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US3798762A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit board processing
Assignee: United States Department of the Army
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Filing: 1972-08-14
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Granted: 1974-03-26
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Expires: 1992-08-14
Abstract
Abstract A method of making a multilayer printed circuit board and subsequent mounting of the printed circuit board to a carrier without compromising the electric properties and optimizing the mechanical characteristics of the assembly.
Inventors
- 👤 Harris Norman
- 👤 Thomas John
- 👤 Isaak Harlan
- 👤 J Kanz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 20:04
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4664; H05K3/4667; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
123 words
A method of making a large area multilayer printed circuit structure comprising: a. providing a straight and flat substrate material, b. screen printing a first conductor circuit on said substrate and allowing said first conductor to dry, c. firing said first conductor layer, d. screen printing a double layer of dielectric material over said first conductor and allowing said dielectric to dry after each printing of said dielectric, e. printing a second conductor circuit over said first dielectric and said first conductor and allowing said second conductor to dry, f. co-firing said first dielectric and second conductor, g. repeating steps d, e, and f until the desired number of conductor-dielectric layers have been printed, and h. solder coating the last and exposed conductor.
Claim 2
Independent Claim
123 words
A method of making a large area multilayer printed circuit structure comprising: a. providing a straight and flat substrate material, b. screen printing a first conductor circuit on said substrate and allowing said first conductor to dry, c. firing said first conductor layer, d. screen printing a double layer of dielectric material over said first conductor and allowing said dielectric to dry after each printing of said dielectric, e. printing a second conductor circuit over said first dielectric and said first conductor and allowing said second conductor to dry, f. co-firing said first dielectric and second conductor, g. repeating steps d, e, and f until the desired number of conductor-dielectric layers have been printed, and h. solder coating the last and exposed conductor.
Claim 3
Dependent Claim
35 words
A method of making a multilayer structure as set forth in claim 1, wherein said substrate is alumina, wherein said last printed conductor is platinum-gold and wherein the other of said printed conductors are gold.
Claim 4
Dependent Claim
94 words
A method of making a multilayer structure as set forth in claim 1, wherein said substrate has holes therethrough, and said method comprising filling said holes with a gold conductor and allowing to dry, firing said gold conductor that fills said holes, screen printing a ground plane conductor on a bottom side of said substrate and allowing said ground plane to dry, firing said ground plane, screen printing a double layer of dielectric material over said ground plane and allowing each layer of said dielectric to dry, and firing said double layer of dielectric.
Claim 5
Dependent Claim
55 words
A method of making a multilayer structure as set forth in claim 1, wherein said repeated steps of screen printing the dielectric involves first printing two layers of dielectric with via''s therein, screen printing the via''s with conductor material, and then screen printing layers of dielectric before screen printing of the printed circuit conductor layer.
Claim 6
Dependent Claim
28 words
The method of fabricating a multilayer structure as set forth in claim 1, where said substrate is alumina and is annealed at a temperature of approximately 1,400* C.
Claim 7
Dependent Claim
25 words
The method of fabricating a multilayer structure as set forth in claim 1, said method further comprising bonding said substrate to a molybdenum support plate.
Claim 8
Dependent Claim
32 words
The method of fabricating a multilayer structure as set forth in claim 1, wherein components are bonded to the top surface of the multilayer structure and then interconnected to the exposed condUctor.
Claim 9
Dependent Claim
50 words
A method of making a multilayer structure as set forth in claim 1, wherein said screen printing is done using a screen printer that has a ramp at the end of the substrate to cause the screen to breakaway as the squeegee of the screen printer travels up the ramp.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-03-25 | 1977-09-24 | 1978-03-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-03-25 | 1981-09-24 | 1982-03-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-03-25 | 1985-09-24 | 1986-03-26 | $7700.00 | Window Closed / Lapsed |