Method of electroplating on a dielectric base

Claim 1

A PROCESS OF MAKING AN ADDITIVE PRINTED CIRCUIT BOARD HAVING FORMATIONS ON BOTH SIDES THEREOF AND CONNECTIONS THEREBETTWEEN THROUGH HOLES, THE PROCESS COMPRISING: IMMERSING A DIELECTRIC BASE BOARD HAVING HOLES THEREIN AT DESIRED LOCATIONS IN A LIQUID SUSPENSION OF AT LEAST SEMI-COLLODIAL PALLADIUM TO DEPOSIT A THIN ELECTRICALLY NON-CONDUCTIVE COATING OF THE AT LEAST SEMI-COLLOIDAL PALLADIUM ON THE ENTIRE SURFACE OF THE BOARE INCLUDING THE HOLES, ELECTROPLATING A FLASH COATING OF A CONDUCTIVE METAL DIRECTLY OVER THE THIN ELECTRICALLY NON-CONDUCTIVE COATING OF THE COLLIDAL METAL OF THE ENTIRE SURFACE INCLUDING THE HOLES, THE ELECTROPLASTING BEING STARTED AT A POINT ON SAID BASE WHICH IS IN CONTACT WITH THE ELECTROLYTIC BATH FROM WHICH SAID FLASH COATING OF CONDUCTIVE METAL IS PLATED, OUTLINING THE DESIRED CIRCUIT PATTERN ON THE OPPOSITE FACES OF THE BOARD WITH A RESIST, BUILDING UP THE CIRRCUIT PATTERN BY ADDITIONAL ELECTROPLATING ON THE AREAS NOT COVERED BY THE RESIST AND REMOVING THE RESIST TOGETHER WITH THE FLASH COATING AND SAID THIN ELECTRICALLY NON-CONDUCTIVE COATING THEREUNDER TO THEREBY DEFINE A PRINTED CIRCUIT CONDUCTIVE PPATTERN ON BOTH FACES OF THE DIELECTIRC BOARD CONDUCTIVELY CONNECTED THROUGH THE DESIRED HOLES.