Patent US3825353A successfully refreshed from Google Patents.
US3825353A
Expired / Lapsed
US
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Mounting leads and method of fabrication
Assignee: Microsystems International Ltd
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Filing: 1972-07-12
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Granted: 1974-07-23
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Expires: 1992-07-12
Abstract
Abstract A beam terminal for a semiconductor chip which does not cantilever outwardly from the chip, and which extends no further than the boundary thereof. The beam terminal is adherent to the chip at one position, allowing the remainder thereof to flex with applied stress. The beam terminalled chip thus may be handled using economical mass production techniques.
Inventors
- 👤 A Loro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:34
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/60; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
75 words
A terminal for a semiconductor device comprising a terminal anchor region on the surface of a semiconductor chip, a conductive beam terminal adherent to the anchor region, the beam terminal having a pliant arm portion non-adherent to the surface extending over another portion of the chip, its boundary extending no further than the boundary of the chip, and a connection pad region on the surface of said arm a predetermined distance from the anchor region.
Claim 2
Dependent Claim
75 words
A terminal for a semiconductor device comprising a terminal anchor region on the surface of a semiconductor chip, a conductive beam terminal adherent to the anchor region, the beam terminal having a pliant arm portion non-adherent to the surface extending over another portion of the chip, its boundary extending no further than the boundary of the chip, and a connection pad region on the surface of said arm a predetermined distance from the anchor region.
Claim 3
Dependent Claim
19 words
A terminal as defined in claim 1 further comprising a raised land extending upwardly from said connection pad region.
Claim 4
Dependent Claim
35 words
A terminal as defined in claim 2, in which the arm portion is comprised of a tab extending in one direction from the anchor region, the raised land being disposed at the opposite end thereof.
Claim 5
Dependent Claim
34 words
A terminal as defined in claim 2, in which the arm portion is comprised of a plate adherent at a position centrally thereof to the anchor region, the raised land bordering within its periphery.
Claim 6
Dependent Claim
19 words
A terminal as defined in claim 3 in which the tab and the land are both comprised of gold.
Claim 7
Dependent Claim
50 words
A terminal as defined in claim 5, further including successive layers of a metal chosen from the group consisting of nickel and silver; platinum, and titanium between the beam terminal and the anchor region, and successive layers of said metal and titanium underlying the arm portion of the beam lead.
Claim 8
Dependent Claim
40 words
A terminal as defined in claim 5, further including successive layers of nickel and aluminum underlying the anchor region of the beam terminal and successive layers of nickel, silicon dioxide and aluminum underlying the arm portion of the beam lead.
Claim 9
Dependent Claim
32 words
A terminal as defined in claim 3, further including a metallized conduction path of the semiconductor device extending along the surface, located between the tab and the nearest edge of the chip.
Claim 10
Dependent Claim
90 words
Means for mounting a semiconductor device to a substrate comprising a semiconductor chip, a beam terminal adherent at a selected position to the semiconductor device and generally non-adherent at all other positions, the beam terminal extending no further than the edge of the chip, and having a connection pad region on the surface of the beam terminal a distance from said selected position, a substrate having a terminal pad in mirror juxtaposed position to the connection pad region, and means for bonding the connection pad region to the terminal pad.
Claim 11
Dependent Claim
90 words
Means for mounting a semiconductor device to a substrate comprising a semiconductor chip, a beam terminal adherent at a selected position to the semiconductor device and generally non-adherent at all other positions, the beam terminal extending no further than the edge of the chip, and having a connection pad region on the surface of the beam terminal a distance from said selected position, a substrate having a terminal pad in mirror juxtaposed position to the connection pad region, and means for bonding the connection pad region to the terminal pad.
Claim 12
Dependent Claim
31 words
A mounting means as defined in claim 9 in which said means for bonding is comprised of a gold promontory malleably sandwiched between the connection pad region and the terminal pad.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-07-22 | 1978-01-21 | 1978-07-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-07-22 | 1982-01-21 | 1982-07-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-07-22 | 1986-01-21 | 1986-07-23 | $7700.00 | Window Closed / Lapsed |