Patent US3079254A successfully refreshed from Google Patents.
US3079254A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Photographic fabrication of semiconductor devices
Assignee: GEORGE W CROWLEY
•
Filing: 1959-01-26
•
Granted: 1963-02-26
•
Expires: 1979-01-26
Abstract
No abstract record available.
Inventors
- 👤 William E Rowe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 18:10
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10D; H10D99/00; H10P; H10P50/00; H10P50/60; H10P50/64; H10P50/642; H10P50/644; H10P95/00; H10W20/00; H10W20/40
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
353 words
IN THE MANUFACTURE OF A SEMICONDUCTOR DEVICE INCLUDING A BODY OF SEMICONDUCTOR MATERIAL HAVING A FIRST METALLIC LAYER BONDED TO ONE SURFACE THEREOF, THE STEPS INCLUDING APPLYING A FIRST COATING OF PHOTOSENSITIVE RESIST MATERIAL OVER SAID FIRST METALLIC LAYER, MASKING A PRESCRIBED REGION OF SAID FIRST COATING IN THE NEGATIVE OF A FIRST CONTACT AND LEAD ASSEMBLY INCLUDING AN AREA CONTACT AND AN ELONGATED LEAD INTEGRAL THEREWITH, EXPOSING SAID FIRST COATING TO A LIGHT SOURCE TO HARDEN THE UNMASKED REGIONS OF SAID FIRST COATING CORRESPONDING TO SAID FIRST CONTACT AND LEAD ASSEMBLY, REMOVING SAID FIRST COATING TO EXPOSE SAID FIRST METALLIC LAYER IN THE REGIONS CORRESPONDING TO THE NEGATIVE OF SAID FIRST CONTACT AND LEAD ASSEMBLY, ETCHING AWAY THE EXPOSED REGIONS OF SAID FIRST METALLIC LAYER WITH A FIRST ETCHANT CAPABLE OF ATTACKING SAID FIRST METALLIC LAYER TO LEAVE SAID FIRST CONTACT AND LEAD ASSEMBLY BONDED TO A PORTION OF SAID ONE SURFACE OF SAID BODY, BONDING A SECOND METALLIC LAYER TO AN ADJACENT PORTION OF SAID ONE SURFACE, APPLYING A SECOND COATING OF PHOTOSENSITIVE RESIST MATERIAL OVER SAID SECOND METALLIC LAYER, MASKING A PRESCRIBED REGION OF SAID SECOND COATING IN THE NEGATIVE OF A SECOND CONTACT AND LEAD ASSEMBLY INCLUDING AN AREA CONTACT AND AN ELONGATED LEAD INTEGRAL THEREWITH, EXPOSING SAID SECOND COATING TO A LIGHT SOURCE TO HARDEN THE UNMASKEED REGION OF SAID SECOND COATING CORRESPONDING TO SAID SECOND CONTACT AND LEAD ASSEMBLY, REMOVING SAID SECOND COATING TO EXPOSE SAID SECOND METALLIC LAYER IN THE REGIONS CORRESPONDING TO THE NEGATIVE OF SAID SECOND CONTACT AND LEAD ASSEMBLY, ETCHING AWAY THE EXPOSED REGIONS OF SAID SECOND METALLIC LAYER WITH A SECOND ETCHANT CAPABLE OF ATTACKING SAID SECOND METALLIC LAYER TO LEAVE SAID SECOND CONTACT AND LEAD ASSEMBLY BONDED TO SAID BODY, AND ETCHING SAID ONE SURFACE OF SAID BODY WITH A FURTHER ETCHANT CAPABLE OF SELECTIVELY ATTACKING SAID SEMICONDUCTIVE MATERIAL FOR A PERIOD SUFFICIENT TO COMPLETELY UNDERCUT AND FREE SAID FIRST AND SECOND ELONGATED LEADS FROM SAID BODY BUT INSUFFICIENT TO APPRECIABLY UNDERCUT SAID FIRST AND SECOND AREA CONTACTS SUCH THAT SAID FIRST AND SECOND AREA CONTACTS REMAIN BONDED TO SAID BODY.
