US3768157A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process of manufacture of semiconductor product
Assignee: Northrop Grumman Space and Mission Systems Corp
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Filing: 1971-03-31
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Granted: 1973-10-30
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Expires: 1991-03-31
Abstract
Abstract This invention relates to a process of resistor adjustment and to a semiconductor microelectronic device package, wherein a window cap or other optically transparent access means is provided in a flat pack or similar structure for such purposes as the post fabrication adjustment of microcircuit resistors by light from a source such as a laser. By providing an optically transparent cover for an integrated or thin film circuit package, post fabrication adjustment of elements such as thin film resistors by intense optical radiation is possible. The cap or window, which may be any optically transparent means suitable to the particular structure, permits a seal to be made immediately after completion of fabrication of the circuitry so as to preclude contamination by moisture or dirt. Thereafter, resistance values are adjusted by means of a focused laser beam and, if desired, an opaque paint may then be applied to the window cap to exclude radiation which might lead to spurious photo-electric effects.
Inventors
- 👤 J Buie
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 16:39
CPC Classifications
H; H10; H10W; H10W90/00; H10P; H10P95/00; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/60; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49087; Y10T29/49099
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
85 words
A method of packaging a microelectronic circuit device having thin-film resistors deposited on a surface thereof, comprising: hermetically sealing said device within a container provided with an optically transparent window portion spaced from the thin-film resistors so that said thin film resistors are exposed through said window portion; and while said device is hermetically sealed, adjusting the electrical resistance of said thin-film resistors to predetermiNed values by exposing them to radiation transmitted through said window portion from a laser source positioned outside of said container.
Claim 2
Independent Claim
85 words
A method of packaging a microelectronic circuit device having thin-film resistors deposited on a surface thereof, comprising: hermetically sealing said device within a container provided with an optically transparent window portion spaced from the thin-film resistors so that said thin film resistors are exposed through said window portion; and while said device is hermetically sealed, adjusting the electrical resistance of said thin-film resistors to predetermiNed values by exposing them to radiation transmitted through said window portion from a laser source positioned outside of said container.
Claim 3
Independent Claim
113 words
A method of packaging a microelectronic circuit device having a subsurface and an opposing active surface, upon which active surface thin-film resistors are deposited, comprising: mounting said device with its subsurface on the base portion of an open container; hermetically closing said container with an optically transparent member spaced from the active surface of said device so as to leave said thin-film resistors optically exposed through said member to the exterior of said container; and irradiating said thin-film resistors with a laser beam directed through said transparent member from a source positioned exteriorly of said container to adjust the resistance of said thin-film resistors to predetermined values while said device is hermetically sealed.
Claim 4
Independent Claim
113 words
A method of packaging a microelectronic circuit device having a subsurface and an opposing active surface, upon which active surface thin-film resistors are deposited, comprising: mounting said device with its subsurface on the base portion of an open container; hermetically closing said container with an optically transparent member spaced from the active surface of said device so as to leave said thin-film resistors optically exposed through said member to the exterior of said container; and irradiating said thin-film resistors with a laser beam directed through said transparent member from a source positioned exteriorly of said container to adjust the resistance of said thin-film resistors to predetermined values while said device is hermetically sealed.
Claim 5
Independent Claim
195 words
A method of packaging a semiconductor chip having a lower mounting surface and an upper active surface, said upper active surface containing microcircuitry that includes thin-film resistors, said method comprising: providing a flat pack including a base portion having an upper mounting surface and a peripheral upstanding lid portion encircling said base portion, said lid portion having a height greater than the thickness of said semiconductor chip; mounting said semiconductor chip with its lower mounting surface down upon the upper mounting surface of said flat pack so that said lid portion extends above the upper active surface of said semiconductor chip; sealing an optically transparent member across the upper extremity of said lid portion to hermetically enclose said semiconductor chip within said flat pack with the active surface of said semiconductor chip spaced from said transparent member so as to optically expose said thin-film resistors to the exterior of said sealed flat pack; and while said semiconductor chip is hermetically sealed irradiating said thin-film resistors with optical radiation transmitted through said optically transparent member from a laser source positioned outside said sealed flat pack to adjust the resistance of said thin-film resistors to predetermined values.
