radiation.

Claim 16

The process of forming a solid cured imide containing polythioether which comprises (1) admixing (A) a polyene of the formula: ##STR38## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR39## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator, then in either order (2) exposing said admixture to actinic radiation and (3) heating the admixture at a temperature in the range 50°-250° C. for a time sufficient to imidize the amide-acid in the polyene.

Claim 17

The process of forming a solid cured imide containing polythioether which comprises (1) admixing (A) a polyene of the formula: ##STR38## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR39## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator, then in either order (2) exposing said admixture to actinic radiation and (3) heating the admixture at a temperature in the range 50°-250° C. for a time sufficient to imidize the amide-acid in the polyene.

Claim 18

The process of forming a solid cured imide containing polythioether which comprises admixing (A) a polyene of the formula: ##STR40## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR41## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) 0.01-5% by weight of (A) and (B) of a pinacol of the general formula: ##STR42## wherein R 1 and R 3 are members independently selected from the group consisting of substituted and unsubstituted aromatic radicals, R 2 and R 4 are members independently selected from the group consisting of substituted and unsubstituted aliphatic and aromatic radicals and X and Y are members independently selected from the group consisting of hydroxyl, alkoxy and aryloxy and, thereafter, heating the admixture in the range 50°-250° C.

Claim 19

The process of forming a solid cured imide containing polythioether which comprises admixing (A) a polyene of the formula: ##STR40## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR41## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) 0.01-5% by weight of (A) and (B) of a pinacol of the general formula: ##STR42## wherein R 1 and R 3 are members independently selected from the group consisting of substituted and unsubstituted aromatic radicals, R 2 and R 4 are members independently selected from the group consisting of substituted and unsubstituted aliphatic and aromatic radicals and X and Y are members independently selected from the group consisting of hydroxyl, alkoxy and aryloxy and, thereafter, heating the admixture in the range 50°-250° C.

Claim 20

The process of forming a solid cured imide containing polythioether which comprises admixing (A) an imide containing polyene of the formula: ##STR43## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR44## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator, and, thereafter, exposing the mixture to actinic radiation.

Claim 21

The process of forming a solid cured imide containing polythioether which comprises admixing (A) an imide containing polyene of the formula: ##STR43## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR44## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator, and, thereafter, exposing the mixture to actinic radiation.

Claim 22

The process of forming a solid cured imide containing polythioether which comprises admixing (A) a polyene of the formula: ##STR45## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR46## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) 0.01-5% by weight of (A) and (B) of the pinacol of the general formula: ##STR47## wherein R 1 and R 3 are members independently selected from the group consisting of substituted and unsubstituted aromatic radicals, R 2 and R 4 are members independently selected from the group consisting of substituted and unsubstituted aliphatic and aromatic radicals and X and Y are members independently selected from the group consisting of hydroxyl, alkoxy and aryloxy and, thereafter, heating the admixture in the range 50°-250° C.

Claim 23

The process of forming a solid cured imide containing polythioether which comprises admixing (A) a polyene of the formula: ##STR45## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR46## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) 0.01-5% by weight of (A) and (B) of the pinacol of the general formula: ##STR47## wherein R 1 and R 3 are members independently selected from the group consisting of substituted and unsubstituted aromatic radicals, R 2 and R 4 are members independently selected from the group consisting of substituted and unsubstituted aliphatic and aromatic radicals and X and Y are members independently selected from the group consisting of hydroxyl, alkoxy and aryloxy and, thereafter, heating the admixture in the range 50°-250° C.

Claim 24

A photopolymerizable composition comprising (A) an imide-containing polyene of the formula: ##STR48## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR49## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10; and (B) a photocuring rate accelerator.

Claim 25

A photopolymerizable composition comprising (A) an imide-containing polyene of the formula: ##STR48## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR49## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10; and (B) a photocuring rate accelerator.

Claim 26

An article comprising the composition of claim 7 as a coating on a substrate.

Claim 27

The article according to claim 15 wherein the substrate is an electrical conductor.

Claim 28

An article comprising the composition of claim 8 as a coating on a substrate.

Claim 29

The article of claim 17 wherein the substrate is an electrical conductor.

Claim 30

The process of coating a substrate which comprises (1) applying to a substrate a curable composition comprising (A) an amide-acid containing polyene of the formula: ##STR50## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR51## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, then in either order (2) exposing said curable composition under ambient conditions to a free radical generator to form a solidified, cured polythioether coating on said substrate and (3) heating said cured composition in the range 50°-250° C. to imidize the polyene.

Claim 31

The process of coating a substrate which comprises (1) applying to a substrate a curable composition comprising (A) an amide-acid containing polyene of the formula: ##STR50## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR51## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, then in either order (2) exposing said curable composition under ambient conditions to a free radical generator to form a solidified, cured polythioether coating on said substrate and (3) heating said cured composition in the range 50°-250° C. to imidize the polyene.

Claim 32

The process according to claim 19 wherein the curable composition contains 0.005 to 50% by weight of the polyene and polythiol of said curable composition of a photocuring rate accelerator and the free radical generator is actinic radiation.

Claim 33

The process according to claim 19 wherein the free radical generator is high energy ionizing radiation.

Claim 34

A photopolymerizable composition comprising (A) an amide-acid containing polyene of the formula: ##STR52## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR53## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and (B) a photocuring rate accelerator.