Claim 2
Dependent Claim
353 words
IN THE MANUFACTURE OF A SEMICONDUCTOR DEVICE INCLUDING A BODY OF SEMICONDUCTOR MATERIAL HAVING A FIRST METALLIC LAYER BONDED TO ONE SURFACE THEREOF, THE STEPS INCLUDING APPLYING A FIRST COATING OF PHOTOSENSITIVE RESIST MATERIAL OVER SAID FIRST METALLIC LAYER, MASKING A PRESCRIBED REGION OF SAID FIRST COATING IN THE NEGATIVE OF A FIRST CONTACT AND LEAD ASSEMBLY INCLUDING AN AREA CONTACT AND AN ELONGATED LEAD INTEGRAL THEREWITH, EXPOSING SAID FIRST COATING TO A LIGHT SOURCE TO HARDEN THE UNMASKED REGIONS OF SAID FIRST COATING CORRESPONDING TO SAID FIRST CONTACT AND LEAD ASSEMBLY, REMOVING SAID FIRST COATING TO EXPOSE SAID FIRST METALLIC LAYER IN THE REGIONS CORRESPONDING TO THE NEGATIVE OF SAID FIRST CONTACT AND LEAD ASSEMBLY, ETCHING AWAY THE EXPOSED REGIONS OF SAID FIRST METALLIC LAYER WITH A FIRST ETCHANT CAPABLE OF ATTACKING SAID FIRST METALLIC LAYER TO LEAVE SAID FIRST CONTACT AND LEAD ASSEMBLY BONDED TO A PORTION OF SAID ONE SURFACE OF SAID BODY, BONDING A SECOND METALLIC LAYER TO AN ADJACENT PORTION OF SAID ONE SURFACE, APPLYING A SECOND COATING OF PHOTOSENSITIVE RESIST MATERIAL OVER SAID SECOND METALLIC LAYER, MASKING A PRESCRIBED REGION OF SAID SECOND COATING IN THE NEGATIVE OF A SECOND CONTACT AND LEAD ASSEMBLY INCLUDING AN AREA CONTACT AND AN ELONGATED LEAD INTEGRAL THEREWITH, EXPOSING SAID SECOND COATING TO A LIGHT SOURCE TO HARDEN THE UNMASKEED REGION OF SAID SECOND COATING CORRESPONDING TO SAID SECOND CONTACT AND LEAD ASSEMBLY, REMOVING SAID SECOND COATING TO EXPOSE SAID SECOND METALLIC LAYER IN THE REGIONS CORRESPONDING TO THE NEGATIVE OF SAID SECOND CONTACT AND LEAD ASSEMBLY, ETCHING AWAY THE EXPOSED REGIONS OF SAID SECOND METALLIC LAYER WITH A SECOND ETCHANT CAPABLE OF ATTACKING SAID SECOND METALLIC LAYER TO LEAVE SAID SECOND CONTACT AND LEAD ASSEMBLY BONDED TO SAID BODY, AND ETCHING SAID ONE SURFACE OF SAID BODY WITH A FURTHER ETCHANT CAPABLE OF SELECTIVELY ATTACKING SAID SEMICONDUCTIVE MATERIAL FOR A PERIOD SUFFICIENT TO COMPLETELY UNDERCUT AND FREE SAID FIRST AND SECOND ELONGATED LEADS FROM SAID BODY BUT INSUFFICIENT TO APPRECIABLY UNDERCUT SAID FIRST AND SECOND AREA CONTACTS SUCH THAT SAID FIRST AND SECOND AREA CONTACTS REMAIN BONDED TO SAID BODY.
References Cited (Backward Citations)
US2587568A
Cited
US2780569A
Cited
US2911706A
Cited
US2829460A
Cited
US2849298A
Cited
US2910634A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1966-02-25 | 1966-08-27 | 1967-02-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1970-02-25 | 1970-08-27 | 1971-02-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1974-02-25 | 1974-08-27 | 1975-02-26 | $7700.00 | Window Closed / Lapsed |