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US3736157A Expired / Lapsed US ⏱️ 0.0 years remaining

Electroless copper tin plating solution and process

Assignee: Henkel Corp
•
Filing: 1972-01-17
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Granted: 1973-05-29
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Expires: 1992-01-17
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Abstract

Abstract AN AQUEOUS ACIDIC COMPOSITION USEFUL FOR FORMING A COPPER TIN COATING ON A FERROUS METAL SURFACE WITHOUT THE APPLICATION OF ELECTRIC CURRENT, WHICH COMPRISES COPPER IONS IN THE RANGE O FROM ABOUT 0.01 TO 30% BY WEIGHT CALCULATED AS CUSO4.5H2O, TIN IONS WITHIN THE RANGE OF ABOUT 0.01 TO 30% BY WEIGHT CALCULATED AS SNSO4 AND A LONG CHAIN ALIPHATIC AMINE IN THE RANGE OF ABOUT 0.01 TO 10% BY WEIGHT.

Inventors

  • 👤 K Hacias

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-22 23:35
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/48

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-05-28 1976-11-27 1977-05-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-05-28 1980-11-27 1981-05-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-05-28 1984-11-27 1985-05-29 $7700.00 Window Closed / Lapsed

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