Claim 35

A photopolymerizable composition comprising (A) an amide-acid containing polyene of the formula: ##STR52## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR53## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and (B) a photocuring rate accelerator.

Claim 36

The process of coating a substrate which comprises applying to a substrate a curable composition comprising (A) an amide-acid containing polyene of the formula: ##STR54## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of ##STR55## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and thereafter exposing said curable composition under ambient conditions to a free radical generator to form a solidified, cured polythioether coating on said substrate.

Claim 37

The process of coating a substrate which comprises applying to a substrate a curable composition comprising (A) an amide-acid containing polyene of the formula: ##STR54## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of ##STR55## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and thereafter exposing said curable composition under ambient conditions to a free radical generator to form a solidified, cured polythioether coating on said substrate.

Claim 38

The process according to claim 23 wherein the curable composition contains 0.005 to 50% by weight of the polyene and polythiol of said curable composition of a photocuring rate accelerator and the free radical generator is actinic radiation.

Claim 39

The process according to claim 23 wherein the free radical generator is high energy ionizing radiation.

Claim 40

A process for forming a continuous flexible adherent cured coating on the surface of an electrical conductor selected from the group consisting of wire and cable which comprises immersing said electrical conductor in a bath of a liquid radiation curable composition comprising (A) an amide-acid containing polyene of the formula: ##STR56## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of ##STR57## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and thereafter exposing said curable composition under ambient conditions to a free radical generator to form a solidified, cured polythioether coating on said substrate.

Claim 41

A process for forming a continuous flexible adherent cured coating on the surface of an electrical conductor selected from the group consisting of wire and cable which comprises immersing said electrical conductor in a bath of a liquid radiation curable composition comprising (A) an amide-acid containing polyene of the formula: ##STR56## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of ##STR57## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and thereafter exposing said curable composition under ambient conditions to a free radical generator to form a solidified, cured polythioether coating on said substrate.

Claim 42

The process according to claim 26 wherein the curable composition contains 0.005 to 50% by weight of the polyene and polythiol of said curable composition of a photocuring rate accelerator and the free radical generator is actinic radiation.

Claim 43

The process according to claim 26 wherein the free radical generator is high energy ionizing radiation.

Claim 44

The process of coating a substrate which comprises applying to a substrate a polymerizable composition comprising (A) an amide-acid containing polyene of the formula: ##STR58## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR59## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10 and exposing said compositions under ambient conditions to a free radical generator to form a solidified coating on said substrate.

Claim 45

The process of coating a substrate which comprises applying to a substrate a polymerizable composition comprising (A) an amide-acid containing polyene of the formula: ##STR58## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR59## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10 and exposing said compositions under ambient conditions to a free radical generator to form a solidified coating on said substrate.

Claim 46

The process according to claim 29 wherein the composition contains 0.005 to 50% by weight of the polyene of a photocuring rate accelerator and the free radical generator is actinic radiation.

Claim 47

The process according to claim 29 wherein the free radical generator is high energy ionizing radiation.

Claim 48

The process of coating a substrate which comprises applying to a substrate a polymerizable composition comprising (A) an amide-acid containing polyene of the formula: ##STR60## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR61## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and then in either order (2) exposing said curable composition under ambient conditions to a free radical generator to form a solidified, adherent coating on said substrate and (3) heating said cured composition in the range 50°-250° C. to imidize the polyene.

Claim 49

The process of coating a substrate which comprises applying to a substrate a polymerizable composition comprising (A) an amide-acid containing polyene of the formula: ##STR60## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR61## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and then in either order (2) exposing said curable composition under ambient conditions to a free radical generator to form a solidified, adherent coating on said substrate and (3) heating said cured composition in the range 50°-250° C. to imidize the polyene.

Claim 50

The process according to claim 32 wherein the composition contains 0.005 to 50% by weight of the polyene of a photocuring rate accelerator and the free radical generator is actinic radiation.

Claim 51

The process according to claim 32 wherein the free radical generator is high energy ionizing radiation.

Claim 52

A process for forming a continuous flexible adherent cured coating on the surface of an electrical conductor selected from the group consisting of wire and cable which comprises (1) immersing said electrical conductor in a bath of a liquid radiation curable composition comprising (A) an amide-acid containing polyene of the formula: ##STR62## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR63## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator, thus coating said electrical conductor with said composition, (2) passing said coated electrical conductor through a die, then in either order (3) exposing said coated electrical conductor to actinic radiation for a time sufficient to cure said coating on said electrical conductor under ambient conditions and (4) heating said coated electrical conductor in the range 50°-250° C. to imidize the polyene.

Claim 53

A process for forming a continuous flexible adherent cured coating on the surface of an electrical conductor selected from the group consisting of wire and cable which comprises (1) immersing said electrical conductor in a bath of a liquid radiation curable composition comprising (A) an amide-acid containing polyene of the formula: ##STR62## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is ##STR63## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator, thus coating said electrical conductor with said composition, (2) passing said coated electrical conductor through a die, then in either order (3) exposing said coated electrical conductor to actinic radiation for a time sufficient to cure said coating on said electrical conductor under ambient conditions and (4) heating said coated electrical conductor in the range 50°-250° C. to imidize the polyene.