Method of manufacturing molded module assemblies

Claim 1

THE PROCESS FOR MANUFACTURING A MOLDED MODULE SECTION COMPRISING THE STEPS OF PROVIDING FIRST AND SECOND MATING DIE PORTIONS WHERE SAID FIRST DIE PORTION INCLUDES ONE OR MORE PROTRUDING PORTIONS WHICH MATE WITH ONE OR MORE HOLES FORMED IN SAID SECOND DIE PORTION WHEN SAID FIRST AND SECOND DIE PORTION ARE BROUGHT TOGETHER AND WHERE SAID SECOND DIE PORTION INCLUDES AN EMBOSSED SURFACE HAVING A RAISED PATTERN WHICH CORRESPONDS TO THE PRINTED CIRCUIT PATTERN TO BE FORMED ON THE SURFACE OF THE MOLDED MODULE SECTION, PLACING A CONDUCTIVE FOIL BETWEEN SAID FIRST AND SECOND DIE PORTIONS, CLOSING THE DIE SO THAT SAID PROTRUDING PORTIONS OF SAID FIRST DIE PORTION MATE WITH SAID HOLES OF SAID SECOND DIE PORTION TO PIERCE SAID FOIL, INTRODUCING AN INSULATING MOLDING COMPOUND INTO SAID DIE AT A RELATIVELY HIGH PRESSURE SO THAT SAID CONDUCTIVE FOIL IS MADE TO SUBSTANTIALLY CONFORM TO THE EMBOSSED SURFACE OF SAID SECOND DIE PORTION AND CAVITIES ARE PRODUCED WITHIN THE SOLIDIFYING MODULE SECTION BY SAID PROTRUDING PORTIONS, SEPARATING SAID FIRST AND SECOND DIE PORTIONS, WITHDRAWING THE MOLDED MODULE SECTION FROM THE MOLD, AND REMOVING THE RAISED PORTIONS OF THE SURFACE OF SAID MODULE SECTION FORMED BY THE EMBOSSED SURFACE OF SAID SECOND DIE PORTION.