Method of forming an electroplatable microporous film with exposed metal particles within the pores
Abstract
Abstract Rendering non-conductive substrates electroplatable by firmly bonding and uniting thereto an electroplate-receptive coating comprising a film-forming thermoplastic organic polymer and electrically conductive metallic particles having a largest dimension in the range of about 0.02 to 50 microns, the solids portion of the coating comprising at least about 20 percent by volume of a film-forming polymer and at least about 25 percent by volume of metallic particles, the coating further having a microporous structure to a depth of at least about 1 micron from the exposed surface thereof, and this microporous structure having about 40 to 90 percent open space, with the major portion of the open space being provided by pores with a largest dimension between about 0.1 to 15 microns, and with the metallic particles exposed in this microporous structure.
Inventors
- 👤 R Cross
- 👤 A Testa
- 👤 R Thompson
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
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