Patent US5137509A successfully refreshed from Google Patents.
Patent US3805117A successfully refreshed from Google Patents.
US3805117A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hybrid electron device containing semiconductor chips
Assignee: RCA Corp
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Filing: 1972-12-12
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Granted: 1974-04-16
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Expires: 1992-12-12
Abstract
Abstract The device includes a sub-assembly comprising a solid member of insulating material and a number of electronic devices disposed within openings through the solid member. Lead wires of the components extend outwardly of the openings and into holes through a pair of printed circuit board members mounted on opposite sides of the solid member, the lead wires being soldered to various conductive paths on the circuit boards. Spring clips are used to clamp the circuit boards against the solid member, the clips being soldered to various ones of the conductive paths. Semiconductor chips are mounted on the circuit boards after the solder operations, and the sub-assembly is mounted on the terminal leads of a header by welding the leads to various ones of the spring clips.
Inventors
- 👤 E Hausman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 10:07
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/145; H10; H10W; H10W90/00
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
131 words
An electronic device comprising: a member of insulating material having a pair of sUrfaces, and spaced apart openings through said member between said surfaces, electronic components disposed within said openings and having lead wires extending beyond said member from said openings, a pair of circuit boards at least one having a pattern of conductive paths on a surface thereof and openings through said board intersecting various ones of said paths, said boards being mounted on said member surfaces with said lead wires extending into said board openings and being electrically connected to various ones of said paths, spring clips clamping said boards against said insulating member, said clips being electrically connected to different ones of said conductive paths, and terminal leads for said device bonded to different ones of said clips.
Claim 2
Dependent Claim
131 words
An electronic device comprising: a member of insulating material having a pair of sUrfaces, and spaced apart openings through said member between said surfaces, electronic components disposed within said openings and having lead wires extending beyond said member from said openings, a pair of circuit boards at least one having a pattern of conductive paths on a surface thereof and openings through said board intersecting various ones of said paths, said boards being mounted on said member surfaces with said lead wires extending into said board openings and being electrically connected to various ones of said paths, spring clips clamping said boards against said insulating member, said clips being electrically connected to different ones of said conductive paths, and terminal leads for said device bonded to different ones of said clips.
Claim 3
Independent Claim
102 words
A method of assembling an electron device comprising: providing a sub-assembly by disposing various electrical components within openings through an insulating member, threading lead wires of said components through openings of circuit board members having conductive paths intersected by said board openings, clamping said circuit boards against said member, and soldering said lead wires to said conductive paths, and thereafter mounting semiconductor chips on at least one of said boards, electrically connecting said chips with various ones of said conductive paths by processes other than soldering processes and providing terminal connections to said conductive paths using bonding processes other than soldering processes.
Claim 4
Independent Claim
102 words
A method of assembling an electron device comprising: providing a sub-assembly by disposing various electrical components within openings through an insulating member, threading lead wires of said components through openings of circuit board members having conductive paths intersected by said board openings, clamping said circuit boards against said member, and soldering said lead wires to said conductive paths, and thereafter mounting semiconductor chips on at least one of said boards, electrically connecting said chips with various ones of said conductive paths by processes other than soldering processes and providing terminal connections to said conductive paths using bonding processes other than soldering processes.
Claim 5
Dependent Claim
52 words
A method as in claim 2 wherein said clamping step comprises disposing compressive spring clips about the periphery of said boards, said connecting step comprises bonding fine wires between said semiconductor chips and said conductive paths, and said terminal providing step comprises welding terminal leads to various ones of said spring clips.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-04-15 | 1977-10-15 | 1978-04-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-04-15 | 1981-10-15 | 1982-04-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-04-15 | 1985-10-15 | 1986-04-16 | $7700.00 | Window Closed / Lapsed |