Method of making connecting parts of semiconductor devices or the like
Abstract
Abstract A SEMICONDUCTOR DEVICE HAVING OHMIC CONTACTS APPLIED TO A SEMICONDUCTOR WAFER THROUGH WINDOWS IN A GLASS OR OTHER INSULATING LAYER ON A SURFACE OF THE WAFER IS PROVIDED WITH METAL BUMPS OR PROTUBERANCES FOR CONNECTING THE CONTACTS WITH CORRESPONDING CONDUCTORS OF A HEADER OR PRINTED CIRCUIT BY COVERING THE ENTIRE WAFER SURFACE WITH A LAYER OF TIN OR OTHER METAL HAVING NO AFINITY FOR THE INSULATING LAYER AND STRONG AFFINITY FOR THE CONTACTS, SELECTIVELY DEPOSITING ON REGIONS OF THE TIN LAYER WHICH CORRESPOND TO AT LEAST PORTIONS OF THE CONTACTS METAL, SUCH AS LEAD OR AN ALLOY THEREOF, FOR FORMING THE DESIRED PROTUBERANCES OR BUMPS AND FOR WHICH THE TIN LAYER HAS A STRONG AFFINITY, AND THEN HEATING THE RESULTING STRUCTURE SO THAT THE TIN LAYER IS AGGREGATED ON THE OHMIC CONTACTS AS A RESULT OF ITS SURFACE TENSION AND CAUSES A CORRESPONDING AGGREGATION OF THE BUMP OR PROTUBERANCE FORMING METAL.
Inventors
- 👤 Yoshiyuki Kaneda
- 👤 Sakan Iwashita
- 👤 Shinichi Hishikawa
Bibliographic Details
Claims Analysis
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