Patent US3749823A successfully refreshed from Google Patents.
Patent US3937857A successfully refreshed from Google Patents.
US3937857A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Catalyst for electroless deposition of metals
Assignee: TE Connectivity Corp
•
Filing: 1974-07-22
•
Granted: 1976-02-10
•
Expires: 1994-07-22
Abstract
Abstract A solvent method for the metallization of a non-conductive surface with gold, nickel or copper is shown whereby on a substrate a thermosensitive coordination complex of palladium is deposited; the complex has the formula LmPdXn wherein L is a ligand or unsaturated organic radical, X is a halide, alkyl group or a bidentate ligand and m is an integer from 1 to 4 and n is from 0 to 3; trimethyl phosphite palladium dichloride complex is an appropriate illustration of the complex; the palladium complex is applied on the substrate in a suitable non-aqueous solution such as tetrahydrofuran solution; the complex is then baked in air at elevated temperature; the exposure to high temperature decomposes the complex leaving a residue which is catalytic to the deposition of gold, nickel, cobalt or copper from an electroless bath thereof; the non-conductive material is then immersed in an electroless bath to metallize the areas which have been rendered catalytic; the preferred thermosensitive coordination complex of palladium is trimethyl phosphite palladium dichloride; a requirement for a proper thermal exposure of the complex is that the substrate is capable of withstanding the elevated temperatures such as above 210°C; illustrative organic substrates are polyimides, polysulfones, silicones, vulcanizates, fluoroplastics, polyphenylene sulfides, polyparabanic acids, and polyhydantoin, etc.
Inventors
- 👤 Charles Roscoe Brummett
- 👤 Ray Ned Shaak
- 👤 Daniel Marshall Andrews
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 16:52
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; C23C18/30; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12389; Y10T428/12396; Y10T428/12493; Y10T428/12535; Y10T428/12556; Y10T428/12569
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
150 words
A method for the decomposition of a metal into an inert substrate from a bath containing said metal, said metal comprising the steps of: applying to said substrate a thin film of a thermally decomposable complex of palladium or platimum having the formulae LmPdXn or LmPtXn wherein L is a ligand or an unsaturated organic group; Pd or Pt is palladium or platinum metal; X is a halide, an alkyl group or a bidentate ligand; and m is from 1 to 4 and n is from 0 to 3; exposing said substrate to which said complex has been applied to heat at a temperature of about 300°C and less to effect decomposition of said complex and to create a residue catalytic to a metal in an electroless bath solution; and depositing a metal from said electroless bath on said substrate in an area rendered catalytic by decomposition of said complex.
Claim 2
Independent Claim
150 words
A method for the decomposition of a metal into an inert substrate from a bath containing said metal, said metal comprising the steps of: applying to said substrate a thin film of a thermally decomposable complex of palladium or platimum having the formulae LmPdXn or LmPtXn wherein L is a ligand or an unsaturated organic group; Pd or Pt is palladium or platinum metal; X is a halide, an alkyl group or a bidentate ligand; and m is from 1 to 4 and n is from 0 to 3; exposing said substrate to which said complex has been applied to heat at a temperature of about 300°C and less to effect decomposition of said complex and to create a residue catalytic to a metal in an electroless bath solution; and depositing a metal from said electroless bath on said substrate in an area rendered catalytic by decomposition of said complex.
Claim 3
Dependent Claim
15 words
The process as defined in claim 1 and wherein the complex is bis-trimethylphosphite palladium dichloride.
Claim 4
Dependent Claim
65 words
The method as defined in claim 1 and wherein said ligand L is a phosphine moiety, a phosphite moiety; a nitrile moiety; a diene moiety; a diamine, a tetramine; diethanol alkyl amine; or a triethanol alkyl amine; X is a halide, i.e., chloride, bromide, or iodide, an alkyl group of 1 to 6 carbon atoms, or a bidentate ligand of oxalate, succinate, citrate or borohydride.
Claim 5
Dependent Claim
37 words
As an article of manufacture, a polyimide film having a circuit pattern thereon defined by an electroless metal deposit and as catalyst for said electroless deposit a thermal decomposition product of a complex defined in claim 1.
Claim 6
Independent Claim
100 words
A method for the metallization of a non-conductive substrate with nickel, cobalt, gold or copper comprising the steps of: a. applying to said substrate a thermally sensitive, coordination complex of palladium or platinum having the formula LmPdXn or LmPtXm b. forming residue catalytic to electroless nickel, cobalt, gold or copper on said substrate by decomposing the said complex at a temperature from 210°C to 300°C; and immersing said substrate in an electroless solution of nickel, cobalt, gold or copper and depositing nickel, cobalt, gold or copper therefrom on the catalytic film formed by decomposition of said palladium or platinum complex.
Claim 7
Independent Claim
100 words
A method for the metallization of a non-conductive substrate with nickel, cobalt, gold or copper comprising the steps of: a. applying to said substrate a thermally sensitive, coordination complex of palladium or platinum having the formula LmPdXn or LmPtXm b. forming residue catalytic to electroless nickel, cobalt, gold or copper on said substrate by decomposing the said complex at a temperature from 210°C to 300°C; and immersing said substrate in an electroless solution of nickel, cobalt, gold or copper and depositing nickel, cobalt, gold or copper therefrom on the catalytic film formed by decomposition of said palladium or platinum complex.
Claim 8
Dependent Claim
16 words
A process as recited in claim 5 wherein the palladium complex is trimethyl phosphite palladium dichloride.
