Solid-phase bonding of metals

Claim 1

THE METHOD OF INTERFACIALLY SOLID-PHASE BONDING MALLEABLE METAL COMPONENTS WHICH HAVE ELIMINATED FROM THEIR FACES TO BE INTERFACIALLY BONDED GROSS CONTAMINANTS AND FILM WHICH WOULD ACT AS A BARRIER TO BONDING, SAID COMPONENTS BEING FREE OF ANY SIDE EDGE WELDING ADAPTED TO HOLD THEM TOGETHER AS AN ASSEMBLED UNIT, COMPRISING SUBJECTING SAID COMPONENTS TO A TEMPERATURE WHICH IS IN A RANGE WHICH IS LOWER THAN THE HOT-SHORT TEMPERATURE OF THE METAL HAVING THE LEAST HOT-SHORT TEMPERATURES OR LOWER THAN THE TEMPERATURE AT WHICH INTERFACIAL LIQUID PHASE MATERIAL OR A BRITTLE INTERMETALLIC COMPOUND WOULD FORM IN APPRECIABLE AMOUNT, WHICHEVER TEMPERATURE IS THE LOWER, SQUEEZING THE COMPONENTS TOGETHER SUBSTANTIALLY IN SAID TEMPERATURE RANGE WITH CONCOMITANT INCREASE IN THE INTERFACIAL AREA AT A REDUCTION ADAPTED TO EFFECT A FIRST FORMATION OF A MULTITUDE OF DISCRETE BONDS WITH A FIRST INTEGRATED STRENGTH OF SAID DISCRETE BONDS WHICH IS ONLY A MINOR FRACTIONAL PART OF THE FINAL BOND STRENGTH, APPLYING A FORCE TO THE PARTIALLY BONDED COMPONENTS IN A DIRECTION ADAPTED TO OFFSET ANY TRANSVERSE SEPARATING FORCES THEREBETWEEN INCURRED AS THE COMPONENTS EMERGE FROM SAID SQUEEZING OPERATION, HOLDING THE COMPONENTS TOGETHER UNDER SAID FORCE, THEN WHILE SUBJECT TO SAID HOLDING FORCE AGAIN AT LEAST ONCE SQUEEZING SAID COMPONENTS TOGETHER IN SAID TEMPERATURE RANGE AND AT A REDUCTION ADAPTED TO PRODUCE ADDITIONAL BOND FORMATION WHICH WITH THE FIRST BOND FORMATION HAS A SUBSEQUENT INTEGRATED BOND STRENGTH LARGER THAN SAID MINOR FRACTIONAL PART OF FINAL BOND STRENGTH BUT STILL A FRACTIONAL PART OF SAID FINAL BOND STRENGTH, AND SUBSEQUENTLY HEATING THE COMPONENTS AS HELD TOGETHER WITH SAID LARGER BOND STRENGTH, SAID LAST-NAMED HEATING BEING AT A TEMPERATURE LYING WITHIN THE RANGE WHICH EXTENDS FROM APPROXIMATELY THE RECRYSTALLIZATION TEMPERATURE OF THE METAL COMPONENT HAVING THE LOWEST RECRYSTALLIZATION TEMPERATURE TO A POINT BELOW ONE OF THOSE TEMPERATURES, WHICHEVER IS THE LOWER, AT WHICH LIQUID PHASE MATERIAL WOULD FORM, OR AT WHICH A BRITTLE INTERMETALLIC COMPOUND WOULD FORM IN APPRECIABLE AMOUNT, SAID HEATING BEING CONTINUED FOR SUCH A LENGTH OF TIME AS TO EFFECT GROWTH OF THE BONDS THEREBY TO INCREASE THE OVER-ALL BOND STRENGTH.

Claim 2

THE METHOD OF INTERFACIALLY SOLID-PHASE BONDING MALLEABLE METAL COMPONENTS WHICH HAVE ELIMINATED FROM THEIR FACES TO BE INTERFACIALLY BONDED GROSS CONTAMINANTS AND FILM WHICH WOULD ACT AS A BARRIER TO BONDING, SAID COMPONENTS BEING FREE OF ANY SIDE EDGE WELDING ADAPTED TO HOLD THEM TOGETHER AS AN ASSEMBLED UNIT, COMPRISING SUBJECTING SAID COMPONENTS TO A TEMPERATURE WHICH IS IN A RANGE WHICH IS LOWER THAN THE HOT-SHORT TEMPERATURE OF THE METAL HAVING THE LEAST HOT-SHORT TEMPERATURES OR LOWER THAN THE TEMPERATURE AT WHICH INTERFACIAL LIQUID PHASE MATERIAL OR A BRITTLE INTERMETALLIC COMPOUND WOULD FORM IN APPRECIABLE AMOUNT, WHICHEVER TEMPERATURE IS THE LOWER, SQUEEZING THE COMPONENTS TOGETHER SUBSTANTIALLY IN SAID TEMPERATURE RANGE WITH CONCOMITANT INCREASE IN THE INTERFACIAL AREA AT A REDUCTION ADAPTED TO EFFECT A FIRST FORMATION OF A MULTITUDE OF DISCRETE BONDS WITH A FIRST INTEGRATED STRENGTH OF SAID DISCRETE BONDS WHICH IS ONLY A MINOR FRACTIONAL PART OF THE FINAL BOND STRENGTH, APPLYING A FORCE TO THE PARTIALLY BONDED COMPONENTS IN A DIRECTION ADAPTED TO OFFSET ANY TRANSVERSE SEPARATING FORCES THEREBETWEEN INCURRED AS THE COMPONENTS EMERGE FROM SAID SQUEEZING OPERATION, HOLDING THE COMPONENTS TOGETHER UNDER SAID FORCE, THEN WHILE SUBJECT TO SAID HOLDING FORCE AGAIN AT LEAST ONCE SQUEEZING SAID COMPONENTS TOGETHER IN SAID TEMPERATURE RANGE AND AT A REDUCTION ADAPTED TO PRODUCE ADDITIONAL BOND FORMATION WHICH WITH THE FIRST BOND FORMATION HAS A SUBSEQUENT INTEGRATED BOND STRENGTH LARGER THAN SAID MINOR FRACTIONAL PART OF FINAL BOND STRENGTH BUT STILL A FRACTIONAL PART OF SAID FINAL BOND STRENGTH, AND SUBSEQUENTLY HEATING THE COMPONENTS AS HELD TOGETHER WITH SAID LARGER BOND STRENGTH, SAID LAST-NAMED HEATING BEING AT A TEMPERATURE LYING WITHIN THE RANGE WHICH EXTENDS FROM APPROXIMATELY THE RECRYSTALLIZATION TEMPERATURE OF THE METAL COMPONENT HAVING THE LOWEST RECRYSTALLIZATION TEMPERATURE TO A POINT BELOW ONE OF THOSE TEMPERATURES, WHICHEVER IS THE LOWER, AT WHICH LIQUID PHASE MATERIAL WOULD FORM, OR AT WHICH A BRITTLE INTERMETALLIC COMPOUND WOULD FORM IN APPRECIABLE AMOUNT, SAID HEATING BEING CONTINUED FOR SUCH A LENGTH OF TIME AS TO EFFECT GROWTH OF THE BONDS THEREBY TO INCREASE THE OVER-ALL BOND STRENGTH.