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US3436259A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for plating and polishing a silicon planar surface

Assignee: International Business Machines Corp
•
Filing: 1966-05-12
•
Granted: 1969-04-01
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Expires: 1986-05-12
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Abstract

No abstract record available.

Inventors

  • 👤 Joseph Regh
  • 👤 Gene A Silvey
  • 👤 James R Gardiner

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 18:33
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/04; B24B37/07; B24B37/10; B24B37/102; B24B37/042; H; H10; H10P; H10P14/00; H10P14/40; H10P14/46; H10P52/00; H10P52/40; H10P52/402; H10P14/20; H10P14/29; H10P14/2901; H10P14/2902; H10P14/2905; H10P14/34; H10P14/3402; H10P14/3404; H10P14/3411; H10P14/36

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 111 words
A METHOD FOR POLISHING A SILICON PLANAR SURFACE TO A HIGH DEGREE OF SURFACE PERFECTION SUITABLE FOR EPITAXIAL DEPOSITION COMPRISING: MAINTAINING THE SAID SILICON SURFACE CONTINUOUSLY WETTED WITH AN EXCESS QUANTITY OF A DISPLACEMENT PLATING SOLUTION HAVING A PH LESS THAN 7 CONTAINING A CUPRIC CATION AND FLUORIDE ANION TO CAUSE A DISPLACEMENT PLATING OF THE CATION ONTO THE SAID SILICON SURFACE IN THE FORM OF THE METAL; AND CONTINUOUSLY WIPING THE SAID SILICON SURFACE WITH A FIRM SURFACE USING A SUBSTANTIAL PRESSURE WHILE MAINTAINING A RELATIVE MOVEMENT BETWEEN THE SAID SILICON SURFACE AND SAID FIRM SURFACE TO REMOVE THE PLATED SAID METAL FROM THE HIGH POINTS OF SAID SILICON SURFACE.
Claim 2
Independent Claim 111 words
A METHOD FOR POLISHING A SILICON PLANAR SURFACE TO A HIGH DEGREE OF SURFACE PERFECTION SUITABLE FOR EPITAXIAL DEPOSITION COMPRISING: MAINTAINING THE SAID SILICON SURFACE CONTINUOUSLY WETTED WITH AN EXCESS QUANTITY OF A DISPLACEMENT PLATING SOLUTION HAVING A PH LESS THAN 7 CONTAINING A CUPRIC CATION AND FLUORIDE ANION TO CAUSE A DISPLACEMENT PLATING OF THE CATION ONTO THE SAID SILICON SURFACE IN THE FORM OF THE METAL; AND CONTINUOUSLY WIPING THE SAID SILICON SURFACE WITH A FIRM SURFACE USING A SUBSTANTIAL PRESSURE WHILE MAINTAINING A RELATIVE MOVEMENT BETWEEN THE SAID SILICON SURFACE AND SAID FIRM SURFACE TO REMOVE THE PLATED SAID METAL FROM THE HIGH POINTS OF SAID SILICON SURFACE.

References Cited (Backward Citations)

US3224904A Cited
US3342652A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1972-03-31 1972-09-30 1973-04-01 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1976-03-31 1976-09-30 1977-04-01 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1980-03-31 1980-09-30 1981-04-01 $7700.00 Window Closed / Lapsed

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