Electronic package header system having omni-directional heat dissipation characteristic

Claim 1

An electronic package header system for an electronic component of the type that is cooled by a fluid coolant passing over major surfaces thereof, said header system having a substantially uniform heat transfer coefficient and omnidirectional heat dissipating characteristics and comprising in combination: a main body portion of non-conductive material and defining a plate-like member having opposite first and second major surfaces, an electronic component mounted on the first major surface of said main body portion, said main body portion including a plurality of selectively oriented, spaced projections of non-conductive material integrally formed on and extending outwardly from the second major surface thereof and defining a unitary one piece structure therewith, said projections being so arranged as to produce relatively high turbulence of the flow of a fluid coolant passing over surfaces thereof to provide enhanced heat dissipating characteristics for said main body portion, a bonding pad selectively positioned on the first major surface of said main body portion, said electronic component being secured to said bonding pad in fixed relation to the first major surface of said main body portion, and a plurality of spaced flat conductor members selectively formed on and fixed to the first major surface of said main body portion in contiguous engagement therewith, said plurality of flat conductor members being selectively electrically connected to said electronic component and extending along the first major surface of said main body portion beyond the outer marginal edge thereof for selective electrical connection to adjacent external components so as to electrically interconnect said electronic component thereto.

Claim 7

A system of electronic packages of the type that is cooled by a fluid coolant passing over major surfaces of said packages comprising in combination: a main housing having intake means and exhaust means; means connected to said intake means for providing a flow of fluid coolant through said main housing to said exhaust means; a plurality of printed circuit boards fixedly secured within said main housing in spaced parallel relation to each other and including openings therethrough to provide for the flow of fluid coolant across each of said printed circuit boards in a path of flow extending between said intake means and said exhaust means of said main housing; a plurality of electronic packages affixed to said plurality of printed circuit boards and disposed in the path of flow to be taken by the fluid coolant in passing through said main housing; and each of said electronic packages including a header system having a substantially uniform heat transfer coefficient and omni-directional heat dissipating characteristics; each of said header systems including a main body portion of nonconductive material in the form of a plate-like member having opposite first and second major surfaces, an electronic component mounted on the first major surface of said main body portion, said main body portion including a plurality of selectively oriented, spaced projections of non-conductive material integrally formed on and extending outwardly from the second major surface thereof and defining a unitary one piece structure therewith, said projections being so arranged as to produce relatively high turbulance of fluid coolant flow thereacross for enhancing the heat dissipating characteristics of said main body portion, a bonding pad selectively positioned on the first major surface os said main body portion, said electronic component being secured to said bonding pad in fixed relation to the first major surface of said main body portion, and a plurality of spaced flat conductor members selectively formed on and fixed to the first major surface of said main body portion in contiguous engagement therewith, and extending thereacross beyond the marginal edge thereof so as to include respective conductor portions disposed outwardly with respect to the marginal edge of said main body portion, said flat conductor members providing selective electrical connections between said electronic component and at least one circuit element of one of said printed circuit boards so as to electrically interconnect said electronic component thereto.

Claim 8

A system of electronic packages of the type that is cooled by a fluid coolant passing over major surfaces of said packages comprising in combination: a main housing having intake means and exhaust means; means connected to said intake means for providing a flow of fluid coolant through said main housing to said exhaust means; a plurality of printed circuit boards fixedly secured within said main housing in spaced parallel relation to each other and including openings therethrough to provide for the flow of fluid coolant across each of said printed circuit boards in a path of flow extending between said intake means and said exhaust means of said main housing; a plurality of electronic packages affixed to said plurality of printed circuit boards and disposed in the path of flow to be taken by the fluid coolant in passing through said main housing; and each of said electronic packages including a header system having a substantially uniform heat transfer coefficient and omni-directional heat dissipating characteristics; each of said header systems including a main body portion of nonconductive material in the form of a plate-like member having opposite first and second major surfaces, an electronic component mounted on the first major surface of said main body portion, said main body portion including a plurality of selectively oriented, spaced projections of non-conductive material integrally formed on and extending outwardly from the second major surface thereof and defining a unitary one piece structure therewith, said projections being so arranged as to produce relatively high turbulance of fluid coolant flow thereacross for enhancing the heat dissipating characteristics of said main body portion, a bonding pad selectively positioned on the first major surface os said main body portion, said electronic component being secured to said bonding pad in fixed relation to the first major surface of said main body portion, and a plurality of spaced flat conductor members selectively formed on and fixed to the first major surface of said main body portion in contiguous engagement therewith, and extending thereacross beyond the marginal edge thereof so as to include respective conductor portions disposed outwardly with respect to the marginal edge of said main body portion, said flat conductor members providing selective electrical connections between said electronic component and at least one circuit element of one of said printed circuit boards so as to electrically interconnect said electronic component thereto.