Dual in-line chip extractor-exchanger apparatus

Claim 2

Apparatus for removing and replacing dual in-line solid state chips and like devices relative to printed wiring assemblies such as printed circuit boards, comprising: a first heat source, said first heat source comprising oppositely disposed heater elements, means to position said elements so that said elements straddle an individual chip effective when said heater elements are activated to release said chip from said board; a second heater source adjacent said first heat souce; means to position a printed circuit board between said first and second heat sources; means for energizing said first and second heat sources effective to release the attachment means securing said chips to said board; and cyclically operable means operably associated with said means to position the printed circuit board for detaching and removing a chip from said board upon release of the attachment means.

Claim 3

The invention in accordance with claim 1 wherein said means to position said printed circuit board comprises a demountable cam actuated work piece holder, means mounting said work piece holder adjacent to said printed circuit board permitting the work piece holder to grip said chip, means for reciprocably moving said work piece holder effective upon release of said chip detaching means to detach said chip from said board.

Claim 4

The invention in accordance with claim 2 wherein said work piece holder further includes cam means operably engageable with follower means for moving said work piece holder to a position enabling said work piece holder to insert a new chip into the position vacated by the removed chip.

Claim 5

Apparatus for removing and replacing dual in-line solid state chips and like devices relative to printed wiring assemblies such as printed circuit boards, comprising: a first heat source; a second heat source adjacent said first heat source; said second heat source comprising a high heat radiant energy means arranged to focus the heat output therefrom onto said printed circuit board effective when said energy source is energized to release the chip securing attachment means thereby releasing said chip for removal and extraction from said board; means to position a printed circuit board between said first and second heat sources; means for energizing said first and second heat sources so as to release the attachment means; and cyclically operable means operably associated with said means to position the printed circuit board for detaching and removing a chip from said board upon release of the attachment means.

Claim 6

Apparatus for removing and replacing dual in-line solid state chips and like devices relative to printed wiring assemblies such as printed circuit boards, comprising: a first heat source; a second heat source adjacent said first heat source; said second heat source comprising a high heat radiant energy means arranged to focus the heat output therefrom onto said printed circuit board effective when said energy source is energized to release the chip securing attachment means thereby releasing said chip for removal and extraction from said board; means to position a printed circuit board between said first and second heat sources; means for energizing said first and second heat sources so as to release the attachment means; and cyclically operable means operably associated with said means to position the printed circuit board for detaching and removing a chip from said board upon release of the attachment means.

Claim 7

Apparatus for removing and replacing dual-in-line solid state chips and like devices relative to printed wiring assemblies such as printed circuit boards comprising, a pair of parallel oriented heater members arranged to straddle a chip on one side circuit board assembly, a radiant energy heat source arranged to focus the heat energy against the attachment means of said chip on the opposite side of said printed wiring board, means to position said printed circuit chip carrying board between said parallel heater members, means for energizing said parallel heater members and said radiant energy heat source effective to release the attachment securing said chip to said board, cyclically operable means including a chip carrying workpiece holder operably engageable with said positioning means for detaching said chips and removing the same from said board, and means preventing the extraction of a chip from said board upon failure of the release of the chip attaching means.

Claim 8

Apparatus for removing and replacing dual-in-line solid state chips and like devices relative to printed wiring assemblies such as printed circuit boards comprising, a pair of parallel oriented heater members arranged to straddle a chip on one side circuit board assembly, a radiant energy heat source arranged to focus the heat energy against the attachment means of said chip on the opposite side of said printed wiring board, means to position said printed circuit chip carrying board between said parallel heater members, means for energizing said parallel heater members and said radiant energy heat source effective to release the attachment securing said chip to said board, cyclically operable means including a chip carrying workpiece holder operably engageable with said positioning means for detaching said chips and removing the same from said board, and means preventing the extraction of a chip from said board upon failure of the release of the chip attaching means.

Claim 9

The invention in accordance with claim 5 wherein said radiant energy heat source is adjustably positionable relative to said printed circuit board assembly so as to bring the focus of said energy adjacent to the chip attachment means effective to cause the chip attachment means to release upon energization of said heat energy source.

Claim 10

The invention in accordance with claim 6 wherein said radiant energy heat source is coupled to means for controllably timing the energization thereof in accordance with a preselected time sequence.

Claim 11

The invention in accordance with claim 5 wherein said means for preventing the extraction of a chip from said board comprises cam actuated switch means operably associated with said chip detaching means effective to cancel said chip extraction operation thereby avoiding damage to the chip and/or the board.

Claim 12

The invention in accordance with claim 5 wherein said means to position said printed circuit board between said heater means further comprises means mounting a chip inserting member and an attachment removal member thereon, said attachment removal member including means for forcing pressurized air into and through the apertures vacated by the chip connecting lugs effective to clear the printed circuit board of any attachment residue preparatory to receiving a fresh chip thereon.

Claim 13

The invention in accordance with claim 5 wherein said cyclically operable means operably engageable with said positioning means includes a first multiposition air actuated ram having spring return means for repositioning said ram, a second air actuated ram including latch means for cocking said chip detaching means in a home position, switch means controlling said heater means whereby upon release of said chip attachment means said latch is released enabling said first ram means to partially pull said chip from said board and upon chip release therefrom to enable said spring return means to totally remove said chip and position the chip carrying work piece holder to one side for insertion of a new chip.