Claim 9
Dependent Claim
37 words
A process as recited in claim 5 wherein the said substrate after application of said complex and electroless metal in a nickel, cobalt, or copper electroless bath solution is masked and exposed to further additive electroless deposition.
Claim 10
Dependent Claim
32 words
A process as recited in claim 7 wherein said substrate after said further additive deposition is stripped of said mask and back etched in areas wherein said electroless metal has been deposited.
Claim 11
Independent Claim
119 words
A method for the preparation of an inert substrate to electroless deposition of a metal upon said substrate comprising the steps of: a. applying to said substrate a thin film of a thermally decomposable coordination complex of palladium having the formula LmPdXn wherein L = a ligand or unsaturated organic group, Pd is metal palladium and X = a halide, alkyl group or bidentate ligand, m is an integer from 1 to 4 and n is from 0 to 3, and b. exposing said substrate to which said complex has been applied, to heat, at a temperature of about 300°C and less, to effect decomposition of said complex and create residue catalytic to a metal in an electroless bath.
Claim 12
Independent Claim
119 words
A method for the preparation of an inert substrate to electroless deposition of a metal upon said substrate comprising the steps of: a. applying to said substrate a thin film of a thermally decomposable coordination complex of palladium having the formula LmPdXn wherein L = a ligand or unsaturated organic group, Pd is metal palladium and X = a halide, alkyl group or bidentate ligand, m is an integer from 1 to 4 and n is from 0 to 3, and b. exposing said substrate to which said complex has been applied, to heat, at a temperature of about 300°C and less, to effect decomposition of said complex and create residue catalytic to a metal in an electroless bath.
Claim 13
Dependent Claim
15 words
The process as defined in claim 9 and wherein the complex is bis-trimethylphosphite palladium dichloride.
Claim 14
Dependent Claim
14 words
A process as recited in claim 9 wherein said complex is bis-triphenylphosphine palladium dimethyl.
Claim 15
Dependent Claim
14 words
A process as recited in claim 9 wherein said complex is bis-tri-n-butylphosphine palladium dichloride.
Claim 16
Dependent Claim
13 words
A process as recited in claim 9 wherein said complex is palladium acetylacetonate.
Claim 17
Dependent Claim
19 words
The process as defined in claim 9 and wherein the substrate is etched before applying said complex to same.
Claim 18
Dependent Claim
116 words
The process as defined in claim 9 and wherein a complex or a mixture of complexes is applied to said substrate and said complex is bis-triphenylphosphine palladium dichloride; bis-triphenylphosphine dimethyl palladium; bis(triphenylphosphine) di(secondarybutyl) palladium; bis-triphenylphosphine palladium oxalate; bis-triphenylphosphine palladium borohydride; bis-triphenylphosphine palladium diamine; tris-triphenylphosphine palladium chloride; tetrakis-triphenylphosphine palladium (0); bis-triethyl phosphine or bis-tri-n-butyl phosphine palladium chloride or the dialkyl, oxalate, and borohydride bidentate substituents of said complex; bis-trimethylphosphite palladium dichloride or the dialkyl oxalate, succinate, citrate, and borohydride bidentate substituent of said complex; bis-benzonitrile, palladium dichloride; bis-acetonitrile palladium dichloride, 1,3-butadiene palladium dichloride; bis-triethylene tetramine palladium dichloride or bis-triethylene tetramine palladium oxalate, or mixtures thereof; said alkyl moieties, defined above, being from 1 to 6 carbon atoms.
Claim 19
Dependent Claim
109 words
The method as defined in claim 9 and wherein the ligand is a phosphite or phosphine substituted with (a) aromatic mono or polynuclear groups, (b) an alkyl group or mixed alkyl group of 1 to 10 carbon atoms in said alkyl group; an aromatic nitrile, an aliphatic nitrile, said aromatic or aliphatic group having from 1 up to 8 carbon atoms in said nitrile moiety; an aliphatic diene of 4 to 8 carbon atoms; an alicyclic diene, an alkylene diamine or a tetramine of 2 to 4 carbon atoms in the alkylene portion thereof; or triethanol or diethanol alkylamine of 1 to 4 carbon atoms in the alkyl group.
Claim 20
Dependent Claim
37 words
As an article of manufacture a nonconductive substrate having a circuit pattern thereon defined by an electroless metal deposit and as catalyst for said electroless deposit a thermal decomposition product of the complex defined in claim 9.
Claim 21
Dependent Claim
19 words
The article of manufacture as defined in claim 17 with an electrolytic overplate on said catalyst and electroless deposit.
Claim 22
Dependent Claim
18 words
The article of manufacture as defined in claim 17 and wherein the complex is trimethyl phosphite palladium dichloride.
Claim 23
Dependent Claim
37 words
As an article of manufacture, a polyimide film having a circuit pattern thereon defined by an electroless metal deposit and as catalyst for said electroless deposit a thermal decomposition product of a complex defined in claim 9.
References Cited (Backward Citations)
US3370973A
Cited
US3509624A
Cited
US3684534A
Cited
US3704156A
Cited
US3697319A
Cited
US3767538A
Cited
US3745095A
Cited
US3767583A
Cited
US3791848A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-02-09 | 1979-08-11 | 1980-02-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-02-09 | 1983-08-11 | 1984-02-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-02-09 | 1987-08-11 | 1988-02-10 | $7700.00 | Window Closed / Lapsed |