Claim 6
Independent Claim
195 words
A method of packaging a semiconductor chip having a lower mounting surface and an upper active surface, said upper active surface containing microcircuitry that includes thin-film resistors, said method comprising: providing a flat pack including a base portion having an upper mounting surface and a peripheral upstanding lid portion encircling said base portion, said lid portion having a height greater than the thickness of said semiconductor chip; mounting said semiconductor chip with its lower mounting surface down upon the upper mounting surface of said flat pack so that said lid portion extends above the upper active surface of said semiconductor chip; sealing an optically transparent member across the upper extremity of said lid portion to hermetically enclose said semiconductor chip within said flat pack with the active surface of said semiconductor chip spaced from said transparent member so as to optically expose said thin-film resistors to the exterior of said sealed flat pack; and while said semiconductor chip is hermetically sealed irradiating said thin-film resistors with optical radiation transmitted through said optically transparent member from a laser source positioned outside said sealed flat pack to adjust the resistance of said thin-film resistors to predetermined values.
Claim 7
Dependent Claim
51 words
The invention according to claim 3, wherein said flat pack is made of a metal alloy, said transparent member is a thin plate of glass having a coefficient of thermal expansion matching that of said metal alloy, and said transparent member is sealed to said flat pack by a glass-to-metal seal.
Claim 8
Dependent Claim
16 words
The invention according to claim 4, wherein said thin-film resistors are made of a cermet composition.
Claim 9
Dependent Claim
20 words
The invention according to claim 5, wherein said thin-film resistors are made of a mixture of chromium and silicon monoxide.
Claim 10
Independent Claim
218 words
A method of packaging a semiconductor chip having a lower mounting surface and an upper active surface, said upper active surface containing microcircuitry that includes thin-film resistors, said method comprising: providing a flat pack including a base portion having an upper mounting surface and a peripheral upstanding lid portion encircling said base portion, said lid portion having a height greater than the thickness of said semiconductor chip; mounting said semiconductor chip with its lower mounting surface down upon the upper mounting surface of said flat pack so that said lid portion extends above the upper active surface of said semiconductor chip; sealing an optically transparent member across the upper extremity of said lid portion to hermetically enclose said semiconductor chip within said flat pack with the active surface of said semiconductor chip spaced from said transparent member so as to optically expose said thin-film resistors to the exterior of said sealed flat pack; while said semiconductor chip is hermetically sealed irradiating said thin-film resistors with optical radiation transmitted through said optically transparent member from a laser source positioned outside said sealed flat Pack to adjust the resistance of said thin-film resistors to predetermined values; and applying an opaque layer to the external surface of said transparent member after said thin-film resistors have been irradiated by said laser source.
Claim 11
Independent Claim
218 words
A method of packaging a semiconductor chip having a lower mounting surface and an upper active surface, said upper active surface containing microcircuitry that includes thin-film resistors, said method comprising: providing a flat pack including a base portion having an upper mounting surface and a peripheral upstanding lid portion encircling said base portion, said lid portion having a height greater than the thickness of said semiconductor chip; mounting said semiconductor chip with its lower mounting surface down upon the upper mounting surface of said flat pack so that said lid portion extends above the upper active surface of said semiconductor chip; sealing an optically transparent member across the upper extremity of said lid portion to hermetically enclose said semiconductor chip within said flat pack with the active surface of said semiconductor chip spaced from said transparent member so as to optically expose said thin-film resistors to the exterior of said sealed flat pack; while said semiconductor chip is hermetically sealed irradiating said thin-film resistors with optical radiation transmitted through said optically transparent member from a laser source positioned outside said sealed flat Pack to adjust the resistance of said thin-film resistors to predetermined values; and applying an opaque layer to the external surface of said transparent member after said thin-film resistors have been irradiated by said laser source.
