Patent US2822476A successfully refreshed from Google Patents.
US3698618A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Face bonding machine
Assignee: Motorola Solutions Inc
•
Filing: 1971-11-29
•
Granted: 1972-10-17
•
Expires: 1991-11-29
Abstract
Abstract This disclosure discloses a method of bonding and a face bonding machine adapted to bond an integrated circuit die having a plurality of electrodes thereon to a substrate having a plurality of leads. The machine has a receptacle which mechanically registers the die in its bonding position on top of the substrate leads.
Inventors
- 👤 Robert W Helda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 06:35
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; B; B23; B23K; B23K20/00; B23K20/02; B23K20/023; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
330 words
A machine for simultaneously bonding together multiple individual lead portions in a group of such lead portions predetermined in number in a metallic member and the multiple electrodes on one face of a semiconductor unit wherein the electrodes correspond in number to the lead portions in a group in said metallic member, with said metallic member being provided in an elongated strip form defined by two longitudinal edges and with a plurality of such groups of lead portions being spaced apart from one another longitudinally over the elongated strip form and with the lead portions in each group converging toward the center area of the group, said machine having a supporting surface for supporting a metallic member in a flat position thereon and having means for successively indexing the bonding position of a group of lead portions as the metallic member is fed through the machine, with said single group of lead portioNs at such bonding position on the supporting surface adapted to be bonded to the electrodes of a semiconductor unit, positioning means in the machine for orienting a semiconductor unit and positioning the electrodes of the semiconductor unit in contact with the corresponding lead portions in the group in the metallic member positioned to be bonded, a bonding support for contacting all lead portions in a group on the side of each opposite to the side against which the electrodes are in contact, and bonding means in the machine located at the face of the semiconductor unit opposite to the face having the electrodes thereon to be operated to simultaneously bond together all lead portions and corresponding electrodes on the semiconductor unit, with said machine adapted to successively and repetitively bond the electrodes of a semiconductor unit to corresponding plurality of lead portions in each of the plurality of groups in the elongated strip form metallic member as such member is moved through the machine and semiconductor units are oriented and positioned in the machine to be bonded.
Claim 2
Dependent Claim
330 words
A machine for simultaneously bonding together multiple individual lead portions in a group of such lead portions predetermined in number in a metallic member and the multiple electrodes on one face of a semiconductor unit wherein the electrodes correspond in number to the lead portions in a group in said metallic member, with said metallic member being provided in an elongated strip form defined by two longitudinal edges and with a plurality of such groups of lead portions being spaced apart from one another longitudinally over the elongated strip form and with the lead portions in each group converging toward the center area of the group, said machine having a supporting surface for supporting a metallic member in a flat position thereon and having means for successively indexing the bonding position of a group of lead portions as the metallic member is fed through the machine, with said single group of lead portioNs at such bonding position on the supporting surface adapted to be bonded to the electrodes of a semiconductor unit, positioning means in the machine for orienting a semiconductor unit and positioning the electrodes of the semiconductor unit in contact with the corresponding lead portions in the group in the metallic member positioned to be bonded, a bonding support for contacting all lead portions in a group on the side of each opposite to the side against which the electrodes are in contact, and bonding means in the machine located at the face of the semiconductor unit opposite to the face having the electrodes thereon to be operated to simultaneously bond together all lead portions and corresponding electrodes on the semiconductor unit, with said machine adapted to successively and repetitively bond the electrodes of a semiconductor unit to corresponding plurality of lead portions in each of the plurality of groups in the elongated strip form metallic member as such member is moved through the machine and semiconductor units are oriented and positioned in the machine to be bonded.
Claim 3
Dependent Claim
246 words
A machine for processing therein an elongated metallic member in strip form having a body portion and a plurality of groups of lead portions integral with the body portion and spaced apart over the length of such body portion and a plurality of semiconductor units adapted to be individually bonded to the lead portions of said metallic member, with each group of lead portions extending toward a central area in the group and each such semiconductor unit having a plurality of electrodes on one face thereof, with said electrodes of a semiconductor unit adapted to be simultaneously bonded to corresponding lead portions in a group adjacent the central area in the group, whereby successive individual semiconductor units can be bonded to successive groups of lead portions in the metallic member, said machine having a supporting surface thereon for the movement thereover and support of a metallic member, and having indexing means for positioning a metallic member in a position to have a semiconductor unit bonded thereto, receptacle means in the machine for receiving a semiconductor unit and positioning the same so as to have the electrodes thereon oriented relative to respective lead portions in a group on the metallic member and in contact with the end portions of the respective lead portions, and means in the machine for maintaining a semiconductor unit in contact with the lead portions at the electrodes and simultaneously bonding the electrodes of a unit and lead portions in a group together.
