US3736157A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electroless copper tin plating solution and process
Assignee: Henkel Corp
•
Filing: 1972-01-17
•
Granted: 1973-05-29
•
Expires: 1992-01-17
Abstract
Abstract AN AQUEOUS ACIDIC COMPOSITION USEFUL FOR FORMING A COPPER TIN COATING ON A FERROUS METAL SURFACE WITHOUT THE APPLICATION OF ELECTRIC CURRENT, WHICH COMPRISES COPPER IONS IN THE RANGE O FROM ABOUT 0.01 TO 30% BY WEIGHT CALCULATED AS CUSO4.5H2O, TIN IONS WITHIN THE RANGE OF ABOUT 0.01 TO 30% BY WEIGHT CALCULATED AS SNSO4 AND A LONG CHAIN ALIPHATIC AMINE IN THE RANGE OF ABOUT 0.01 TO 10% BY WEIGHT.
Inventors
- 👤 K Hacias
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-22 20:21
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/48
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-05-28 | 1976-11-27 | 1977-05-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-05-28 | 1980-11-27 | 1981-05-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-05-28 | 1984-11-27 | 1985-05-29 | $7700.00 | Window Closed / Lapsed |