Claim 12
Dependent Claim
99 words
A process of adjusting resistor values in a microelectronic circuit device comprising: fabricating a microelectronic circuit device including a resistor; mounting said device in an open packaging means; hermetically sealing said packaging means with a member having optically transparent access means positioned to mechanically protect said device while permitting optical access thereto; said member having a coefficient of thermal expansion matching that of said packaging means; and focusing optical radiation on a preselected resistor in said device hermetically sealed within said packaging means to adjust the resistance value thereof by transmitting said radiation through said optically transparent access means.
Claim 13
Dependent Claim
99 words
A process of adjusting resistor values in a microelectronic circuit device comprising: fabricating a microelectronic circuit device including a resistor; mounting said device in an open packaging means; hermetically sealing said packaging means with a member having optically transparent access means positioned to mechanically protect said device while permitting optical access thereto; said member having a coefficient of thermal expansion matching that of said packaging means; and focusing optical radiation on a preselected resistor in said device hermetically sealed within said packaging means to adjust the resistance value thereof by transmitting said radiation through said optically transparent access means.
Claim 14
Dependent Claim
99 words
A process of adjusting resistor values in a microelectronic circuit device comprising: fabricating a semiconductor microelectronic circuit device having a thin-film resistor deposited thereon; mounting said device in an open generally flat packaging means; hermetically sealing said packaging means with a member having optically transparent access means and coefficient of thermal expansion matching that of said packaging means; and focusing radiation from a laser on a preselected portion of said thin-film resistor in said hermetically sealed microelectronic circuit device to adjust the resistance value thereof by transmitting said radiation through said optically transparent access means to said thin-film resistor.
Claim 15
Dependent Claim
99 words
A process of adjusting resistor values in a microelectronic circuit device comprising: fabricating a semiconductor microelectronic circuit device having a thin-film resistor deposited thereon; mounting said device in an open generally flat packaging means; hermetically sealing said packaging means with a member having optically transparent access means and coefficient of thermal expansion matching that of said packaging means; and focusing radiation from a laser on a preselected portion of said thin-film resistor in said hermetically sealed microelectronic circuit device to adjust the resistance value thereof by transmitting said radiation through said optically transparent access means to said thin-film resistor.
Claim 16
Dependent Claim
115 words
A process of adjusting resistor values in a microelectronic circuit device comprising: fabricating a semiconductor microelectronic circuit device having a thin-film resistor deposited thereon; mounting said device in an open generally flat packaging means; hermetically sealing said packaging means with a member having optically transparent access means and coefficient of thermal expansion matching that of said packaging means; focusing radiation from a laser on a preselected portion of said thin-film resistor in said hermetically sealed microelectronic circuit device to adjust the resistance value thereof by transmitting said radiation through said optically transparent access means to said thin-film resistor; and covering said optically transparent means with an opaque material after said resistance value is finally adjusted.
Claim 17
Dependent Claim
115 words
A process of adjusting resistor values in a microelectronic circuit device comprising: fabricating a semiconductor microelectronic circuit device having a thin-film resistor deposited thereon; mounting said device in an open generally flat packaging means; hermetically sealing said packaging means with a member having optically transparent access means and coefficient of thermal expansion matching that of said packaging means; focusing radiation from a laser on a preselected portion of said thin-film resistor in said hermetically sealed microelectronic circuit device to adjust the resistance value thereof by transmitting said radiation through said optically transparent access means to said thin-film resistor; and covering said optically transparent means with an opaque material after said resistance value is finally adjusted.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-10-29 | 1977-04-30 | 1977-10-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-10-29 | 1981-04-30 | 1981-10-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-10-29 | 1985-04-30 | 1985-10-30 | $7700.00 | Window Closed / Lapsed |