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US3076253A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Materials for and methods of manufacturing semiconductor devices
Assignee: Texas Instruments Inc
•
Filing: 1955-03-10
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Granted: 1963-02-05
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Expires: 1975-03-10
Abstract
No abstract record available.
Inventors
- 👤 Cornelison Boyd
- 👤 Morton E Jones
- 👤 James T Lineback
- 👤 Jr Elmer A Wolff
- 👤 Jr Samuel W Barcus
- 👤 Frank A Horak
- 👤 Norman S Ince
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 10:51
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/0198; B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/30; B23K35/3013; H10P; H10P95/00; H10W70/00; H10W70/40; H10W70/481; H10W72/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
105 words
A METHOD OF MASS MANUFACTURING SEMICONDUCTOR DEVICES COMPRISING THE STEPS OF POSITIONING A PAIR OF ETCHRESISTANT LEADS IN SPACED PARALLEL RELATIONSHIP, SPACING A PLURALITY OF ETCH-RESISTANT ALLOY SOLDER TABS ALONG EACH OF SAID LEADS, POSITIONING A PLURALITY OF SEMICONDUCTOR BODIES IN CONNECTING RELATION BETWEEN SAID PAIR OF LEADS WHEREBY SAID ALLOY TABS ARE INTERPOSED BETWEEN SAID SEMICONDUCTOR BODIES AND SAID LEADS, LAYING A DOT OF MATERIAL ON EACH OF SAID PLURALITY OF SEMICONDUCTOR BODIES, CONNECTING SAID DOTS BY ANOTHER ETCH-RESISTANT LEAD, FUSING THE COMPONENTS INTO A SINGLE ASSEMBLY, AND THEREAFTER SEPARATING SAID ASSEMBLY INTO A PLURALITY OF SEMICONDUCTOR DEVICES WHICH CAN BE ETCHED WITHOUT MASKING.
Claim 2
Independent Claim
105 words
A METHOD OF MASS MANUFACTURING SEMICONDUCTOR DEVICES COMPRISING THE STEPS OF POSITIONING A PAIR OF ETCHRESISTANT LEADS IN SPACED PARALLEL RELATIONSHIP, SPACING A PLURALITY OF ETCH-RESISTANT ALLOY SOLDER TABS ALONG EACH OF SAID LEADS, POSITIONING A PLURALITY OF SEMICONDUCTOR BODIES IN CONNECTING RELATION BETWEEN SAID PAIR OF LEADS WHEREBY SAID ALLOY TABS ARE INTERPOSED BETWEEN SAID SEMICONDUCTOR BODIES AND SAID LEADS, LAYING A DOT OF MATERIAL ON EACH OF SAID PLURALITY OF SEMICONDUCTOR BODIES, CONNECTING SAID DOTS BY ANOTHER ETCH-RESISTANT LEAD, FUSING THE COMPONENTS INTO A SINGLE ASSEMBLY, AND THEREAFTER SEPARATING SAID ASSEMBLY INTO A PLURALITY OF SEMICONDUCTOR DEVICES WHICH CAN BE ETCHED WITHOUT MASKING.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1966-02-04 | 1966-08-06 | 1967-02-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1970-02-04 | 1970-08-06 | 1971-02-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1974-02-04 | 1974-08-06 | 1975-02-05 | $7700.00 | Window Closed / Lapsed |