US3662312A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor strain transducers
Assignee: Ferranti International PLC
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Filing: 1969-03-24
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Granted: 1972-05-09
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Expires: 1989-03-24
Abstract
Abstract A strain transducer having a plurality of piezo-resistive sensing elements formed adjacent to one major face of a semiconductor wafer is wholly assembled by employing techniques compatible with the structure of the semiconductor wafer, these techniques including bonding the wafer to a rigid metal supporting ring which in turn is bonded to an annular insulating member secured to the transducer housing.
Inventors
- 👤 William Thorp
- 👤 Charles Trevor Jones
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-22 19:38
CPC Classifications
G; G01; G01L; G01L19/00; G01L19/14; G01L19/148; G01L19/0061; G01L19/0084; G01L19/147; G01L9/00; G01L9/0041; G01L9/0051; G01L9/0052; G01L9/0054
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
153 words
A strain transducer including a semiconductor wafer having a plurality of piezo-resistive strain sensing elements formed adjacent to one major wafer face and defined by P-N junctions, a metal ring alloyed to circumferential parts of the semiconductor wafer, an annular member of insulating material having a plane surface at least partially metallized and cooperating with the metal ring to which it is bonded, a housing for the wafer secured to the insulating annular member and enclosing the major wafer face adjacent to the sensing elements with the opposite major wafer face arranged to be exposed to the medium the pressure of which is required to be measured, leads extending externally of the housing, wires extending between contacts to the sensing elements and said leads extending externally of the housing and intermediate means supported by said annular member within said housing for electrically connecting each wire to an associated lead through the intermediate means.
Claim 2
Dependent Claim
153 words
A strain transducer including a semiconductor wafer having a plurality of piezo-resistive strain sensing elements formed adjacent to one major wafer face and defined by P-N junctions, a metal ring alloyed to circumferential parts of the semiconductor wafer, an annular member of insulating material having a plane surface at least partially metallized and cooperating with the metal ring to which it is bonded, a housing for the wafer secured to the insulating annular member and enclosing the major wafer face adjacent to the sensing elements with the opposite major wafer face arranged to be exposed to the medium the pressure of which is required to be measured, leads extending externally of the housing, wires extending between contacts to the sensing elements and said leads extending externally of the housing and intermediate means supported by said annular member within said housing for electrically connecting each wire to an associated lead through the intermediate means.
Claim 3
Dependent Claim
43 words
A transducer as claimed in claim 1 in which the wires extending from the contacts of the sensing elements are bonded to electrically discrete metallized pads provided on the insulating annular member, and the intermediate means are arranged to contact the metallized pads.
Claim 4
Dependent Claim
34 words
A transducer as claimed in claim 1 in which the intermediate means are resiliently deformable and each is mounted in compression between the insulating annular member and a lead extending externally of the housing.
Claim 5
Dependent Claim
15 words
A transducer as claimed in claim 3 in which the intermediate means are leaf springs.
Claim 6
Dependent Claim
32 words
A transducer as claimed in claim 1 in which the intermediate means are masses of deformable conductive material bonded between the insulating annular member and the leads extending externally of the housing.
Claim 7
Dependent Claim
26 words
A transducer as claimed in claim 1 in which a thin-film trimming resistor is provided on a surface of the insulating annular member within the housing.
Claim 8
Dependent Claim
28 words
A transducer as claimed in claim 1 in which the leads extending externally of the housing comprise the conductivE parts of a connection member incorporated in the housing.
Claim 9
Dependent Claim
31 words
A transducer as set forth in claim 1 further including an electrically insulating layer on said opposite major face for electrically isolating the sensing elements in the wafer from the medium.
Claim 10
Dependent Claim
17 words
A transducer as set forth in claim 8 further including a metallic coating on the insulating layer.
Claim 11
Dependent Claim
54 words
A transducer as set forth in claim 8 wherein said housing is metallic, and further including a metallic coating on said insulating layer, said coating being in electrical contact with said housing, and a connection member capping said housing at one end, said connection member including said leads which extend externally of the housing.
Claim 12
Dependent Claim
133 words
A strain transducer including a semiconductor wafer having a plurality of piezo-resistive strain sensing elements formed adjacent to one major wafer face and defined by P-N junctions, a metal ring alloyed to circumferential parts of the semiconductor wafer, an annular member of insulating material having a plane surface at least partially metallized and cooperating with the metal ring to which it is bonded, a housing for the wafer secured to the insulating annular member and enclosing the major wafer face adjacent to the sensing elements with the opposite major wafer face arranged to be exposed to the medium the pressure of which is required to be measured leads extending through the housing, means for electrically connecting contacts to the sensing elements and said leads, said means including a resilient connection within the housing.
Claim 13
Dependent Claim
133 words
A strain transducer including a semiconductor wafer having a plurality of piezo-resistive strain sensing elements formed adjacent to one major wafer face and defined by P-N junctions, a metal ring alloyed to circumferential parts of the semiconductor wafer, an annular member of insulating material having a plane surface at least partially metallized and cooperating with the metal ring to which it is bonded, a housing for the wafer secured to the insulating annular member and enclosing the major wafer face adjacent to the sensing elements with the opposite major wafer face arranged to be exposed to the medium the pressure of which is required to be measured leads extending through the housing, means for electrically connecting contacts to the sensing elements and said leads, said means including a resilient connection within the housing.
Claim 14
Dependent Claim
50 words
A transducer as claimed in claim 11 in which the electrical connecting means further includes wires extending from the contacts to the sensing elements to discrete metallized pads provided on the insulating annular member and resilient spring elements within the housing arranged to contact the metallized pads and the leads.
Claim 15
Dependent Claim
34 words
A transducer as claimed in claim 12 in which the spring elements are resiliently deformable and each is mounted in compression between the insulating annular member and a lead extending externally of the housing.
Claim 16
Dependent Claim
40 words
A transducer as claimed in claim 11 in which the resilient connection includes masses of deformable conductive material bonded between the insulating annular member and the leads extending externally of the housing, said insulating annular member being resilient in character.
Claim 17
Dependent Claim
70 words
A strain transducer as set forth in claim 11 wherein the outer periphery of said annular member is secured to the housing so as to support the metal ring and wafer such as to provide a space between the inner wall of the housing and the radial outer periphery of the metal ring and the wafer and insulative means within said space for electrically insulating said wafer from the housing.
References Cited (Backward Citations)
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GB1094862A
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US3290928A
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US3493912A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-05-09 | 1975-11-08 | 1976-05-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-05-09 | 1979-11-08 | 1980-05-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-05-09 | 1983-11-08 | 1984-05-09 | $7700.00 | Window Closed / Lapsed |