Claim 4
Dependent Claim
246 words
A machine for processing therein an elongated metallic member in strip form having a body portion and a plurality of groups of lead portions integral with the body portion and spaced apart over the length of such body portion and a plurality of semiconductor units adapted to be individually bonded to the lead portions of said metallic member, with each group of lead portions extending toward a central area in the group and each such semiconductor unit having a plurality of electrodes on one face thereof, with said electrodes of a semiconductor unit adapted to be simultaneously bonded to corresponding lead portions in a group adjacent the central area in the group, whereby successive individual semiconductor units can be bonded to successive groups of lead portions in the metallic member, said machine having a supporting surface thereon for the movement thereover and support of a metallic member, and having indexing means for positioning a metallic member in a position to have a semiconductor unit bonded thereto, receptacle means in the machine for receiving a semiconductor unit and positioning the same so as to have the electrodes thereon oriented relative to respective lead portions in a group on the metallic member and in contact with the end portions of the respective lead portions, and means in the machine for maintaining a semiconductor unit in contact with the lead portions at the electrodes and simultaneously bonding the electrodes of a unit and lead portions in a group together.
Claim 5
Dependent Claim
48 words
In a machine as defined in claim 1, wherein said bonding means includes bonding structure for directly engaging the face of a semiconductor unit opposite to the face upon which the electrodes are formed and operating on that face to secure an electrode and a lead portion together.
Claim 6
Dependent Claim
56 words
In a machine as defined in claim 1, means for engaging the lead portions of a group on a metallic member on the side of each lead portion opposite to the side engaging an electrode of a semiconductor unit, and adapted to maintain the lead portions in fixed position during the operation of said bonding structure.
Claim 7
Dependent Claim
72 words
In a machine as defined in claim 1, wherein said positioning means includes a receptacle portion with sidewalls forming the receptacle in said portion and acting to orient a semiconductor unit when placed therein, said receptacle portion being movable relative to the lead portions of a group to position the semiconductor unit at said lead portions with the electrodes in position at the ends of said lead portions adjacent the central area.
Claim 8
Dependent Claim
323 words
A machine for bonding together in single successive bonding operations a plurality of lead portions in a single group of lead portions with an elongated lead frame member and a corresponding plurality of electrodes on one face of each of a plurality of individual semiconductor units, with the lead portions in each group extending from an outside frame portioN toward an open central area in the group and with the elongated frame member being defined by two longitudinal edges spaced apart generally by the width of a group of lead portions plus the outside frame portion having indexing holes therein, said machine having supporting surface means for the movement thereover and support thereon of the elongated lead frame member, having means utilizing the indexing holes for positioning and maintaining such elongated lead frame member on the supporting surface means with a group of lead portions in bonding position, having means for positioning a semiconductor unit so as to have the electrodes thereon oriented relative to the respective lead portions in a single group on the elongated frame member and in contact with the end portions of such respective lead portions, and having bonding means and anvil means for maintaining the electrodes of a semiconductor unit in contact with the lead portions at the electrodes for the bonding together in a single bonding operation such electrodes of a unit and such lead portions in a group, with one of said two latter means being movable in a direction at right angles to the material to be bonded to provide said two latter means relative to one another in bonding position, and with said machine adapted to successively release said elongated lead frame member after a bonding operation and successively reposition and maintain said member in position for another single bonding operation of the plurality of electrodes in a semiconductor unit and a plurality of lead portions in a single group with said frame member.
Claim 9
Dependent Claim
323 words
A machine for bonding together in single successive bonding operations a plurality of lead portions in a single group of lead portions with an elongated lead frame member and a corresponding plurality of electrodes on one face of each of a plurality of individual semiconductor units, with the lead portions in each group extending from an outside frame portioN toward an open central area in the group and with the elongated frame member being defined by two longitudinal edges spaced apart generally by the width of a group of lead portions plus the outside frame portion having indexing holes therein, said machine having supporting surface means for the movement thereover and support thereon of the elongated lead frame member, having means utilizing the indexing holes for positioning and maintaining such elongated lead frame member on the supporting surface means with a group of lead portions in bonding position, having means for positioning a semiconductor unit so as to have the electrodes thereon oriented relative to the respective lead portions in a single group on the elongated frame member and in contact with the end portions of such respective lead portions, and having bonding means and anvil means for maintaining the electrodes of a semiconductor unit in contact with the lead portions at the electrodes for the bonding together in a single bonding operation such electrodes of a unit and such lead portions in a group, with one of said two latter means being movable in a direction at right angles to the material to be bonded to provide said two latter means relative to one another in bonding position, and with said machine adapted to successively release said elongated lead frame member after a bonding operation and successively reposition and maintain said member in position for another single bonding operation of the plurality of electrodes in a semiconductor unit and a plurality of lead portions in a single group with said frame member.
Claim 10
Dependent Claim
56 words
In a machine as defined in claim 3, means for engaging the lead portions of a group on a metallic member on the side of each lead portion opposite to the side engaging an electrode of a semiconductor unit, and adapted to maintain the lead portions in fixed position during the operation of said bonding structure.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-10-17 | 1976-04-17 | 1976-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-10-17 | 1980-04-17 | 1980-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-10-17 | 1984-04-17 | 1984-10-17 | $7700.00 | Window Closed / Lapsed |