Abstract Mixture for providing a hydrogel layer on a hard denture consisting of a soluble glycol methacrylate or glycol acrylate polymer, a glycol methacrylate or glycol acrylate monomer consisting of 98 to 99.95 percent of the monoester and 0.05 to 2 percent of the diester, a polymerization initiator and a watersoluble solvent capable of dissolving in anhydrous condition the soluble glycol methacrylate or glycol acrylate polymer as well as the polymer of the hard denture. The solvent is used in an amount which causes an approximately equal swelling as water in equilibrium with the resulting hydrogel, from which it is entirely removed by washing the denture in water. The method is also suitable for rebasing old dentures.
Method as set forth in claim 1, wherein the surface of said hard polymeric acrylic base to be provided with the hydrogel layer is previously wetted with a mixture of the above said monomer with the monomer from which the hard polymer of the hard polymeric acrylic base has been prepared.
Claim 2
Dependent Claim
14 words
Method as set forth in claim 1, wherein said solvent is ethylene glycol monoacetate.
Claim 3
Dependent Claim
13 words
Method as set forth in claim 1, wherein said solvent is glycerol diacetate.
Claim 4
Dependent Claim
46 words
Method as set forth in claim 1, wherein said coating composition is prepared by stirring together before use two components, one consisting of the said noncross linked polymer in dry, powdered condition and a peroxidic initiator, the other consisting of the said liquid monomer and solvent.
Claim 5
Dependent Claim
71 words
Method as set forth in claim 1, wherein said coating composition is prepared by stirring together just before use two components, one consisting of the said noncross linked soluble polymer in dry, powdered condition and a peroxidic initiator, the other consisting of the said liquid monomer, said solvent and reducing agent forming together with the said peroxidic initiator an effective redox system, causing a rapid polymerization at temperatures under 40* C.