Modular package for semiconductor devices

Claim 1

IN A MODULAR PACKAGE, A BODY FORMED OF INSULATING MATERIAL, A PLURALITY OF SPACED METALLIC LEADS CARRIED BY THE BODY AND BEING INSULATED FROM EACH OTHER, SAID LEADS HAVING CONTACT AREAS ARRANGED IN A PATTERN LYING IN A COMMON PLANE WITHIN THE CONFINES OF THE BODY, THE PORTIONS OF SAID LEADS IN CONTACT WITH SAID BODY BEING CARRIED BY THE BODY SO THAT SAID LEADS ARE INSULATED FROM EACH OTHER, A SEMICONDUCTOR BODY HAVING AN INTEGRATED CIRCUIT FORMED THEREIN AND HAVING A PLURALITY OF METAL PADS CONNECTED TO THE INTEGRATED CIRCUIT AND CARRIED BY THE SEMICONDUCTOR BODY, AND SAID CONTACT PADS BEING DISPOSED EXCLUSIVELY ADJACENT THE OUTER MARGIN OF THE SEMICONDUCTOR BODY AND LYING IN A COMMON PLANE, AND A PLURALITY OF CONNECTING ELEMENTS LYING GENERALLY IN A SINGLE PLANE FORMED OF A THIN METALLIC FILM SUPPORTED BY THE BODY IN DIRECT AND INTIMATE CONTACT WITH SAID CONTACT AREAS, SAID SEMICONDUCTOR BODY BEING DISPOSED SO THAT SAID CONTACT PADS ARE IN DIRECT AND INTIMATE ELECTRICAL CONTACT WITH SAID CONNECTING ELEMENTS, SAID CONNECTING ELEMENTS EXTENDING EXCLUSIVELY IN DIRECTIONS AWAY FROM SAID SEMICONDUCTOR BODY, SAID CONNECTING ELEMENTS OF THIN FILM FORMING THE SOLE MEANS MAKING ELECTRICAL CONTACT BETWEEN THE LEADS AND SAID CONTACT PADS CONNECTED TO SAID PORTIONS OF SAID ELECTRICAL CIRCUIT WHEREBY ELECTRICAL CONTACT CAN BE MADE TO THE INTEGRATED CIRCUIT THROUGH THE LEADS.